Telit General Presentation - M2M Platforms
Telit General Presentation - M2M Platforms
Telit General Presentation - M2M Platforms
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Why BGA?<br />
No IF/RF connectors:<br />
reduction of total<br />
solution cost up to 5<br />
Euro<br />
Compatible with the<br />
standard reflow<br />
process<br />
Available in special packaging<br />
to enable automatic processing<br />
in SMT production lines<br />
Author: <strong>Telit</strong> wireless solutions February 2007<br />
High interconnection density<br />
translates into<br />
reduction in application size<br />
Optimization of production<br />
process with the use of all SMT<br />
components: More reliable and<br />
stable production process<br />
Eliminates manual<br />
handling from the<br />
assembly process<br />
Improved heat dissipation<br />
and excellent long term<br />
connection between<br />
Application and Module<br />
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