Posters 1 - Fontismedia
Posters 1 - Fontismedia
Posters 1 - Fontismedia
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16:20 to 16:40<br />
Coffee break<br />
Program of the 58th Annual Meeting of the International Society of Electrochemistry 45<br />
16:40 to 17:00<br />
Baotong Lu (Canada), Peter Norton<br />
Effects of Dissolved Hydrogen, Elastic and Plastic Deformation on Active Dissolution of Pipeline<br />
Steel in Near-Neutral pH Groundwater<br />
17:00 to 17:20<br />
Zack Qin (Canada), W-J. Cheong, P. G. Keech, D. W. Shoesmith, J. C. Wren<br />
Modelling the Development of Locally Acidified Sites within Corroding Nuclear Fuel Surfaces<br />
17:20 to 17:40<br />
Michael Broczkowski (Canada), Peter Keech, Jamie Noel, Dave Shoesmith<br />
The role of dissolved hydrogen for inhibiting UO2 corrosion in the presence of H2O2<br />
17:40 to 18:00<br />
Erika Kalman (Hungary), Ilona Felhosi, Gyula Tolnai<br />
Self-Repair Nanocoating System for Protection of Iron<br />
Symposium 9: Surfactant and Additive Effects on Thin Film<br />
Deposition and Particle Growth<br />
Location: Laszlo Funtek Teaching Wing, LF 122/124<br />
Chair: G. Zangari, W. Schwarzacher<br />
15:00 to 15:20<br />
Eric Favry (France), Arnaud Etcheberry, Nadia Frederich, Francois Jomard, Laurent Omnès<br />
Investigation of organics adsorption and inclusionat the growing interfaces during the Damascene<br />
process<br />
15:20 to 15:40 Invited<br />
Benedetto Bozzini (Italy), Lucia D’Urzo, Claudio Mele, Abderrahmane Tadjeddine<br />
An in situ SFG and SERS Investigation of Copper in contact with aqueous solutions containing 4-2-<br />
[1-(2-cyanoethyl)-1,2,3,4-tetrahydroquinolin-6-yl]diazenyl benzonitrile<br />
15:40 to 16:00 Invited<br />
Masanori Hayase (Japan), Masayuki Nagao<br />
Effect of agitation on accelerator removal by reverse pulses in copper electroplating<br />
16:00 to 16:20 Invited<br />
Givoanni Zangari (USA), Wenbo Shao<br />
Influence of Chloride, Sulfamate and Thiourea on the Electrodeposition of Copper<br />
16:20 to 16:40<br />
Coffee break<br />
16:40 to 17:00 Invited<br />
Claude Gabrielli (France), Philippe Moçotéguy, Hubert Perrot, Alan Zdunek<br />
Probing additive degradation in the Damascene Process by Electrochemical Impedance Analysis<br />
17:00 to 17:20 Invited<br />
Walther Schwarzacher (United Kingdom), Peter Heard, Manon Lafouresse<br />
Surface evolution of Cu electrodeposited in presence of Cl-<br />
17:20 to 17:40<br />
Thomas Moffat (USA), Daniel Josell, Soo-Kil Kim, Daniel Wheeler<br />
Superconformal Film Growth: Mechanism and Quantification<br />
17:40 to 18:00<br />
Gi Taek Lee (Korea, Republic of), Geon Hi Kim, Jae Hong Kim<br />
The Study of Cu film impurity and micro void according to plating RPM in Cu electroplating Process<br />
THURSDAY
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