contact angle meter surftens 300 wh - OEG
contact angle meter surftens 300 wh - OEG
contact angle meter surftens 300 wh - OEG
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CONTACT ANGLE METER SURFTENS <strong>300</strong> WH<br />
SURFTENS <strong>300</strong> WH<br />
Contact <strong>angle</strong> measuring instrument with 3 axis wafer<br />
handling robot for 200 and <strong>300</strong> mm technology<br />
SURFACE MEASURING TECHNOLOGY<br />
Technical data subject to change without notice, Date: 10.8.2004
CONTACT ANGLE METER SURFTENS <strong>300</strong> WH<br />
GENERAL SOFTWARE<br />
- implementation of user levels in software<br />
- connection to SPC via network interface card<br />
- operating system Windows 2000<br />
- automatic loadport recognition<br />
- automatic recognition of slot occupancy<br />
- automatic measurement recipes assigned to certain load port (recipe mix up between different wafer<br />
sizes is avoided)<br />
- slot integrity is warranted<br />
- notching before measurement<br />
- Measurement data will be stored on local disc – any backup storage on network server will be organized<br />
by customer<br />
- LAN compatible<br />
- Client software for result evaluation on office PC is included<br />
- Manual operation mode (via joystick)<br />
MEASUREMENT GENERAL<br />
- Dispense System<br />
- Syringe or other dispense system for one media (DI-water)<br />
- Tank with 10 ml media stock<br />
- Programmable droplet size<br />
- Automatic placement of the droplet on the wafer, movement for droplet placement is programmable<br />
- Easy disassembly/cleaning of the dispense system<br />
- System capable for measurements with second liquid<br />
MEASUREMENT<br />
- Tool/Software supports free definable measurement maps<br />
- The <strong>wh</strong>ole wafer surface for 12“ must be in reach for the dispense system (excluding edge area)<br />
- Complete automatic measurement (FOUP -> droplet placement -> measurement -> droplet removal -><br />
FOUP)<br />
- <strong>contact</strong> <strong>angle</strong>s between 85° and 95° will be excluded from measurement range of the tool<br />
GENERAL HARDWARE<br />
- Wafer handling capability for 12“ wafer<br />
- System guarantees slot integrity<br />
- Manual focus system <strong>OEG</strong> provides detailed instruction for focus adjustment<br />
- <strong>OEG</strong> provides concept for maintenance, spare parts, complete users guide<br />
- <strong>OEG</strong> provides instruction for change of syringe<br />
- Wafer chuck only defined by measurement characteristics<br />
- Air pressure, vacuum, exhaust is provided by customer<br />
- Customer provides <strong>300</strong>mm wafers plus FOUPs for development system setup<br />
- After measurement liquid will be evaporated by hotplate<br />
- Work place contains keyboard and mouse<br />
Technical data subject to change without notice, Date: 10.8.2004
CONTACT ANGLE METER SURFTENS <strong>300</strong> WH<br />
TOOL CONFIGURATION<br />
Configuration - unit description:<br />
No Item Description<br />
3-axis wafer handling robot<br />
FOUP opening system <strong>300</strong>mm<br />
1 Wafer handling system Loadport 200mm<br />
Laser scanner<br />
Vacuum endeffector<br />
3-axis-step motor<br />
stepping motor driven wafer table<br />
automatic dispense system<br />
automatic droplet positioning (teachable)<br />
2 SURFTENS automatic illumination system<br />
CCD camera<br />
Frame grabber<br />
Software package<br />
3 Hotplate<br />
4 PC<br />
ACCEPTANCE CRITERIA<br />
for liquid removal<br />
PC, Flatscreen, keyboard, mouse<br />
- All relevant documents have to be present<br />
- Software will be accepted according to specifications<br />
- Handlingtest with “empty“ recipe: 50 wafers have to be handled without interruption<br />
- For check of measurement accuracy <strong>contact</strong> <strong>angle</strong> standard (provided by <strong>OEG</strong>) will be used<br />
- Measured values have to be within +/- 0,2° compared to standard<br />
- 25 wafer have to be handled and measured automatically without interruption using recipe set up<br />
according customer requirements<br />
- For acceptance Customer has to provide sufficient number of primed wafers<br />
Technical Para<strong>meter</strong>s for <strong>contact</strong> <strong>angle</strong> measurement<br />
Contact <strong>angle</strong> measuring device SURFTENS <strong>300</strong> WH for the fully automatic measurement of the wetting<br />
behavior of solids (e.g. wafers or glass substrates for flat panel displays) under clean-room conditions, as<br />
well as for series tests and systematic analysis. The SURFTENS automatic enables the reduction of<br />
subjective factors and time involved for <strong>contact</strong> <strong>angle</strong> measurements in research, quality- and production<br />
inspection.<br />
For the software-controlled measurement and analysis of:<br />
- the static and dynamic <strong>contact</strong> <strong>angle</strong> according to the Sessile Drop method;<br />
- the wetting behavior on solid surfaces<br />
- the surface free energy of solids and their components<br />
The SURFTENS automatic consists of the basic instrument with the following technical equipment:<br />
- Single needle support with vertical and horizontal positioning;<br />
- Measuring stage, for fully automatic accurate sample positioning;<br />
- telecentric measuring lens;<br />
- Video measuring system with high-resolution CCD-camera;<br />
- High-performance video digitizing board (frame grabber) for the PC;<br />
Technical data subject to change without notice, Date: 10.8.2004
CONTACT ANGLE METER SURFTENS <strong>300</strong> WH<br />
- Illumination with continuously adjustable intensity for a homogeneous back lighting;<br />
- Control and measuring electronics for the teach-in procedure, graphic display with keyboard and video<br />
display<br />
- Power supply by PC<br />
- The 32-bit software SURFTENS developed for Windows NT/98/XP®;<br />
- Control of the sample position in X-, Y-direction, the needle position in Z-direction,<br />
- Static and dynamic <strong>contact</strong> <strong>angle</strong> measurement according to the Sessile drop method<br />
- Calculation of the surface and interfacial tension from the sessile drops<br />
- Calculation of the surface free energy of solids and their components according to the theorie of Wu,<br />
- Statistics and measurement error analysis<br />
- 3 axis wafer handling robot<br />
- Loadport for <strong>300</strong>mm wafer<br />
- scanner for slot occupacy<br />
- housing<br />
Technical data for conatct <strong>angle</strong> measurement<br />
- sample size: <strong>300</strong> mm Si-Wafer<br />
- Position accuracy ± 0.05 mm in the sample level;<br />
- Range of <strong>contact</strong> <strong>angle</strong> measurement 0 … 180° ; ± 0.2° measuring accuracy of the video system<br />
(excluded is the <strong>contact</strong> <strong>angle</strong> range of 85°...95°<br />
- Range of surface and interfacial tension 1·10-2 … 2·103 mN/m; resolution: min. ± 0.05 mN/m<br />
- CCD-camera with a resolution of max. 752 x 582 pixels<br />
- Video system: High-performance image processing system with 132 MBytes/s data transfer rate<br />
(compatible to European standard CCIR and US standard RS-170) , up to 50 images/s digitizing speed<br />
- Measuring methods: Sessile Drop method<br />
- Clean-room classification: 100<br />
<strong>OEG</strong> GmbH<br />
Wildbahn 8b<br />
D-15236 Frankfurt<br />
Germany<br />
Tel.: +49 335 5213894<br />
Fax: +49 335 5213896<br />
www.oeg-instruments.com<br />
info@oeg-instruments.com<br />
Representative<br />
Contact <strong>angle</strong> <strong>meter</strong><br />
Thin film stress measurement<br />
End point detection<br />
Micro diamond scriber<br />
Technical data subject to change without notice, Date: 10.8.2004
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