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The perfect answer to all your measurement needsThe NEXIV VMR series.With an expanded lineup that includes small to ultra-wide measurement platformsas well as versatility in optical head selection,the NEXIV VMR series provides complete support for all your measurement needs.NEXIV VMR EZ Solution FinderAppropriate Object Size(for FOV measurement athighest magnification)Optical HeadModelVMR-1515 VMR-3020VMR-6555 VMR-10080 VMR-12072 VMR-H3030Optional PartsColor Camera1*–5 µmVMR Maximum MagnificationModule Model Z120XHigh Density & MiniatureMachined PartsMEMSProbe CardsLCD-Array ProcessSuper Zoom & High Accuracy Non-Contact Height MeasurementUltimate PrecisionAdvanced Packaging Technology:Water Level CSP, FlipchipYes (Limited Use)4*–20 µmType 3Semiconductor Packaging/Final Assembly ProcessMedical DevicesDies & MoldsElectronic Devices:SMD/Connector/FerruleMicro Drills/EndmillsFlat Panel Display DevicesOLED/LCD-Cell Process Module ProcessHigher MagnificationPrinted Circuit Boards, Mask PatternLarge Size, Multiple Parts MeasurementMetrology LaboratoryMaster MachineHigh Precision EtchingProductYes8*–40 µm16*–80 µmType 2Type 1Larger Measurement EnvelopeVersatile Measurement TasksLead FrameSolar Cell ModulesMachined, Cast, Stamped, Etched, & Molded PartsHigh Precision Dies & MoldsYesYesModel LUAppropriate Wafer SizeAppropriate Display Panel Size150mm (6 inch) wafers 200mm (8 inch) wafers22 in.37 in. 47 in.*For clear edges such as metallized line patterns on a transparent glass.Optional PartsRotary Indexer RI-3600L(for Type 1 to 3)Yes YesYes No No YesStandard ProvidedSoftwareOnline CAD InterfaceOffline CAD Interface2D Profile AnalysisHard / Software ControlMultiple Language SupportData File ManagementVMR AutoMeasure / VMR CAD ReaderVMR Virtual AutoMeasureVMR ProfilerVMR Control ProgramEnglish / Japanese / Mandarin Chinese / Traditional Chinese / German / French, etc.VMR Data ManagerOptional SoftwareQuick Data ReportingStatistical Process Control3D Surface Analysis3D Surface & Roughness AnalysisGear Evaluation SoftwareImage Archiving SoftwareLead Frame Measuring SoftwareVMR Report Generator / Custom FitSPC-IV ExcelNEXIV Bird's Eye ViewMountainsMap XGear Measurement SoftwareEDF/Stitching ExpressVMR AutoMeasureLF

Versatile Part Measurement PlatformNEXIV VMR-3020Wide Stage Envelopment PlatformNEXIV VMR-6555The standard model of the NEXIV series with 300 x 200 mm stage stroke.It handles a variety of measurement tasks including those for mechanicalparts, molded parts, stamped parts and various other workpieces.High-speed measurements with large 650 x 550 mm stroke stage.Optimal for measurements of PCB patterns and external dimensions of adisplay panel. You can save inspection costs by measuring a number ofsmall parts at one time after placing them together on the stage.Type 1, 2, 3 Models• Variety of illumination choices facilitates accurate detection of edges in molded parts• 3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements• Long working distance (50mm) permits measurement of parts with large height variances• 15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate calibrationat all magnifications allows rapid field of view measurements of multiple parameters• Laser AF enables cross-sectional shape and flatness evaluation as well as 3D profilingApplicationsSemiconductor packages, Substrates, Stamped parts, Connectors, Injection molded partsType 1, 2, 3 Models• 650 x 550 mm stage stroke perfect for PCBs• Automatic measurement of batches of parts by placing multiple pieces together on the stage• Laser AF achieves high-accuracy measurements of bump heights• Laser AF also enables measurements of height variance and warping in workpieces• Search function enables measurements of lands and holes of PCBs• Search function provides accurate measurements even when workpieces are not properly located on the stage• Variety of illumination choices facilitate accurate edge detection even for vague geometries• High-speed stage and image processing provide higher throughputApplicationsSemiconductor packages (multiple pieces), Substrates, Printing masks for substrates, Stamped parts (multiple pieces),Connectors (multiple pieces), Injection molded parts (multiple pieces)HDD Slider HDD Slider Height Gap Profile BGA - Golden Finger Circuit Patterns on FlipchipZ120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece)Multi-Vision AF on Bonding Wire Loop Cross Section CCD IC Patterns - Darkfield MicroscopyIts maximum magnification module achieves measurements of finelymachined workpieces. Perfect for measurements of topical MEMS parts,high-density PCBs and semiconductor packages.• The combination of the maximum magnification module and high-precisionstage enables accurate measurements of large geometry workpieces as wellas minute structures• Laser AF uses small spot size to provide accurate measurements of finercross-sectional shapes and heights• Optional surface analysis software displays 3D shapes of MEMS parts• Full range of Nikon CFI60 LU microscope objectives from 5x to 150x• Supports brightfield, darkfield, DIC, simple polarizing applications• Motorized quintuple universal nosepiece• Easy to use software controls all functions of the systemApplicationsSmall-size LCDs, Organic EL panels, 8” (200mm) wafersZ120X Model (with Maximum Magnification Module)Amazing 120X zoom combined with a big stage enables ultrahighmagnification measurements on big workpieces. Ideal for measuringhigh-density PCBs and their masks.• Amazing 120X zoom• Measurements of 1µm line widths are possible at the maximum magnification• Laser AF perfect for measuring small, complicated geometries• High-speed stage and image processing provide higher throughputLU Model (universal epi-illuminator/motorized nosepiece)• Full range of Nikon CFI60 LU microscope objectives from 5x to 150x• Supports brightfield, darkfield, DIC, simple polarizing applications• Motorized quintuple universal nosepiece• Easy to use software controls all functions of the systemApplicationsFPD panels (up to 22”)ApplicationsApplicationsHigh-density PCBs, Exposure masks for substrates, Packages (2D + height), MEMS partsHigh-density PCBs, Exposure masks for substrate, Semiconductor packages (multiple pieces;2D + height), Photo plotter machines for masks, Probe cards67

Ultrawide Measurement PlatformNEXIV VMR-1008047-inch Display DeviceMeasurement PlatformNEXIV VMR-12072Long 1000 x 800 mm stage stroke performs brilliantly in themeasurement of large-size workpieces.Ultralong 1200 x 720 mm stage stroke allows the measurementof large workpieces such as FPD devices.Type 1, 2, 3 Models• Long stage stroke enables measurements of LCD substrates/modules and large-size PCBs• 3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements• Laser AF also enables measurements of height variance and warping in workpieces• Search function facilitates measurements of lands and holes of PCBs• Variety of illumination choices facilitate accurate edge detection even for vague geometries• High-speed stage and high-speed image processing provide high throughputApplicationsPrinting masks for substrates, Mother substrates for PCBs, Shadow masks, FPD devicesType 1, 2, 3 Models• Ultralong stage stroke enables measurements of large LCD substrates/modules and PCBs• 3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements• Laser AF enables the measurement of height gaps and warping in workpieces• Search function enables measurements of lands and holes of PCBs• Variety of illumination choices facilitate accurate edge detection, even for vague geometries• High-speed stage and high-speed image processing provide high throughputApplicationsLarge FPD panels and related devicesLaser Scan on FPC and its Cross Section Photo Mask Pattern Metallized Patterns of FPCFPD-Cell Process LCD-TFT LCM-ACF under DIC Microscopy Color FilterZ120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece)Z120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece)The model achieves ultrahigh magnification measurements with a long1000 x 800 mm stage stroke. Ideal for measuring minute line widths oflarge-size display panels.• Automatic measurements of batches of small parts• Laser AF achieves high-accuracy measurements of bump heights• Laser AF enables measurements of height variance and warping in workpieces• Search function enables measurements of lands and holes of PCBs• Search function also provides accurate measurements even when workpiecesare not located properly on the stage• Variety of illumination choices facilitate accurate edge detection even for weakedges• High-speed stage and image processing provide higher throughputApplicationsLCD glass substrates (pattern measurements),Organic EL glass substrates (pattern measurements)Large Size Probe Cards• Full range of Nikon CFI60 LU microscope objectives from 5x to 150x• Supports brightfield, darkfield, DIC, simple polarizing applications• Motorized quintuple universal nosepiece• Easy to use software controls all functions of the systemApplicationsLarge FPD panels (up to 37”)The model achieves ultrahigh magnification measurements with anultralong 1200 x 720 mm stage stroke, making it ideal for themeasurement of large workpieces such as FPD devices.• Automatic measurement of batches of small parts• Laser AF achieves highly accurate measurements of bump heights• Laser AF also enables the measurements of height gaps and warping inworkpieces• Search function enables measurements of lands and holes of PCBs• Search function also provides accurate measurements even when workpiecesare not properly located on the stage• High-speed stage and image processing provide higher throughputApplicationsLCD glass substrates (pattern measurements),Organic EL glass substrates (pattern measurements)• Full range of Nikon CFI60 LU microscope objectives from 5x to 150x• Supports brightfield, darkfield, DIC, simple polarizing applications• Motorized quintuple universal nosepiece• Easy to use software controls all functions of the systemApplicationsLarge FPD panels and related devices (up to 47”*) * Including module parts.8 9

Zoom position 1 2 3 4 5Type 1Optical magnificationTotal magnificationField of view (mm)0.5x18x9.33 x 7With variable magnifications up to 120x,these models address applications that demand higher precision and density.Maximum Magnification Module VMR-Z120X1x36x4.67 x 3.52x72x2.33 x 1.754x144x1.165 x 0.8757.5x270x0.622 x 0.467Type 2Optical magnificationTotal magnificationField of view (mm)1x36x4.67 x 3.52x72x2.33 x 1.754x144x1.165 x 0.8758x288x0.582 x 0.43715x540x0.311 x 0.233Type 3Optical magnificationTotal magnificationField of view (mm)2x72x2.33 x 1.754x144x1.165 x 0.8758x288x0.582 x 0.43716x576x0.291 x 0.21830x1080x0.155 x 0.117Total magnifications listed above represent those on the monitor screenwhen a 20” monitor is set to the UXGA (1600 x 1200 pixels) mode.Newly developed maximum magnification module VMR-Z120XThe Optical new magnification module achieves a 1x to 120X magnification range by usingTotal magnificationtwo Field of objectives view (mm) and changing the optical path. An 8-step zoom gives thissystem the capability to do rapid field of view measurements of hundreds ofOptical magnificationTotal magnificationparameters and do critical measurements of line widths down to 1µm.Field of view (mm)Magnification vs field of view (mm)Two objective lenses—wide field and high power (N.A. 0.55)The combination of these two objective lenses enables a broad array ofapplications ranging from wide-field observations at low magnifications toaccurate measurements at high magnifications.High-resolution TTL Laser AF with ultra tiny laser spotThe module comes with a high-resolution TTL Laser AF that incorporateshigh N.A. objectives and achieves ultra tiny laser spots. Itsignificantly improves performance in focusing on and scanning over thin,transparent/semitransparent (e.g. resists) surfaces or irregular reflectionsurfaces. High-speed scanning measurement is possible at a rate of 1000points per second max., enabling ultra-precise Z-axis measurements in avariety of applications.Three illumination typesThe module delivers the best illumination to any workpieces by providingthree types of CNC controllable illuminations—episcopic, diascopic (highmagnification head), and darkfield illuminations. This enables edges to bedetected with high accuracy.High magnifications darkfield illuminationOptical magnificationTotal magnificationField of view (mm)1X36X4.673.52X72X2.331.754X144X1.1650.8757.5X270X0.6220.467Optical magnificationTotal magnificationField of view (mm)16X576X0.291X0.21832X1146X0.146X0.109Total magnifications listed above represent those on the monitor screenwhen a 20” monitor is set to the UXGA (1600 x 1200 pixels) mode.64X2292X0.073X0.055120X4320X0.039X0.029Dichroic mirrorCamera's zoom opticsAF detectionopticsCamera's zoom opticsAF detectionopticsObjective lensDichroic mirrorLow magnificationsLEDWorkpiece50mm32mmWorkpieceObjective lens9.8mmHow TTL Laser AF worksEpiscopic illuminationDarkfield illumination1X2X4X7.5XHigh magnificationsLow magnifications darkfield illuminationMinute steps measured16X 32X 64X 120X (6µm linewidth)12 13

Handy optionsContribute to time and labor savingsthroughout the work processSurface analysis software MountainsMap XIndustry standard ISO/ASME/JIS compliant surface analysis softwareThe MountainsMap X is powerfulsoftware for surface metrologyanalysis. It provides the richfunctionality of 3D visualization,cross-sectional view, 2D and 3Droughness, and other parametersbased on the latest ISO standards.Report and chart generating program: Custom Fit QCSuitable for lot control of inspection data such as maximum value,minimum value, range, standard deviation and process capability index.In addition to 10 standard inspection result sheet forms, it is possible tocustomize original forms.Codevelopment: Aria Co., Ltd.EDF/Stitching ExpressThis optional software makes EDF - Extended Depth of Field - imagesby extracting focused pixel information from multiple captured imagesin Z-axis direction. Also, it generates stitching images from differentFOV images captured with CNC XY stage motion, making a wide FOVobservation possible. Both functions contribute to image documentation.Brightfield optics for precise 2D measurement and confocal optics for fastand accurate evaluation of fine three-dimensional geometriesCONFOCAL NEXIVVMZ-K6555/VMZ-K3040 Type-H/Type-S• 650 mm x 550 mm measurement range (VMZ-K6555)• General purpose model compatible with 300 mm wafer (VMZ-K3040)• Fully compatible with wafer handling system (VMZ-K3040)• Type-H with new high magnification optical head (30x)• Type-S with three magnification types—1.5x, 3x and 7.5xMultiple sensors on compact bench-top bodyCNC Video Measuring SystemiNEXIV VMA-2520• Compact and lightweight• 200 mm Z-axis stroke• Multiple-sensor measurementwith optional touch probe sensor AF3D surface analysis program: NEXIV Bird's-Eye ViewRunning on Origin TM , this program allows data obtained using theScan Measure feature provided with TTL Laser AF to be plotted in a3-dimensional format. Afterthat, 3-dimensional shapeanalysis and 2-dimensionalcross-section shape analysiscan be performed.Note: Origin TM is software developedby OriginLab ® Corporation.Gear evaluation softwareThis software providesevaluations on variousparameters of themeasured workpiece,including pitch deviations,tooth space runout, basetangent length, anddimension overpin, based onindustrial standards.Real-time SPC via DDE (Dynamic Data Exchange)Using a DDE Link function, measured data can be immediately transferredto spreadsheets such as Microsoft Excel ® , SPC-PC IV Excel, and others,making real-time SPC analysispossible.Note: SPC-PC IV Excel is a QualityAmerica Inc. product.Report generating program: VMR Report GeneratorThis software is fully compatible with the NEXIV VMR AutoMeasuresoftware and enables the quick generation of inspection results sheetsin various report forms including user-designed forms. Users can evencustomize the program for their own easier use by making macro scripts.Operating environment: Windows ® XP,Windows ® 7Memory space: 512MB or moreAn example of macro scripts written byusers: In order to input manually thedata measured by other instruments andcompile them into one complete report,the macro automatically makes cellblanks and display them in sky blue anda message prompts manual inputs.Rotary indexer RI-3600LThe RI-3600L can rotate the image of a workpiece and display it witha 0.01° resolution. Because it can be controlled externally, it enablesautomatic measurements while controlling the posture of the workpiece.Minimum readout: 1”Control resolution: 0.01°Max. workpiece diameter: 75mmOperation mode: Auto or ManualPre-set points: Point of origin and 3othersNWT-3000• Automatic 300 mm wafer handling system designed foruse with VMZ-K3040* Please contact Nikon for more details.* To find out more about Confocal NEXIV, please refer to product brochures.Non-contact, fully automatic measurement provides outstanding throughput.Perfect for measuring FOUP and FOSBWafer Carrier Measuring SystemNEXIV VMR-C4540• Four side planes of the carrier are continuously measured by rotating thekinematic plate in 90° increments• SEMI-compliant kinematic plate provides perfect XYZ coordinates• Laser AF provides fast, non-contact measurements of wafer positionsEnables fully automatic measurement of 1 cassette of wafers in combinationwith NEXIV and automatic wafer loaderAutomatic wafer handling system• Fully automatic per-carrier wafer measurement with dedicated software• Simple GUI for easy selection of wafers and chips• Highly reliable loading system with NWL860TDedicated isolation tableThis pneumatic-type isolation table effectivelyabsorbs external vibrations preventing themfrom affecting measurements.20 21

NWL860VMR-3020SpecificationsDimensional diagramsUnit: mmMain UnitModel VMR-H3030/Z120X VMR-1515/Z120X/LU VMR-3020/Z120X/LU VMR-6555/Z120X/LU VMR-10080/Z120X/LU VMR-12072/Z120X/LUStroke (XxYxZ)Optical Head for Type 1, 2, 3 300 x 300x 150 mm 150 x 150 x 150 mm 300 x 200 x 150mm 650 x 550 x 150mm 1000 x 800 x 150mm 1200 x 720 x 150mmLU model (11.8 x 11.8 x 5.9 in.) (5.9 x 5.9 x 5.9 in.) (11.8 x 7.9 x 5.9 in.) (25.6 x 21.7 x 5.9 in.) (39.4 x 31.5 x 5.9 in.) (47.2 x 28.3 x 5.9 in.)With max. magnification module 300 x 300 x 150mm 150 x 150 x 150 mm 300 x 200 x 150mm 650 x 550 x 150mm 1000 x 800 x 150mm 1200 x 720 x 150mm(high mag. lens) (11.8 x 11.8 x 5.9 in.) (5.9 x 5.9 x 5.9 in.) (11.8 x 7.9 x 5.9 in.) (25.6 x 21.7 x 5.9 in.) (39.4 x 31.5 x 5.9 in.) (47.2 x 28.3 x 5.9 in.)With max. magnification module 250 x 300 x 150mm 100 x 150 x 150 m m 250 x 200 x 150mm 600 x 550 x 150mm 950 x 800 x 150mm 1150 x 720 x 150 mm(low mag. lens) (9.8 x 11.8 x 5.9 in.) (3.9 x 5.9 x 5.9 in.) (9.8 x 7.9 x 5.9 in.) (23.6 x 21.7 x 5.9 in.) (37.4 x 31.5 x 5.9 in.) (45.3 x 28.3 x 5.9 in.)Minimum readout 0.01 μm 0.1 μmMaximum workpiece weight 30kg (66.1 lb) 20kg (44.0 lb) 30kg (66.1 lb) 40kg (88.2 lb)Measuring uncertainty U 1X* 1 , U 1Y* 1 0.6 + 2L/1000 μm 1.5 + 4L/1000 μm 1.5 + 4L/1000 μm 1.5 + 2.5L/1000 μm 2 + 4L/1000 μm 2.2 + 4L/1000 μm(workpiece max. 10kg) (workpiece max. 5kg) (workpiece max. 5kg) (workpiece max. 30kg) (workpiece max. 40kg) (workpiece max. 40kg)VMR-H3030/Z120X1900100058017258255102305601000 250 690 250 1100 73056025302010VMR-1515/Z120X/LU1725825510900230560690 25073017501275850 1654661220856230950 2501078560VMR-3020/Z120X/LU230158612062301725825 1748510 1288850560377690 2507301200 2501444560172582551014002200230690 250560U 2XY* 1 0.9 + 3L/1000 μm 2.5 + 4L/1000 μm 2.5 + 4L/1000 μm 2.5 + 2.5L/1000 μm 3 + 4L/1000 μm 3.2 + 4L/1000 μm(workpiece max. 10kg) (workpiece max. 5kg) (workpiece max. 5kg) (workpiece max. 30kg) (workpiece max. 40kg) (workpiece max. 40kg)VMR-6555/Z120X/LUVMR-10080/Z120X/LUVMR-12072/Z120X/LUZ-axis (L: Length in mm < W.D.) 0.9 + L/150 μm 1.5 + L/150 μm Note: Z-axis accuracy is guaranteed by Laser AF.CameraB&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD12208562301220856230158612062301586120623017861406230Working distanceOptical Head for Type 1, 2, 3 50mmWith max. magnification module High mag. objective lens: 9.8mm Low mag. objective lens: 32mmLU model* 2 Refer to CFI Objective Lenses for LCD on page 15.Magnification vs field of viewOptical Head for Type 10.5 – 7.5X / 9.33 x 7 – 0.622 x 0.467 mmOptical Head for Type 21 – 15X / 4.67 x 3.5 – 0.311 x 0.233 mmOptical Head for Type 32 – 30X / 2.33 x 1.75 – 0.155 x 0.117 mmWith max. magnification module 1 – 120X / 4.67 x 3.5 – 0.039 x 0.029 mmLU model Refer to Magnification and FOV Size on page 15.17501275850 16546617501275850 165950 2501078560466300174812888503779501050 25010781680560174812888503771200 2501444560120014002501444220056014002200174812888503771200 250164456014002200Auto focusIlluminationOptical Head for Type 1, 2, 3With max. magnification moduleLU modelTTI Laser AF and Vision AF. LU model: Vision AF onlyDiascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring)Episcopic, diascopic (with high mag. head only), darkfield illuminationDiascopic, Episcopacy & Darkfield illuminationNEXIV VMR-3020 with Wafer Loader NWL860T17861406230VMR-C454017861406230Power sourceAC100-240V ±10%, 50/60HzPower consumption Max. 11A (Standard type), 13A (Z120X type) Max. 13A (Standard type), 15A (Z120X type)Dimensions & weightMain unit only 915 x 1060 x 1300 mm, 512 x 703 x 1200 mm, 625 x 728 x 1195 mm, — — —approx. 450kg approx. 180kg approx. 200kg(36.0 x 41.7 x 51.2 in., 992.1 lb.) (20.2 x 27.7 x 47.2in., 396.8lb.) (24.6 x 28.7 x 47.0 in., 441.0 lb.)Main unit & table 1000 x 1100 x 1900 mm, 512 x 703 x 1200 mm, 690 x 730 x 1725 mm, 1220 x 1680 x 1750 mm, 1530 x 2200 x 1750 mm, 1734 x 2200 x 1750 mm,approx. 570kg approx. 180kg approx. 240kg approx. 600kg approx. 1500kg approx. 1600kg(39.4 x 43.3 x 74.8 in., 1256.6 lb.) (20.2 x 27.7 x 47.2 in., 396.8 lb.) (27.2 x 28.7 x 67.9 in., 529.1 lb.) (48.0 x 66.1 x 68.9 in., 1322.8 lb.) (60.2 x 86.6 x 68.9 in., 3306.9 lb.) (68.3 x 86.6 x 68.9 in., 3527.4 lb.)Controller 250 x 550 x 500 mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)Footprint 2400 (W) x 1400 (D) mm 2100 (W) x 1100 (D) mm 2100 (W) x 1100 (D) mm 2400 (W) x 2000 (D) mm 2800 (W) x 2500 (D) mm 3000 (W) x 2500 (D) mm(94.5 x 55.1 in.) (82.7 x 43.3 in.) (82.7 x 43.3 in.) (94.5 x 78.7 in.) (110.2 x 98.4 in.) (118.1 x 98.4 in.)Host Computer27.565560710 690730173517482501288850560377174812888503771200 250164465Position of tapped holes for custom fixtures300 282850 200(Measuring range) 506060 60606045 4201560 300 (Measuring range) 6020-M660 60 60 60 60Depth10105560330355 (Glass surface)48012001400 2501644220075607863173956025302010140022001400900250 14002000Main unit IBM PC/AT (Windows ® 7)Monitor20-in. colorThe “Z120X” type is equivalent to the “TZ” type in Japan.* 1 The measurements Uncertainty U 1x, U 1y and U 2xy are guaranteed for Nikon Calibration Scale at 7.5x or higher optical magnification with fixed zoom position or revolving nosepiece.* 2 LU model is not available for VMR-H3030.Automatic Wafer Measuring System VMR-3020 + NWL860TCompatible wafer sizesø150mm/200mm(SEMI/JEIDA compliant, silicon )Standard wafer carriersEntegris ® 150mm: PA182-60MB,200mm: 192-80MProcessing speed per carrier8 minutes + NEXIV's measurement time(Continuous transferof 25 wafers)Orientation flat/notch detectionNon-contact, transmitted-type sensorWafer transfer/chuckVacuum chuck, mechanical transferMain unit dimensions1700 (W) x 960 (D) x 1735 (H) mm(excluding PC rack)(66.9 x 37.8 x 68.3 in.)Footprint2750 (W) x 1100 (D) mm (108.3 x 43.3 in.)(excluding areas for operationand maintenance)Main unit weightApprox. 370kg (815.7 lb.)RequirementsElectricity AC100-240V ±10%, 50/60Hz, 11.5A max.Vacuum – 800hPa (–600mmHg), 10NI/min.22Compatible carriers(FOUP, FOSB, OC)Wafer Carrier Measuring System VMR-C4540SEMI-compliant 300mm wafer carriers200mm wafer carriers (with dedicated adapter)Stroke Measuring head (X x Y x Z) 480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.)Rotary table360 (in 90 increments)Minimum readout 0.1 µmHead travel speed XZ axis: max. 200mm/s (7.9 in.) Y axis: max. 50mm/s (2.0 in.)Kinematic plate rotation speed90˚/2 sec.CameraB&W 1/2-in. CCDOptical magnification0.27X to 2.74X (5-step 10X zoom)Field of view20 x 16 mm to 2.0 x 1.6 mmMax. workpiece weight15kg (33.1 lb.)Measuring accuracy(10 + 10L/1000) µm, L = measuring length in mmRepeatability (2σ) 2 µmIlluminationEpiscopic, diascopic, darkfieldAuto focusLaser AF, Vision AFPower sourceAC100-240V±10%, 50/60HzPower consumption (approx.)AC100-120V: 13A (main unit), 9A (PC)AC200-240V: 7A (main unit), 5A (PC)Dimensions1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.)WeightApprox. 1400kg (3086.41 lb.)Host computer IBM PC/AT (Windows ® 7)Monitor17-in. TFT100 100 100 100 100 100 63100 100 100 100 10063100 100 100 100 100 10063 63VMR-302016 1094 16 161094 1610565330355 (Glass surface)4807560231735200230 (Glass surface)3567863VMR-H3030/Z120XVMR-1515/Z120X/LUVMR-3020/Z120X/LUVMR-6555/Z120X/LU98238903 (Glass surface)4198 800 (Y stroke)8460420300 (Measuring range)60 60 60 60 60606060VMR-10080/Z120X/LU40-M8 Depth 1540-M8 Depth 151126112634 1058 (Stage 34 glass)1058 34 (Stage glass)3463 1000 (X stroke) 63 1000 63 (X stroke)6398238903 (Glass surface)4198 800 (Y stroke)84Measuring range60 4206060 300 (Measuring range) 6060 60 60 60 60105 330 (Glass surface) 10554091 100 100 100 100 100 100 100 100 9125.5 931 25.5Measuring range24-M6Depth10105 330 (Glass surface) 10554091 100 100 100 100 100 100 100 100 9125.5 931 25.52830028240 3330 60 60 60 303360 60 60 60 6098238 903 (Stage glass)98 720 (Y stroke) 16430300 2160 60 60 60 60105 150(Measuring range) 9665 230(Glass surface) 56351VMR-12072/Z120X/LU4116-M6Depth1078 150(Measuring range) 7863 180(Glass surface) 63306300 2850 200(Measuring range) 5060 60 60 60 6045 4201560 300 (Measuring range) 6020-M660 60 60 60 60Depth1030300 2144-M8 Depth 1544-M8 Depth 1560 60 60 60 601326132642045 151258 (Stage 34 glass)1258 (Stage 34 glass)34 3420-M660 60 60 60 6060 601200 (X 63 stroke)1200 10 (X stroke) 6363 634198238 903 (Stage glass)98 720 (Y stroke) 164Measuring range2833 240 3330 60 60 60 30100100 100100 100 1009191 100 100 93125.5 25.5300()105 75100100 100100100100100 63 100100 100100100100100100 63 100 100100 100 10063 6365 355() 6016 16 1294 1294 161648078 200()7863 230() 63Measuring range35691 100 100 100100 100100 100 1009125.5 93125.5105 150(Measuring range) 9665 230(Glass surface) 563517863200230 (Glass surface)356786316-M6Depth1078 150(Measuring range) 7863 180(Glass surface) 633067521388100Y100X100100Measuring range1001008863 650 (X stroke)63776 (Stage glass)14-M8 Depth 20104.5 550 (Y stroke) 97.516706 (Glass surface)308 7368