HP iPAQ hx4700 Series Pocket PC End-of-Life Disassembly ...

HP-00007-01, Appendix 3 13-Oct-2004
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
HP iPAQ hx4700 Series Pocket PC Handheld Device
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10
square cm
Batteries All types including standard
alkaline and lithium coin or button
style batteries
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
0Components, parts and materials
containing radioactive substances
Declaration limited to case
plastics only.
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
1
2
0
0
0
0
0
0
0
0
0
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HP-00007-01, Appendix 3 13-Oct-2004
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
1 2 3 4
Item Tool Description Tool Size (if applicable)
1 Philip Screw Driver 000X40
2 Torex Screw Driver T6X40
3 Special Made Plastic Stick
4 Tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
Step Description Time Required
(Second)
1 Remove the stylus, SD card, Mini-SD card, SIM card, battery cover and
battery.
35
2 Remove the 5 screws. 35
3 Separate housing and bezel, remove the vibrator. 30
4 Disconnect all the FPCs and cables from the connectors of M/B. 80
5 Remove the 3 screws on M/B. 25
6 Remove the screws on speaker carrier and remove the carrier 30
7 I. Remove the M/B from the bezel. Remove the button cell
battery for selective treatment.
55
II. Remove the 4 screws with Philip screwdriver.
III. Remove keypad carrier.
8. Remove the Keypad BD from the bezel. 15
9. Remove the backup battery cover to take out the backup battery. 15
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
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HP-00007-01, Appendix 3 13-Oct-2004
Battery Switch
1
WLAN Cap
3
1
2
Battery Lock
4
2
1.Unlock battery lock.
2.Press battery switch and pull down to release
battery.
1. Remove the screws follow the sequence
shown with screwdriver (T6).
Torque: 1.2±0.2kgf-cm
2. Remove the WLAN Cap from housing with
plastic stick.
Please follow the sequence as left shown when
removing the screws.
Use the plastic stick to separate the housing.
Insert and gently twist into the gap between upper
and lower case with the FLAT side of the tool.
Please start from left then right side.
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HP-00007-01, Appendix 3 13-Oct-2004
LCD FPC
Touch Pad FPC Button Cell Battery
Rubbers
Left Side
1. Remove the screw (72H00338-00 ) with Philip
screwdriver.
Torque: 0.8±0.2kgf-cm
2. Take out the tape and WLAN cable from
WLAN board with tweezers gentlely.
3. Remove the WLAN board from the connector
of M/B with plastic stick.
4. Remove the WLAN cable from the connector
of Main BD with tweezers.
1. Remove the LCD FPC and Touch Pad FPC
from the connectors of Main BD with tweezers
gently.
2. Remove the two screws (72H00401-00) with
Philip screwdriver.
Torque: 0.8±0.2kgf-cm
3. Remove the M/B from the Bezel. Please
watch out the audio jack under the process.
4. Remove the button cell battery for selective
treatment.
1. Remove the LCM by release the hooks;
please start from the left side then right side.
It is not allowed to pull the
LCM FPC under the process.
2. Remove the rubbers (76H00639-00) on left
side hooks of the bezel.
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HP-00007-01, Appendix 3 13-Oct-2004
Disassemble the touch pad from the bezel.
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