AMD G-Series SOC integrates CPU, GPU and I ... - ICC Media GmbH

TRANSPORTATIONperipherals, such as storage, Ethernet, keyboard/mouse,and display. This modularityallows the designer to upgrade the COM onthe carrier board without changing any otherboard design features, and also allows morecustomization of peripherals as dictated by aspecific application.COMs allow system developers to focus ontheir core competencies and the unique functionsof their systems. The COM Express formfactor offers flexibility in the development andadvancement of ultra-rugged embedded applicationsfor a plethora of industries, includingtransportation. By using the modular processingblock, the designer creates a price andvalue advantage; he/she is not locked into asingle vendor for board creation and can customizebased on pricing and performance requirements.Because it is easily swapped froma carrier board and comes in one of thesmallest form factors, COM Express is idealfor long-life embedded applications with acritical development cycle, as well as moreprogressive applications that require frequentprocessor upgrades without affecting otherapplication design elements. Transportationsolutions are most often housed outdoors orin moving vehicles, where exposure to a varietyof climates dictates the need to operate inextended temperatures and to power up inany extreme. The easiest initial step is to selecta rugged board or system that is designed forharsh environments from the ground up. Tosupport the extremes of shock, vibration, humidity,and temperature, care is given to componentselection, circuit design, printed circuitboard (PCB) layout and materials, thermal solutions,enclosure design, and manufacturingprocess. Robust test methods, including highlyaccelerated life testing (HALT), ensure optimalproduct design phases in order to meet thestringent requirements of a product, such as-40°C to +85°C operating temperature range,MIL-STD, shock and vibration, and long-termreliability.Onboard train systems also deal with highconcentrations of sulphur and humidity whengoing through tunnels. Designers can look forboards with conformal coating to reduce degradationfrom such exposure. Conformal coatingis used in small form factor manufacturingrather than potting, which is a similar processthat uses a heavier material and is harder toinspect, test, and repair. Though consideredthe highest level of environmental protection,potting encapsulates the entire PCB, whichadds weight and expands dimensions of aunit. Even an extra mm can be critical insmall form factor design, which is why conformalcoating with a single-part material thatconforms to the board is a better option. A varietyof conformal coating materials (such asacrylic, polyurethane, epoxy, and silicone) andapplication methods (such as brushing, spraying,and dipping) are currently used to protectagainst moisture, dust, chemicals, and temperatureextremes that can potentially damageelectronics. The correct coating or applicationmethod varies depending on established standardoperating conditions for an application.With transportation applications, differentcoatings may be selected based on a primaryneed for moisture resistance versus abrasionresistance versus temperature stability.Transportation applications typically need asmuch functionality as possible in the smallestform factor, meaning the controller may beburdened with extreme loads of informationand intricate tasks. Rugged computing solutionsalso demand more memory space than everbefore for both data storage and applicationperformance. Options for storage include rotatinghard disk drives (HDDs) for economyor solid-state drives (SSDs), which are truly