Douglas Casanova

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COTS Use Issues for DoD Systems‣ Quality (commercial vs. mil)‣ Physics of failure‣ Plasma residue‣ Mechanical weakness‣ Hot carrier damage‣ Gate oxide failure‣ Interconnect current density faults‣ Electromigration‣ Lead-free impacts‣ Reliability‣ Tin whisker failures‣ Solder cracks - configuration control‣ Lack of availability (DMS) of traditionalSnPb finished components‣ Commercial industry is going lead-free‣ Initial versus un-announced changes‣ Design / Process / Packaging materials
Unpredictable Commercial SupplyPhillips semiconductor plant (Caen, France)destroyed by fire‣ Produced the SA5521 LVDT integrated circuitused in US subs‣ All mask sets, data sheets, reticles, and waferswere destroyed‣ Philips decided not to resume production‣ Most parts located in the aftermarket were counterfeit‣ Critical part for SSN Virginia Class submarineRecent Fab Closure Announcements:New semiconductor fabrication is moving offshoreExisting onshore state-of-the-practice fabrication facilities are closing:‣ Closure Announcements in last 8 months:‣ Intel, CA & OR‣ On Semiconductor, AZ & ID‣ Analog Devices, MA‣ NEC, CA‣ Hynix Semiconductor, OR“IBM’s microelectronics plant continues to bethe poorest performing of IBM’s five majordivisions.”“IBM’s Microelectronics unit..saw its revenuedecrease 34%...”
Page 1: Defense MicroelectronicsActivityDou
Page 4 and 5: Where Do Your Parts Come From?Count
Page 8 and 9: DMEA Mission‣ DoD Mission - Provi
Page 10 and 11: DoD’s Advanced ReconfigurableManu
Page 12 and 13: War Surge!Hellfire MissilePriceless
Page 14 and 15: Development of Researched Technolog
Page 16 and 17: Microelectronics Densification‣ E
Page 18 and 19: The Trusted Foundry Initiative‣ I
Page 20 and 21: 50 Accredited ServicesTotal Accredi
Page 22 and 23: Instantaneous Battlespace Awareness
Page 24 and 25: B-52 Program Support‣ Problem:‣
Page 26 and 27: DoD / Industry PartnershipEvolved S
Page 28: DMEA: A Complete Strategy for Defen

Douglas Casanova

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