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Company Overview - TT electronics Showcase - TT electronics plc

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Core Operational Capabilities<br />

• Micro electronic Packaging<br />

Die & Wire bonding<br />

Integrated Circuit die attach<br />

Hermetic and Vacuum package assembly<br />

• Hybrid Thick Film Printing<br />

• Thin film deposition, sputtering process<br />

• Circuit board assembly on various materials: PCB,<br />

Ceramic, Aluminium (Anotherm®Plus Technology), Steel<br />

• Surface mount assembly<br />

• Electronic calibration and test<br />

Laser Trimming: Thick Film and Thin Film<br />

ASIC programming<br />

Automated final condition testing<br />

• Packaging and assembly in clean room environments<br />

• Automotive Quality level Certification (TS16949)<br />

• Aerospace Quality level Certification (AS)<br />

• MIL STD certifications<br />

• ISO 14000 and ISO9000 level certifications<br />

©2012 <strong>TT</strong> <strong>electronics</strong> <strong>plc</strong> 13

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