Sonix Auto-Wafer

AUTO Wafer System
Features:
• Automatically inspects bonded wafers in
cassettes holding 25 wafers.
• Robotics which remove the wafers from the input
cassette, align, place in test area, and sort "approved"
and "failed" wafers.
• Optional bar code reader allows for quick input of
cassette serial numbers and operator I.D.
• Production mode software is very easy to use, can be as
simple as operator loading and removing the wafer
cassettes and entering serial numbers.
• Different levels of user interface.
• Accommodates 100, 125, 150 and 200 mm wafers.
• Scan times of less than 5 minutes for 100 mm wafers at
100 micron resolution.
• Displays the "Total Percent Defects" for present cassette
or entire lot, also number of defects per bin.
• Wafers are positioned in a vacuum chuck to maintain
orientation and levelness.
• Automatic aligning feature.
• Automatic drying feature.
• Ultra high frequency and resolution - Clearly detects
defects as small as 5 microns, 1 micron step capability.
The Auto Wafer System is an ultra-high resolution Scanning Acoustic Microscope (SAM) designed
to inspect bonded silicon or GaAs wafers for internal discontinuities. Designed for the production
environment, the system provides unmatched resolution and speed to satisfy all your process control
and production needs.
Wafer bonding methods and techniques have become an increasingly important issue in the
manufacturing of ICs, opto-eletronic devices and micro-mechanical devices. There are several
critical areas where investigation is required to establish adequate wafer reliability. Specifically, voids,
delaminations and other contaminants like excess flux can be detrimental to electrical and long term
die and device functionality. SAM technology allows for reliability concerns to be screened prior to
wafer dicing, thereby reducing scrap, reducing costs and ultimately improving reliability.
The Auto Wafer System differs significantly from other production SAM systems on the market
today. While maintaining Sonix’ digital data acquisition advantage, the Auto Wafer offers a
state-of-the-art linear servo motor, delivering unparalleled scan resolution. The robot /aligner
combination provides fast and precise placement of each wafer to within a few tenths of a degree.
Equally important is the user friendly production software with advanced wafer analysis and SPC
feedback. The automatic defect detection and defect sizing software allows the operator to
automatically determine which individual die meet a specific accept/reject criteria and aids in the
“root cause” defect determination.

Auto Wafer Specs
Scan Axis
• Positioning Device:
• Servo Max Velocity:
• Servo Repeatability:
• Linear Encoder Resolution:
• Max Travel:
Linear servo motor
1000 mm/sec
+/- 0.5 micron
0.5 micron
315 mm
Step Axis
• Positioning Device:
• Step Axis Resolution:
• Max Travel:
Low-EMI
microstep motor
with zero-backlash
lead screw
0.25 micron
327 mm
Close-up of handling and inspection area
showing robot, input/output cassettes,
aligner and inspection area
Focus Axis
• Positioning Device:
• Focus Axis Resolution:
• Max Travel:
Low-EMI
microstep motor
with zero-backlash
lead screw
0.5 micron
7 mm
Ultrasonic Instruments
• DPR-500S Receiver with H1 remote
pulser pre-amp (RPPA)
• UHF kit including U1 RPPA with expanded
bandwidth receiver and UHF transducer
Enclosure
• Footprint:
1525 mm x 915 mm
• Includes base cabinet for computer and
instrumentation, with casters and leveling feet
• Approved emergency off and safety interlock
• Recommended floor space: 1600 mm x 990 mm
Easy to use production software, showing
accepted/rejected wafers and percent
defects for each wafer in the cassette.
8700 Morrissette Drive • Springfield, VA 22152
tel: 703-440-0222 • fax: 703-440-512
e-mail: info@sonix.com • www.sonix.com