THERMAL DESIGN AND PERFORMANCE OF PROBES IN THICK ...
THERMAL DESIGN AND PERFORMANCE OF PROBES IN THICK ...
THERMAL DESIGN AND PERFORMANCE OF PROBES IN THICK ...
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Temperature (C)<br />
150<br />
100<br />
50<br />
0<br />
-50<br />
-100<br />
-150<br />
Taero<br />
Shelf T1<br />
Shelf T2<br />
Ambient<br />
Elect<br />
Galileo Probe ASI<br />
0 500 1000 1500 2000 2500 3000 3500<br />
Time (s)<br />
Figure 6. Galileo Temperatures from the ASI instrument – most of the probe system equipment such as<br />
computer and batteries most closely follows the benign shelf temperature T1.<br />
Temperature (C)<br />
55<br />
35<br />
15<br />
-5<br />
-25<br />
-45<br />
-65<br />
-85<br />
Huygens Descent<br />
0 2000 4000 6000 8000 10000 12000<br />
Time from T0 (s)<br />
Figure 8. Huygens Probe temperatures (external sensors saturated at -80C) Notice the DISR sensor head<br />
temperature rises after impact (at 8870s) due to the drastic reduction in convective cooling on the ground.<br />
Internal temperatures (battery, transmitter) show a small change in slope at this time but are always benign.<br />
Skin<br />
DISR sensor<br />
Battery 3<br />
Mortar<br />
Transmitter
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