PDF[1229KB/26 pages] - Toyota Industries Corporation

ElectronicsPlastic Package Substrates forHigh-Performance Semiconductors andSubstrates for IC CardsTIBC manufactures leading-edge semiconductor packagesubstrates to enable more compact, lighter weight PCs, mobilephones and other electronic devices. Specifi cally, TIBC currentlymanufactures plastic package substrates, including fl ip chip (FC)package substrates and wire bonding package substrates, for highperformancesemiconductors, as well as fl exible printed circuit (FPC)substrates for IC cards. TIBC is able to supply high-quality, high-performance products by achieving synergies derived from thequality management and production technology capabilities of ToyotaIndustries and Ibiden, an industry leader in this fi eld.TIBC’s semiconductor plastic package substrates are soldthrough Ibiden to the world’s premier semiconductor manufacturersand semiconductor-packaging companies for such applications asPCs and mobile phones. At the same time, TIBC’s FPC substratesare also marketed through Ibiden to SIM card and smart cardsuppliers mainly in Europe and China for integration into credit cardsand telephone cards.TIBCWire bondingpackage substrateFlip chippackage substrateFlexible printed circuitpackage substrateLow-Temperature Polysilicon TFT-LCD Panelsfor Mobile DevicesSTLCD and STMD manufacture small- and medium-sized lowtemperaturepolysilicon (poly-Si) TFT-LCD panels, primarily for suchapplications as video and digital still cameras, and mobile phones.These TFT-LCD panels are noted for such outstanding basic featuresas high-quality, high-resolution images and low energy consumption.In addition, Sony is promoting its system-on-glass technology thatintegrates the display device and its driver circuits onto a single glasssubstrate (panel). This technology enables highly reliable, lightweightand miniaturized display modules, and in turn contributes to bothcompanies’ proactive efforts to develop display devices for compact,lightweight mobile products.Through synergies that fully utilize Sony’s technologicalcapabilities and Toyota Industries’ production technologies, STLCDand STMD have built optimal production systems for creatingglobally competitive products. The products manufactured by thesecompanies are used in the mobile devices of Sony and other hightechdevice manufacturers worldwide.Since commencing mass production in 1999, STLCD hasachieved cumulative production of 200 million panels as of August2006. STMD, our second manufacturing base after STLCD, beganmass production of panels on schedule in April 2006.ST Liquid Crystal Display Corp.STLCDLow-temperature polysilicon TFT-LCDsToyota Industries Corporation Annual Report 200741