Power-Efficient, High-Bandwidth Optical ... - Hot Interconnects

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Low Cost Optical Printed Circuit Boards (Polymer Waveguides)All off-MCMlinks are opticalOpticalMCMVision: Optical MCMsOptics co-packaged with logicOpticalMCMWaveguidesOpticalDIMMAdvantages• Low cost pick and place assembly• Passive routing functions: shuffles, splitsWaveguidesOpticalMCMLow cost PCB cardfor control signals,power, ground• Bring optics close to chips for maximum performanceand efficiency• Enables use of low-cost PCBs – eliminates designchallenges for high-speed electrical linksoPCB:Complete TechnologyDemonstrated:PCB with polymerwaveguidesoPCB: Polymer WG on board or flexChip-Scale Transceivers“Optochips”2-lens opticalcouplingOptical MCMsOptochips on MCM© 2011 IBM
Total Loss (dB)Optical-PCB Technology: Waveguides, Turning Mirrors, Lens Arrays• Polymer waveguides on low-cost FR4 substrate• Lithographic patterning– 48 channels, 35μm core, 62.5 μm pitchWaveguide cross-section25 cm33 x 35 um core size, 62.5 um pitchWaveguideLens Array6O-PCBBGA site forOptomoduleWaveguides, turning mirrors, lens arrayLow loss (< .05 dB/cm)87Uniform – 48 WGsWaveguide on flexWG-to-MMF connector1x124x125432105 10 15 20 25 30 35 40 45Channel Number8 waveguide flex sheets, 192 waveguides, 8 connectors© 2011 IBM
Page 1 and 2: Hot InterconnectsAugust 23, 2012Pow
Page 3 and 4: Evolution of Optical interconnectsT
Page 5 and 6: LasersLasersLasersDetectorsLasersLa
Page 7 and 8: Outline• Intro to Fiber Optics Li
Page 9 and 10: Evolution of Parallel Optics in Sup
Page 11 and 12: Optics close to logic, rather than
Page 13 and 14: 2012: Blue Gene/QSequoia - (96) IBM
Page 15 and 16: Exascale Blueprint: U.S. Department
Page 19: Optical PCB’s with Integrated Tra
Page 23 and 24: Path to Tb/s Modules: Three Generat
Page 25 and 26: 985-nm Transceivers: High-speed, Lo
Page 27 and 28: 3.9mmCompact Si-carrier 850-nm Opto
Page 29 and 30: log 10[BER]360 Gb/s Bidirectional O
Page 31 and 32: Holey Optochip Highly Integrated 8
Page 33 and 34: “Holey” Transceiver Module: Tb/
Page 35 and 36: Optochip Packaging: Pluggable Modul
Page 37 and 38: Probe-able Holey Optomodule: 20 Gb/
Page 39 and 40: Path to Optimizing Link Power Effic
Page 41 and 42: New Technologies: More BW per Fiber
Page 43 and 44: An Alternative to CWDM: Multicore F
Page 47 and 48: Power Efficiency (pJ/bit)90-nm CMOS
Page 49 and 50: Applying Signal Processing to Low P
Page 51 and 52: Efficiency (pJ/bit)Summary of Power
Page 53 and 54: Transmitter-side FFE (TX EQ) is Dra
Page 55 and 56: Summary: Path to High-Speed, Low-Po
Page 57 and 58: Back up57© 2011 IBM Corporation
Page 59 and 60: Optical Link Reliability for PetaSc
Page 61: Key Advantage for Multimode Optics:

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