3D-Micromac AG - TRUMPF Laser

Laserbearbeitung von dünnen Schichten auf 

Rolle-zu-Rolle-Anlagen 

Dr. Frank Allenstein 

3D-Micromac AG 

© 3D-Micromac AG 2012

3D-Micromac – At a Glance 

141 employees in R&D, manufacturing and service 

Worldwide more than 300 industrial installations 

Since 1994 experience in laser technology 

Numerous worldwide patents 

Sales partner for Micromachining products 

Japan 

China 

Hikali KK 

Süss Microtech (Shanghai) Ltd. 

Micro Power Semiconductor Ltd. 

Sanwa Technologies Ltd. 

Korea Raytec Korea Ltd 

Taiwan Ascent Technologies Ltd. 

Superbin Ltd. 

USA 

3D-Micromac America Corp. 

Sales partner ophthalmic, worldwide Laser 2000 GmbH 

Sales partner microSINTERING technology EOS GmbH 


3D-Micromac – microFLEX Center 

Move in: May 2012 

Construction time: 

7 months 

Office and production area: 2000 m 2 

Total invested amount: 3.0 million € 


microFLEX – Evolution 

2003: start of 

R2R process 

development 

and web 

handling 

2006: first 

machine 

prototype 

2010: microFLEX 

V1.0 with basic 

modularity 

2011: microFLEX Rollto-Roll 

system for the 

industrial production 

of RFID antennas 


V2.0 with a 

complex modular 

setup 


R&D line at 3DMM 


microFLEX at 3DMM 


Laser Processing – Fixed Optics 


Laser Processing – Scanner 


Applications 

Laser Thin-Film Ablation – Organic Photovoltaics 

Laser Thin-Film Ablation – OLEDs 

Summary 




Organic Photovoltaics 

Ag 

P3HT : PCBM 

PEDOT : PSS 

ITO 

Substrate 

light 

Organic Solar Cell 

conventional stack layout 


Experimental Setup 

laser source 

beam path 

2D 

scanner 

f-theta lens 

2D-scanner performance parameters 

Repeatability < 22µrad 

Tracking error: 0.18 ms 

Long term drift < 0.6 mrad 

vacuum exhaust 


Experimental Setup – Laser Sources 

Laser 

Wavelength 

in nm 

Pulse duration 

Repetition 

rate in kHz 

Average power 

in W 

Machining speed 

in mm/s 

ns – laser 1064 ~ 30 ns 500 100 1000 

ps – laser 1064/532/355 < 12 ps 500 50 1000 

fs - laser 1024/512 < 500 fs 200 10 400 


ITO on Glass 


ns – Laser | Wavelength λ = 1064 nm 

ITO layer on glass substrate: 

Cracks in substrate 

ITO layer melted 

ITO layer on PET foil substrate: 

PET foil massively damaged 

Huge ITO bulges at the cutting edges 

microscope image 



ps – Laser | Wavelength λ = 1064 nm 

Glass substrate 

DEKTAK image 

ITO 

substrate 

ITO 

bulge within range of RA 

ITO 

nm 

60 

0 

-60 

No heat affected zone 

No melting of ITO 

No cracks in substrate 

Good edge quality 

Large process window 


-120 

substrate 




DEKTAK image 

ITO 

substrate 

ITO 

bulge within range of RA 

ITO 

nm 

0 

-60 

Almost no heat affected zone 



Good edge quality, comparable 

to 1064 nm 


-120 

substrate 




DEKTAK image 

ITO 

substrate 

ITO 


bulge between 10…30 nm 

ITO 

nm 

0 

-60 

Small heat affected zone 




-120 

substrate 



fs – Laser | Wavelength λ = 1024 nm 


No bulge 

Result comparable to ps 


SEM microscope 


ITO on PET Film 



PET film substrate (thickness ~50 µm) 

DEKTAK image 


nm 

No heat affected zone 

ITO 

bulge less than 20 nm! 

40 


substrate 

ITO 

ITO 

0 

Small debris in proximity to the 

scribed area 

-40 

Large process window 


Slight delamination of ITO at the 

substrate 

-80 

REM microscope 

cutting edge 




DEKTAK image 

ITO 

bulge 50…60 nm 

nm 

40 

Small heat affected zone 

Average edge quality 

heat affected zone 

substrate 

ITO 

ITO 

0 

-40 

Some debris in and around 

machining area 

microscope microscope image image 

-80 

substrate 




Heat affected zone 

ITO 

substrate 

Damaged substrate due to high 

absorption 

Low edge quality due to chipping of 

ITO 



fs – Laser | Wavelength λ = 1024 nm 

PET-foil substrate (thickness ~50 µm) 

Minimal damage to PET film 

Smooth cutting edge 

No delamination of ITO layer 


SEM microscope 


Conclusions to Scribing of ITO 

Indium tin oxide 

λ = 1064 nm excellent scribing quality on both glass and film 

λ = 532 nm 

λ = 355 nm 

good scribes on glass but shows higher bulging on film 

good scribes on glass but damages foil due to high absorption 

λ = 1064 nm is to be preferred 

Best scribing quality on both glass and film 

High output powers available 

Relatively inexpensive laser source available 

ps laser for scribing on glass substrates 

fs laser for scribing on polymer substrates 


Applications 



Summary 




OLED Layout and Scribing 

P1 Scribe: 

Isolation cut in back electrode 

P2 Scribe: 

Selective ablation of organic stack 

P3 Scribe: 

Isolation cut in front contact 


Experimental Setup 

laser source 

beam path 

2D 

scanner 

f-theta lens 

2D-scanner performance parameters 

Repeatability < 22µrad 

Tracking error: 0.18 ms 

Long term drift < 0.6 mrad 

vacuum exhaust 


Experimental Setup – Laser Source 

Ultra-short pulse picosecond laser 

Pulse repetition rate up to 1 MHz 

Pulse duration < 12 ps 

Average power up to 50 W (@1064 nm) 

Wavelengths 1064/532/355 nm 


P1 Scribe: ps – Laser | Wavelength λ = 1064 nm 

Ablation of back contact metal layer 

not possible without ablation of 

passivation layer 

optical microscopy 



surface profile 

Markspeed 4.000 mm/s 

Bulge < 20 nm 

Selective ablation of metal back 

contact 

Almost no debris generated 





ITO 

Bulge < 50 nm 

Selective ablation of metal back 

substrate 

electrode 

Smooth cutting edge 






No bulge observed 


Back electrode not fully uncovered 






Bulge < 10 nm 


Back electrode fully uncovered 






Bulge < 10 nm 

Back electrode fully uncovered 

Organic stack step wise ablated at 


cutting edge 





Bulge < 20 nm 


Stepwise ablation of multiple layers 


OLED stack not fully ablated 





Bulge < 30 nm 


OLED stack fully ablated 






Delamination of brittle metal layer 


Generation of large bulge (~100 nm) 




Conclusions to Laser Scribing of OLEDs with ps-Laser 

P1 Scribe: 

ps-Laser with green wavelength is recommended 

Maximum achievable machining speed approximately 8.000 mm/s. 

P2 Scribe: 

ps-Laser with green wavelength is recommended 


P3 Scribe: 

ps-Laser with IR or green wavelength is recommended 



Applications 



Summary 


Summary 

This looks quite simple, doesn‘t it? 

Several things can be learned: 

1. There is a difference between the ablation from foil and glass 

2. The necessary power (fluence) is usually smaller on foil than on glass 

And it is getting even more complicated 


Experiment 1 

Three different stacks with identical top layer 

Experiment with single pulses with a 1064 

nm ps-laser 

Layer to be ablated: always 120 nm thick 

Fluence 


Experiment 2 

Equal stack with different top layer thicknesses 

In comparison the layer thickness has only few impact on the other side 

120nm 

240nm 

Fluence 


Vielen Dank für Ihre 

Aufmerksamkeit! 

3D-Micromac AG 

Technologie-Campus 8 

09126 Chemnitz 

Telefon: +49 371 / 400 43 - 0 

Fax: +49 371 / 400 43 - 40 

Email: info@3d-micromac.com 

Internet: http://www.3d-micromac.com

3D-Micromac AG - TRUMPF Laser

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