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Automotive Electronics Semiconductors and sensors Product ...

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clean &<br />

economical<br />

Electric drives control:<br />

Power modules for (H)EV inverters<br />

Compact, high power mold modules for inverter stages in electric vehicles<br />

Application <strong>Product</strong> V CE max<br />

[V]<br />

I c max<br />

[A]<br />

IGBT half bridge for<br />

(H) EV inverters MH6560C 650 600<br />

IGBT half bridge for<br />

(H) EV inverters MH6530C 650 300<br />

U GE sat<br />

[V]<br />

R th (j-c) per IGBT<br />

switch [K/W]<br />

1.40<br />

(@I CE mod=600A,<br />

V GE=15V, ϑ=25°C) 0.076<br />

1.40<br />

(@I CE mod=300A,<br />

V GE=15V, ϑ=25°C) 0.14<br />

Features T j min<br />

[°C]<br />

T j max<br />

[°C]<br />

• 3 rd Gen. IGBT mold module<br />

• Wirebond-less contacting of IGBTs <strong>and</strong> diodes<br />

• Low inductance layout<br />

• T-sense (NTC) for overtemperature detection<br />

• I-sense on chip for short-circuit detection<br />

• Large, isolated pads for excellent thermal contact<br />

• ROHS compliant, halogen-free -40 150<br />

• 3 rd Gen. IGBT mold module<br />

• Wirebond-less contacting of IGBTs <strong>and</strong> diodes<br />

• Low inductance layout<br />

• T-sense (NTC) for overtemperature detection<br />

• I-sense on chip for short-circuit detection<br />

• Large, isolated pads for excellent thermal contact<br />

• ROHS compliant, halogen-free -40 150<br />

Electric drives | 29<br />

Package<br />

Mold module with<br />

customer specific contacts,<br />

63 mm (L) x 57 mm (W) x 6.6 mm (H)<br />

Mold module with<br />

customer specific contacts,<br />

63 mm (L) x 57 mm (W) x 7.5 mm (H)

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