The Ever Expanding Need for Planarization - NCCAVS - User Groups
The Ever Expanding Need for Planarization - NCCAVS - User Groups
The Ever Expanding Need for Planarization - NCCAVS - User Groups
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HKMG Multi‐Step CMP Applications<br />
ILD3<br />
ILD2<br />
1. Poly Opening Polish<br />
ILD3<br />
ILD2<br />
ILD 1.2.3 Deposition<br />
ILD1<br />
ILD1<br />
2. Al Bulk / Al Buff CMP<br />
3. W Bulk / /W‐Al Buff CMP<br />
Al<br />
W<br />
Al<br />
Al<br />
©2010 Cabot Microelectronics<br />
Corporation CONFIDENTIAL<br />
Source: Feeney et al, Taiwan CMPUG 2010
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