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Zhihong Li - Joint Research Institute in Science and Engineering by ...

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<strong>Zhihong</strong> <strong>Li</strong>PERSONAL INFORMATIONName: <strong>Zhihong</strong> <strong>Li</strong>Title: Professor, <strong>Institute</strong> of Microelectronics, Pek<strong>in</strong>g UniversityCitizenship: People’s Republic of Ch<strong>in</strong>aMail<strong>in</strong>g Address: <strong>Institute</strong> of Microelectronics, Pek<strong>in</strong>g University, Beij<strong>in</strong>g, 100871,P. R. Ch<strong>in</strong>aPhone: +86-10-6275-2536 ext 14 (O), +86-13717512257Fax: +86-10-6275-1789E-mail: zhhli@pku.edu.cnRESEARCH AND PROFESSIONAL EXPERIENCE2004.7-Present Professor, MEMS <strong>Research</strong> Center, <strong>Institute</strong> ofMicroelectronics, Pek<strong>in</strong>g University• Polymer-base (Parylene, PDMS, PMMA)micro/nanofabricationtechnology• μTAS (Micro Total Analysis System) for biomedicalapplications• Integration technology of IC, MEMS <strong>and</strong> microfluidics• RF (Radio Frequency) MEMS, <strong>in</strong>clud<strong>in</strong>g microswitches <strong>and</strong><strong>in</strong>ductors• Nanofabrication base on micromach<strong>in</strong><strong>in</strong>g techniques2001.8-2004.7 Visit<strong>in</strong>g Scholar, EECS, University of California, Davis• Silicon-based microfabrication technology• Optical MEMS for biomedical applications, <strong>in</strong>clud<strong>in</strong>gmicromirrors <strong>and</strong> OCT• RF (Radio Frequency) MEMS, <strong>in</strong>clud<strong>in</strong>g microswitches <strong>and</strong>tunable capacitors2000.8-2001.8 Visit<strong>in</strong>g Scholar, EECS, Cornell University• Silicon-based microfabrication technology• RF (Radio Frequency) MEMS, <strong>in</strong>clud<strong>in</strong>g microswitches <strong>and</strong><strong>in</strong>ductors1997.7-2002.7 Associate Professor, MEMS <strong>Research</strong> Center, <strong>Institute</strong> ofMicroelectronics, Pek<strong>in</strong>g University• Silicon-based microfabrication technology, <strong>in</strong>clud<strong>in</strong>g surfacemicromach<strong>in</strong><strong>in</strong>g <strong>and</strong> surface micromach<strong>in</strong><strong>in</strong>g• Integration technology of IC <strong>and</strong> MEMS• Simulation <strong>and</strong> model<strong>in</strong>g of microsystem, especially on RFMEMS <strong>and</strong> <strong>in</strong>ertial MEMS


ACADEMIC EXPERIENCE1992.9-1997.7 Ph.D. C<strong>and</strong>idate, <strong>Institute</strong> of Microelectronics, Pek<strong>in</strong>g University,Major<strong>in</strong>g <strong>in</strong> Microelectronics.Thesis Reliability of Interconnects <strong>in</strong> VLSI: Electromigration <strong>and</strong>Stress-<strong>in</strong>duced MigrationMa<strong>in</strong> course Analysis <strong>and</strong> design of Digital VLSI, Semiconductor DevicePhysics, Microelectromechanical System, NanometerSemiconductor Devices, Advanced Semiconductor DeviceTechnology, New Technology of VLSI, MEMS Devices <strong>and</strong>Design, Organization <strong>and</strong> Design of Microprocessor1988.9-1992.7 Bachelor of <strong>Science</strong>, Computer <strong>Science</strong> <strong>and</strong> Technology, Pek<strong>in</strong>gUniversity, Major<strong>in</strong>g <strong>in</strong> MicroelectronicsOTHER ACADEMIC ACTIVITIESCo-Chair of Technical Program Committee, IEEE NEMS’09.Member of Technical Program Committee, the IEEE Sensors ConferenceMember of Technical Program Committee, the IEEE MEMS Conference 2010Member of Technical Program Committee, Transducer 2011Member of IEEE (<strong>Institute</strong> of Electrical <strong>and</strong> Electronic Eng<strong>in</strong>eers)Senior Member of CSMNT (Ch<strong>in</strong>ese Society of Micro/Nanotechnology)Vice President, MEMS <strong>and</strong> NEMS Division, Ch<strong>in</strong>a Instrument <strong>and</strong> Control SocietyValued Reviewer, Sensors <strong>and</strong> Actuators AReviewer, IEEE/ASME Journal of Microelectromechanical System, Journal ofMicromechanics <strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g, Sci Ch<strong>in</strong>a Ser E & FPUBLICATIONSJournal Papers:1. Huang Huang, Zewen Wei, Yuanyu Huang, Deyao Zhao, <strong>Li</strong>anghong Zheng, Tianj<strong>in</strong>g Cai1,Mengxi Wu, Wei Wang, Xianfeng D<strong>in</strong>g, Zhuan Zhou, Quan Du*, <strong>Zhihong</strong> <strong>Li</strong>*, Zicai <strong>Li</strong>ang*, Anefficient <strong>and</strong> high-throughput siRNA delivery system, Lab on a Chip, DOI:10.1039/C0LC00195C2. Y<strong>in</strong>hua Lei, Yaop<strong>in</strong>g <strong>Li</strong>u, Wei Wang*, Wengang Wu, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Studies on ParyleneC-caulked PDMS (pcPDMS) for low permeability required microfluidics applications, Lab on aChip, DOI:10.1039/C0LC00486C.3. Fei Xie, Yunshan Wang, Wei Wang*, <strong>Zhihong</strong> <strong>Li</strong>, Gilad Yossifon, <strong>and</strong> Hsueh-Chia Chang,Preparation of rhombus-shaped micro/nanofluidic channels with dimensions rang<strong>in</strong>g fromhundred nanometers to several micrometers, Journal of Nanoscience <strong>and</strong> Nanotechnology, 2010,10(11):7277-7281.


4. Renx<strong>in</strong> Wang, Xianju Huang, Guangfeng <strong>Li</strong>u, Wei Wang, Fangtian Dong <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*,Fabrication <strong>and</strong> Characterization of a Parylene-based 3D Microelectrode Array for Use <strong>in</strong> NeuralProsthesis, Journal Of Microelectromechanical Systems, Vol. 19, NO. 2, 2010, p367-374.5. Y<strong>in</strong>hua Lei, Wei Wang*, Wengang Wu, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Suspended nanoparticle crystal(S-NPC): A nanofluidics-based, Lab on a Chip, 2010, 10, 2338-2340,DOI: 10.1039/C004758A6. Y<strong>in</strong> Zhang, Yisong Wang, <strong>Zhihong</strong> <strong>Li</strong>*, Analytical method of predicat<strong>in</strong>g the <strong>in</strong>stabilities of amicro arch-shaped beam under electrostatic load<strong>in</strong>g, Microsyst Technol (2010) 16:909–9187. ZhaoX<strong>in</strong> GENG, Q<strong>in</strong>g LI, Wei WANG, <strong>Zhihong</strong> LI*, PDMS prism-glass optical coupl<strong>in</strong>g forsurface plasmon resonance sensors based on MEMS technology, SCIENCE CHINA Information<strong>Science</strong>s , Vol. 53, No. 10, 2144-2158, DOI: 10.1007/s11432-010-4072-z8. Y<strong>in</strong>hua Lei, Wei Wang*, Wengang Wu, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Nanofluidic diode <strong>in</strong> a suspendednanoparticle crystal, Applied Physics Letters, 2010, 96, 2631029. B<strong>in</strong>-B<strong>in</strong> Xu, Hong Xia, <strong>Li</strong>-Gang Niu, Yong-Lai Zhang, Kai Sun, Qi-Dai Chen, Y<strong>in</strong>g Xu,Zhi-Qiu Lv, Zhi-Hong <strong>Li</strong>, Hiroaki Misawa, <strong>and</strong> Hong-Bo Sun*, Flexibly metal nanowir<strong>in</strong>g onnonplanar substrates <strong>by</strong> femtosecond laser <strong>in</strong>duced electroless plat<strong>in</strong>g, , Small, Vol. 6, Iss. 16,pp1762–1766, August 16 201010. Xu Ji, Huaiqiang Yu, Xianju Huang, Y<strong>in</strong>ghua Lei, <strong>Zhihong</strong> <strong>Li</strong>*, Parylene film for sidewallpassivation <strong>in</strong> SCREAM process, Sci Ch<strong>in</strong>a Ser E-Tech Sci, Feb. 2009, vol. 52, no. 2, 357-36211. Zhen Chen, Yu Zhao, Wei Wang*, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Microfluidic pattern<strong>in</strong>g of nanoparticlemonolayers, Microfluidics <strong>and</strong> Nanofluidics, 2009, 7:585-591.12. Zhen Chen, Yunshan Wang, Wei Wang*, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Nanofluidic electrok<strong>in</strong>etics <strong>in</strong>nanoparticle crystal, Applied Physics Letters, 2009, 95:10210513. Y<strong>in</strong>hua Lei, Wei Wang*, Huaiqiang Yu, Y<strong>in</strong>gcun Luo, T<strong>in</strong>g <strong>Li</strong>, Yufeng J<strong>in</strong>, Haixia Zhang <strong>and</strong><strong>Zhihong</strong> <strong>Li</strong>, A parylene-filled-trench technique for thermal isolation <strong>in</strong> silicon-basedmicrodevices, J. Micromechanics <strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g, 2009, 19: 035013.14. Xi Ji, Lu Wang, Jianzhong Xi, <strong>Zhihong</strong> <strong>Li</strong>,* A piezoresistive cantilever for lateral forcedetection fabricated <strong>by</strong> a monolithic post-CMOS process, J. Micromech. Microeng. 18 (2008)115001 (11pp)15. Siwei Zhao, Wei Wang, <strong>Zhihong</strong> <strong>Li</strong>*, <strong>Li</strong>nearity <strong>and</strong> dissociative antigen noise analyses ofcompetitive microfluidic heterogeneous immunoadsorption, Biomed Microdevices (2008) 10:519–52916. Wei Wang, Yu Zhao, Y<strong>in</strong>hua Lei, <strong>Zhihong</strong> <strong>Li</strong>*, Nanoparticle-based lift-off technique ultra-th<strong>in</strong>nanoporous film preparation, <strong>Science</strong> <strong>in</strong> Ch<strong>in</strong>a Series F: Information <strong>Science</strong>s, Jun. 2008, vol. 51,no. 6, 819-82417. Wei Wang, <strong>Zhihong</strong> <strong>Li</strong>*, Simplified Scal<strong>in</strong>g Transformation for the Numerical Simulation ofMEMS Devices With Th<strong>in</strong> Film Structures, Ch<strong>in</strong>ese Journal Of Mechanical Eng<strong>in</strong>eer<strong>in</strong>g, Vol. 21,No. 5, 200818. Haixia Zhang, Hui Guo, Zhe Chen, Guob<strong>in</strong>g Zhang, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Application of PECVD


SiC <strong>in</strong> Glass Micromach<strong>in</strong><strong>in</strong>g, Journal of Micromechanics <strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g, (2007)17775-78019. Haixia Zhang, Hui Guo, Yu Wang, Guob<strong>in</strong>g Zhang, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Study on PECVD SiCcoated Pressure Sensor, Journal of Micromechanics <strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g, (2007)17 426-43120. Yu Jie Tang, J<strong>in</strong>g Chen, Yubo Huang, Dachao <strong>Li</strong>, Sha Sha Wang, <strong>Zhihong</strong> <strong>Li</strong>, Wendong Zhang,Ultra-sensitive highly reproducible film stress characterization us<strong>in</strong>g flexible suspended th<strong>in</strong>silicon plates <strong>and</strong> local curvature measurements, Journal of Micromechanics <strong>and</strong>Microeng<strong>in</strong>eer<strong>in</strong>g, v17, n10, p1923-1930, 200721. Wendian Shi, Norman C. Tien, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, A Highly Reliable Lateral MEMS SwitchUtiliz<strong>in</strong>g Undoped Polysilicon as Isolation Material, Journal Of Microelectromechanical Systems,VOL. 16, NO. 5, 2007, PP 1173-118422. Y<strong>in</strong> Zhang, Yisong Wang, <strong>Zhihong</strong> <strong>Li</strong>*, Yubo Huang, <strong>and</strong> Dachao <strong>Li</strong>, Snap-Through <strong>and</strong>Pull-In Instabilities of an Arch-Shaped Beam Under an Electrostatic Load<strong>in</strong>g, Journal OfMicroelectromechanical Systems, VOL. 16, NO. 3, 2007, PP684-69323. Xiang Han, Wengang Wu, Yi <strong>Li</strong>, <strong>Zhihong</strong> <strong>Li</strong>, Yilong Hao, Guizhen Yan, “Electroless copperplat<strong>in</strong>g applicable for bulk-silicon micromach<strong>in</strong>ed radio frequency <strong>in</strong>ductor”, Th<strong>in</strong> Solid Films515 (2006) 2607–2611. (SCI)24. Yiyong Tan, Rongchun Zhou, Haixia Zhang*, Guizhang Lu, <strong>Zhihong</strong> <strong>Li</strong>, “Model<strong>in</strong>g <strong>and</strong>Simulation of LAG Effect <strong>in</strong> Deep Reactive Ion Etch<strong>in</strong>g Process”, Journal of Micromechanics<strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g, 16 (2006) 2570-257525. Wendian Shi, Haixia Zhang*, Guob<strong>in</strong>g Zhang <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong> , “Modify<strong>in</strong>g residual stress <strong>and</strong>stress gradient <strong>in</strong> LPCVD Si3N4 film with ion implantation”, Sensors <strong>and</strong> Actuators A: Physical ,130–131 (2006) 352–357 (SCI)26. Wengang Wu*, <strong>Li</strong> Yi, Fengyi Huang, Xiang Han, Shaoyong Zhang, <strong>Zhihong</strong> <strong>Li</strong> <strong>and</strong> YilongHao, MEMS Inductor Consist<strong>in</strong>g of Suspended Thick Crystall<strong>in</strong>e Silicon Spiral with CopperSurface Coat<strong>in</strong>g, Ch<strong>in</strong>ese Journal of Semiconductors, vol.27 No.4,2006, pp66227. Wengang Wu*, Fengyi Huang, Yi <strong>Li</strong>, Shaoyong Zhang, Xiang Han, <strong>Zhihong</strong> <strong>Li</strong>, Yilong Hao,<strong>and</strong> Yangyuan Wang, RF Inductors with Suspended <strong>and</strong> Copper Coated Thick Crystall<strong>in</strong>e SiliconSpirals for Monolithic MEMS LC Circuits, IEEE Microwave <strong>and</strong> Wireless Components Letters15, No.12, pp.853-855, Dec. 2005.28. Yong Zhu, Guizhen Yan*, Jie Fan, Jian Zhou, Xuesong <strong>Li</strong>u, <strong>Zhihong</strong> <strong>Li</strong> <strong>and</strong> Yangyuan Wang,“ultra deep <strong>and</strong> high aspect ratio electrical isolation trench” Journal of Micromechanics <strong>and</strong>Microeng<strong>in</strong>eer<strong>in</strong>g, 2005, V. 15, No 3, pp 636-642 (SCI)29. Ye Wang, <strong>Zhihong</strong>. <strong>Li</strong>, Daniel McCormick1 <strong>and</strong> Norman Tien*, A low-voltage lateral MEMSswitch with high RF performance, J. Microelectromechanical Systems. 2004, Vol. 13, No. 6,P902-91130. Ye Wang, <strong>Zhihong</strong> <strong>Li</strong>, Daniel T. McCormick <strong>and</strong> Norman C. Tien*, A micromach<strong>in</strong>ed RFmicrorelay with electrothermal actuation, Sensors <strong>and</strong> Actuators A: Physical, Volume 103, Issues


1-2, 15 2003, Pages 231-23631. <strong>Zhihong</strong> <strong>Li</strong>*, Yilong Hao, Dacheng Zhang, T<strong>in</strong>g <strong>Li</strong>, Guoy<strong>in</strong>g Wu, An SOI-MEMS technologyus<strong>in</strong>g substrate layer <strong>and</strong> bonded glass as wafer-level package Sensors <strong>and</strong> Actuators A-Physical96 (1): 34-42, 200232. <strong>Zhihong</strong> <strong>Li</strong>*, Guob<strong>in</strong>g Zhang, Wei Wang, Yilong Hao, T<strong>in</strong>g <strong>Li</strong>, Guoy<strong>in</strong>g Wu, Study on theapplication of silicide <strong>in</strong> surface micromach<strong>in</strong><strong>in</strong>g, Journal of Micromechanics <strong>and</strong>Microeng<strong>in</strong>eer<strong>in</strong>g 12 (2): 162-167, 200233. Zhenchuan Yang, <strong>Zhihong</strong> <strong>Li</strong>, Zhiyong Xiao, Yilong Hao, Guoy<strong>in</strong>g Wu, Numerical simulationof a bulk micromach<strong>in</strong>ed relay with lateral contact International Journal Of Nonl<strong>in</strong>ear <strong>Science</strong>sAnd Numerical Simulation 3 (3-4): 357-360, 200234. Hongrui Jiang, Keytea Yoo, J. Yeh, <strong>Zhihong</strong> <strong>Li</strong>, Norman C. Tien*, Fabrication of thick silicondioxide sacrificial <strong>and</strong> isolation blocks <strong>in</strong> a silicon substrate, Journal Of Micromechanics AndMicroeng<strong>in</strong>eer<strong>in</strong>g 12 (1): 87-95, 200235. Dacheng Zhang, <strong>Zhihong</strong> <strong>Li</strong>*, T<strong>in</strong>g <strong>Li</strong>, <strong>and</strong> Guoy<strong>in</strong>g Wu, A Novel Isolation Technology <strong>in</strong>Bulk Micromach<strong>in</strong><strong>in</strong>g Us<strong>in</strong>g DRIE <strong>and</strong> Polysilicon Refill, Journal of Micromechanics <strong>and</strong>Microeng<strong>in</strong>eer<strong>in</strong>g, 11, 2001, P13-1936. Gang <strong>Li</strong>, <strong>Zhihong</strong> <strong>Li</strong>, Congshun Wangg, Yilong Hao, T<strong>in</strong>g <strong>Li</strong>, Dacheng Zhang <strong>and</strong> Guoy<strong>in</strong>gWu, Design <strong>and</strong> fabrication of a highly symmetrical capacitive triaxial accelerometer, Journal ofMicromechanics <strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g, 48–54, Vol.11, No.1, 2001.37. <strong>Zhihong</strong> <strong>Li</strong>*, Zhixiong Xiao, Yilong Hao, Guoy<strong>in</strong>g Wu, <strong>and</strong> Yangyuan Wang,A BulkMicromach<strong>in</strong>ed Vibratory Lateral Gyroscope Fabricated with Wafer Bond<strong>in</strong>g <strong>and</strong> Deep TrenchEtch<strong>in</strong>g, Sensors <strong>and</strong> Actuators, A83, 2000, 24-2938. <strong>Zhihong</strong> <strong>Li</strong>*, Dacheng Zhang, T<strong>in</strong>g <strong>Li</strong>, Wei Wang, <strong>and</strong> Guoy<strong>in</strong>g Wu, Bulk Micromach<strong>in</strong>edRelay with Lateral Contact, Journal of Micromechanics <strong>and</strong> Microeng<strong>in</strong>eer<strong>in</strong>g , Vol. 8, No. 3,200039. <strong>Zhihong</strong> <strong>Li</strong>,* Guoy<strong>in</strong>g Wu, Yangyuan Wang, Zhiguo <strong>Li</strong>, <strong>and</strong> Y<strong>in</strong>ghua Sun, NumericalCalculation of Electromigration under Pulse Current with Joule Heat<strong>in</strong>g, IEEE Tran. ElectronicDevices, Vol.46, No. 1, 199940. <strong>Zhihong</strong> <strong>Li</strong>*, Guoy<strong>in</strong>g Wu, Yangyuan Wang, Zhiguo <strong>Li</strong>, <strong>and</strong> Y<strong>in</strong>ghua Sun, Dependence ofElectromigration Caused <strong>by</strong> Different Mechanisms on Current Densities <strong>in</strong> VLSI Interconnects, J.Materials <strong>Science</strong>: Materials <strong>in</strong> Electronics, Vol. 10, 1999,p 653-65941. Zhixiong Xiao, Guoy<strong>in</strong>g Wu, Guob<strong>in</strong>g Zhang, <strong>Zhihong</strong> <strong>Li</strong>, Yilong Hao, Wenru Chen, <strong>and</strong>Yangyuan Wang, Low Temperature Silicon Wafer-to Wafer Bond<strong>in</strong>g with Nickel Silicide, J.Electrochem. Soc. Vol.145, No. 4,199842. Zhixiong Xiao, M<strong>in</strong> Chen, Guoy<strong>in</strong>g Wu, Changde Zhao, Dacheng Zhang, Yilong Hao, Guob<strong>in</strong>gZhang <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Silicon micro-accelerometer with mg resolution, high l<strong>in</strong>earity <strong>and</strong> largefrequency b<strong>and</strong>width fabricated with two mask bulk process, Sensors <strong>and</strong> Actuators A: Physical,Volume 77, Issue 2, 12 October 1999, Pages 113-119


43. Zhixiong Xiao, Guoy<strong>in</strong>g Wu, Dacheng Zhang, Guob<strong>in</strong>g Zhang, <strong>Zhihong</strong> <strong>Li</strong>, Yilong Hao,Yangyuan Wang, Silicon/Glass Wafer-to-Wafer Bond<strong>in</strong>g with Ti/Ni Intermediate Bond<strong>in</strong>g,Sensors <strong>and</strong> Actuators A 71(1998) 12344. Zhixiong Xiao, Guoy<strong>in</strong>g Wu, Yilong Hao, Guob<strong>in</strong>g Zhang, <strong>Zhihong</strong> <strong>Li</strong>, Wenru Chen,Shimei <strong>Li</strong>u, T<strong>in</strong>g <strong>Li</strong>u, Tiesong Wang, Yangyuan Wang, A New Process for Releas<strong>in</strong>gMicromechanical Structures <strong>in</strong> Surface Micromech<strong>in</strong><strong>in</strong>g with Polysilicon support <strong>and</strong> LPCVDSi 3 N 4 Mask”, Sensors <strong>and</strong> Actuators A 72(1998) 18945. <strong>Zhihong</strong> <strong>Li</strong>*, Guoy<strong>in</strong>g Wu, <strong>and</strong> Yangyuan Wang, “Evaluation of Yield Strength <strong>in</strong> AlInterconnects <strong>in</strong> VLSI”, Ch<strong>in</strong>ese J. Electronics, Vol.6, 1997, P1946. <strong>Zhihong</strong> <strong>Li</strong>, Ye Gu, Guoy<strong>in</strong>g Wu, Wen-Ru Chen,Yang-Yuan Wang, “Measur<strong>in</strong>g <strong>and</strong> Model<strong>in</strong>gStresses <strong>in</strong> Al Metallization”, J. Vac. Technol. A 14(5), 1996, P2693Conference Papers:1. Xuanye Wang, Zhaox<strong>in</strong> Geng, Wei Wang <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, PDMS nanostructures fabricated <strong>by</strong>two-step mold<strong>in</strong>g process used for tunable sers <strong>in</strong>tegrated with microfluidics, the 14thInternational Conference on M<strong>in</strong>iaturized Systems for Chemistry <strong>and</strong> <strong>Li</strong>fe <strong>Science</strong>s (Micro TotalAnalysis Systems, uTAS’10), 3 - 7 October 2010, 1925-1927,Gron<strong>in</strong>gen, Netherl<strong>and</strong>s,pp1925-19272. Yushi Zhang, XuJi, Can <strong>Li</strong>, Wengang Wu <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, a novel fabrication method ofhollow nanoneedles applicable for s<strong>in</strong>gle cell operation,the 14th International Conference onM<strong>in</strong>iaturized Systems for Chemistry <strong>and</strong> <strong>Li</strong>fe <strong>Science</strong>s (Micro Total Analysis Systems, uTAS’10),3 - 7 October 2010, Gron<strong>in</strong>gen, NETHERLANDS, 1895-18973. Zewen Wei, Huang Huang, Mengxi Wu, Zicai <strong>Li</strong>ang, Wei Wang <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, a highperformance cont<strong>in</strong>uous electroporation chip,the 14th International Conference on M<strong>in</strong>iaturizedSystems for Chemistry <strong>and</strong> <strong>Li</strong>fe <strong>Science</strong>s (Micro Total Analysis Systems, uTAS’10), 3 - 7October 2010, Gron<strong>in</strong>gen, NETHERLANDS, pp 1622-16244. Zhaox<strong>in</strong> Geng, J<strong>in</strong>g Du, <strong>Li</strong>ngqian Zhang, Chun Yang, Wei Wang <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, separation<strong>and</strong> enrichment of mesenchymal stem cells on a chip,the 14th International Conference onM<strong>in</strong>iaturized Systems for Chemistry <strong>and</strong> <strong>Li</strong>fe <strong>Science</strong>s (Micro Total Analysis Systems, uTAS’10),3 - 7 October 2010, 241-243, Gron<strong>in</strong>gen, NETHERLANDS, pp241-2435. Y<strong>in</strong>hua Lei, Wei Wang*, Wengang Wu, <strong>and</strong> <strong>Zhihong</strong><strong>Li</strong>,, Suspended Nanoparticle Crystal forSurface Charge Sens<strong>in</strong>g, IEEE SENSORS 2010 Conference November 1 - 4, 2010, Waikoloa,Hawaii, USA6. Xunjun He, Zhiqiu Lv, Bo <strong>Li</strong>u <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Laterally Driven Capacitive RF MEMS SwitchUs<strong>in</strong>g Parylene as Dielectric Layer, EEE SENSORS 2010 Conference November 1 - 4, 2010,Waikoloa, Hawaii, USA7. Zewen Wei, Huang Huang, Zicai <strong>Li</strong>ang, <strong>Zhihong</strong> <strong>Li</strong>*, A High Performance Electroporation ChipIntegrat<strong>in</strong>g Multi-Well Plate <strong>and</strong> Annular Interdigital Microelectrodes, IEEE MEMS 2010, HongKong, pp951-9548. Bo <strong>Li</strong>u, Zhiqiu Lv,Xunjun He, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Microspr<strong>in</strong>g Contact for Enhancement of Power


H<strong>and</strong>l<strong>in</strong>g <strong>and</strong> Reliability <strong>in</strong> RF MEMS Switch, The 5th Asia-Pacific Conference on Transducers<strong>and</strong> Micro-Nano Technology (APCOT2010), Australia, 20109. Bo <strong>Li</strong>u, <strong>Zhihong</strong> <strong>Li</strong>*, Zhiqiu Lv, Xunjun He, <strong>and</strong> YilongHao, A Surface Micromach<strong>in</strong><strong>in</strong>g ProcessUtiliz<strong>in</strong>g Dual Metal Sacrificial Layer for Fabrication of RF MEMS Switch, ,Proceed<strong>in</strong>g of IEEENEMS, 201010. Zhaox<strong>in</strong> Geng, Zhaoqi Xu, Wei Wang, Wenhua Su <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Separation of Blood on aChip Utiliz<strong>in</strong>g SpiralMicorchannel with Fence <strong>and</strong> Cofferdam as Filtration Structures,ICSICT2010, 1474-1476, Nov. 2010, shanghai11. X<strong>in</strong>yi Zhang, Pei-Yu Chiou, <strong>Zhihong</strong> <strong>Li</strong>*, A conceptual prototype of the light, switchablemicroelectrode array (LSMA) for ret<strong>in</strong>al prosthesis, Nano/Micro Eng<strong>in</strong>eered <strong>and</strong> MolecularSystems (NEMS), 2010 5th IEEE International Conference on, pp.1079 – 108212. Xianju Huang, Renx<strong>in</strong> Wang, Wei Wang, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Fabrication of flexible 3DMicroelectrode Array with parylene-based pattern transfer technique, Transducers’09, pp236-23913. Xu Ji, <strong>Li</strong>n Yang, Zewen Wei1, Lu Wang, Jianzhong Xi <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, A MonolithicallyIntegrated Platform For High Throughput Cell Characterization <strong>and</strong> Drug Screen<strong>in</strong>g,Transducers’09, 1786-178914. Qiang <strong>Li</strong>u, Bo <strong>Li</strong>u <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Improvement of Au cantilever fabrication process with Cuas a sacrificial layer, IEEE NEMS’09, 872-87615. Xianju Huang, Yu Tang, Quan Qiang, Wei Wang, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, A Novel 3D FlexibleParylene-Metal Structure Fabrication Technique, IEEE NEMS’09, 907-91016. Cheny<strong>in</strong>g Yang, Wei Wang*, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Optimization of corona-triggered PDMS-PDMSbond<strong>in</strong>g method, Proceed<strong>in</strong>g of IEEE NEMS, 2009, 319-32217. Zhen Chen, Yu Zhao, Wei Wang*, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Microfluidic Pattern<strong>in</strong>g of NanoparticleMonolayer: Mechanism analysis <strong>and</strong> noncont<strong>in</strong>uously pattern<strong>in</strong>g approach Proceed<strong>in</strong>g of IEEENEMS, 2009, 818-82218. Fei Xie, Yunshan Wang, Wei Wang*, <strong>Zhihong</strong> <strong>Li</strong>, Gilad Yossifon <strong>and</strong> Hsueh-Chia Chang,Preparation of Rhombus-shaped Micro/Nanofluidic Channels with Dimensions Rang<strong>in</strong>g fromHundred Nanometers to Several Micrometers, Proceed<strong>in</strong>g of Ch<strong>in</strong>aNano2009, 2009, 50-203219. <strong>Zhihong</strong> <strong>Li</strong>, Flexible Three-Dimentional Microelectrode Array For Ret<strong>in</strong>al Prosthesis, IEEENANOMED’09 (Invited)20. <strong>Zhihong</strong> <strong>Li</strong>, Integration of SOC <strong>and</strong> LOC, IEEE NEMS’09 (Invited)21. LV Zhiqiu,YANG Bo, LIU Bo, LI <strong>Zhihong</strong>, <strong>Research</strong> on Electroless Plat<strong>in</strong>g for Improvement ofMetal Contact of Lateral RF MEMS Switch, 11 届 中 国 微 米 纳 米 技 术 年 会 ,200922. Xu Ji, Lu Wang, Jianzhong Xi, <strong>Zhihong</strong> <strong>Li</strong>*, Monolithic Integration of Force Sensor,Signal-Process<strong>in</strong>g Circuitry <strong>and</strong> Self-Assembled Cells for Characterization ff Muscles’Mechanics, uTAS 200823. <strong>Zhihong</strong> <strong>Li</strong>*, Xu Ji, Lu Wang, Jianzhong Xi, Merg<strong>in</strong>g SoC <strong>and</strong> LOC Together, InternationalConference on Solid-State <strong>and</strong> Integrated-Circuit Technology ICSICT’2008 ,October 20-23,


2008, Beij<strong>in</strong>g, Ch<strong>in</strong>a (Invited)24. Zhaox<strong>in</strong> Geng , Xu Ji , Xia Lou, Q<strong>in</strong>g <strong>Li</strong> , Wei Wang , <strong>Zhihong</strong> <strong>Li</strong>* ,A surface plasmonresonance(SPR)sensor chip <strong>in</strong>tegrat<strong>in</strong>g prism array based on polymer microfabrication, 9thInternational Conference on Solid-State <strong>and</strong> Integrated-Circuit Technology ICSICT’2008 ,October 20-23, 2008, Beij<strong>in</strong>g, Ch<strong>in</strong>a.25. Zhaox<strong>in</strong> Geng , Xu Ji , Wei Wang , <strong>Zhihong</strong> <strong>Li</strong>*, Near-<strong>in</strong>frared surface plasmon resonance(SPR) chip with silicon micro-prism <strong>and</strong> multi-micro-channel based on MEMS technology, 1stInternational Conference of the Ch<strong>in</strong>ese Society of Micro/Nano Technology,November 20-22,2008, Beij<strong>in</strong>g, Ch<strong>in</strong>a.26. Xianju Huang Weihong Yu, Wei Wang, Chan Zhao, Chengchen Gao, Xuqian Wang,ZhikunYang,<strong>Zhihong</strong> <strong>Li</strong>* <strong>and</strong> Fangtian Dong, Flexible Microelectrode Array on Parylene for Subret<strong>in</strong>alStimulation <strong>and</strong> Its Biocompatibility Test, 1st International Conference of the Ch<strong>in</strong>ese Society ofMicro/Nano Technology, p482-483, 200827. Y<strong>in</strong>hua Lei, Wei Wang*, Huaiqiang Yu, T<strong>in</strong>g <strong>Li</strong>, Yufeng J<strong>in</strong> <strong>and</strong> Haixia Zhang, <strong>Zhihong</strong> <strong>Li</strong>,Deep Trench Refill<strong>in</strong>g With Parylene C For High-Quality Isolation In Bulk Micromach<strong>in</strong>edDevices, Proceed<strong>in</strong>gs of 2nd Integrated Commercialization of Micro & NanosystemsInternational Conference &Exhibition, June 3-5, 2008, Clear Water Bay, Kowloon, HongKongPaper Number: Micro/Nano 2008-70112,28. Yu Zhao, Y<strong>in</strong>hua Lei, Wei Wang*, <strong>Zhihong</strong> <strong>Li</strong>, Microfluidic Pattern<strong>in</strong>g of Close-packedNanoparticle Monolayer, Proceed<strong>in</strong>gs of the 3rd IEEE Int. Conf. on Nano/Micro Eng<strong>in</strong>eered <strong>and</strong>Molecular Systems January 6-9, 2008, Sanya, Ch<strong>in</strong>a29. Xu Ji, Wei Wang, Xia Lou, Jianhong Peng, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, A Centrifugation-EnhancedHigh-Efficiency Micro-Filter With Spiral Channel, The 14th International Conference on Solid-State Sensors <strong>and</strong> Actuators(Transducers’07), Lyon, Paris, PP1865-186830. Dongsheng Xu, Wei Wang, Yufeng J<strong>in</strong> <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Cont<strong>in</strong>uously MicrofluidicCentrifugation In Sequentially Connected Semicircular Microchannels For Micrometer-SizedParticle Enrichment, the 11th International Conference on M<strong>in</strong>iaturized Systems for Chemistry<strong>and</strong> <strong>Li</strong>fe <strong>Science</strong>s (Micro Total Analysis Systems, uTAS’07), Paris, France, 2007, PP539-541,31. <strong>Zhihong</strong> <strong>Li</strong>*, Spiral Microchannels For Cont<strong>in</strong>uously Microfluidic Centrifugation, Workshop onMicrofluidics <strong>and</strong> Its Applications, Hong Kong, 2007(Invited)32. Wei Wang, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, A simplified scal<strong>in</strong>g transformation for the numerical simulation ofMEMS devices with th<strong>in</strong> film structures. International conference of MicroNanoCh<strong>in</strong>a2007,January 10-13, Sanya, Ch<strong>in</strong>a, 200733. Zhanfei, Wang, <strong>Zhihong</strong> <strong>Li</strong>, Wengao Lu, "A New Self-Oscillation Loop for MEMS VibratoryGyroscopes." IEEE ASICON 2007, pp.1046-104934. Yu Wang. Haixia Zhang, Hui Guo, Guob<strong>in</strong>g Zhang, <strong>Zhihong</strong> <strong>Li</strong>, “Mechanical Properties ofPECVD silicon carbide th<strong>in</strong> films”, APCOT 2006, 25-28, June, S<strong>in</strong>gapore35. Hui Guo, Yu Wang, Sheng Chen, Guob<strong>in</strong>g Zhang, Haixia Zhang, <strong>Zhihong</strong> <strong>Li</strong>, “PECVD SiC as a


Chemical Resistant Material <strong>in</strong> MEMS”, 1st IEEE NEMS, 18-21, Jan, 2006, Zhuhai, Ch<strong>in</strong>a,36. Wei Wang, Dongsheng Xu, <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>*, Microfluidic centrifugations <strong>in</strong> a spiralmicrochannel, the 10th International Conference on M<strong>in</strong>iaturized Systems for Chemistry <strong>and</strong> <strong>Li</strong>fe<strong>Science</strong>s (Micro total analysis systems 2006), Tokyo, Japan, Novmber 5-9, 2006.37. Wei Wang, <strong>Zhihong</strong> <strong>Li</strong>*, Thermal isolation <strong>in</strong> cont<strong>in</strong>uous flow PCR chip, a numerical <strong>in</strong>sight,Asia-Pacific Conference of Transducers <strong>and</strong> Micro-Nano Technology, S<strong>in</strong>gapore, June 25-28,2006.38. Xu Ji, J<strong>in</strong>g Chen*, Y<strong>in</strong>g Wang, <strong>Zhihong</strong> <strong>Li</strong>, Guizhen Yan, Yangyuan Wang, A Wafer LevelHermetic Package for Micromach<strong>in</strong>ed Structures on Glass, The 3rd Asia-Pacific Conference ofTransducers <strong>and</strong> Micro-Nano Technology(APCOT 2006), PAT-A049439. Shasha Wang, J<strong>in</strong>g Chen*, Dachao <strong>Li</strong>, Yubo Huang, <strong>Zhihong</strong> <strong>Li</strong>, Evaluat<strong>in</strong>g Interface Effect OnStresses In Th<strong>in</strong> Films By A Local Curvature Metrology With High Accuracy And Resolution,The 1st Annual IEEE International Conference on Nano/Micro Eng<strong>in</strong>eered <strong>and</strong> MolecularSystems (IEEE NEMS 2006), Jan. 2006, Zhuhai, Ch<strong>in</strong>a p1513-151640. <strong>Zhihong</strong> <strong>Li</strong>, MEMS: An Enabl<strong>in</strong>g Technology for Wireless sensor Network, 2006 (Invited)41. Wendian Shi, Haixia Zhang*, Shasha Wang, Guob<strong>in</strong>g Zhang <strong>and</strong> <strong>Zhihong</strong> <strong>Li</strong>, Modify<strong>in</strong>gResidual Stress And Stress Gradient In LPCVD Si3N4 Film With Ion Implantation,Transducers’05, p824-82742. <strong>Zhihong</strong> <strong>Li</strong>, Norman C. Tien*, Low-Cost Electroplated Vertical Comb-Drive Actuator,Proceed<strong>in</strong>gs of the Solid-State Sensor, Actuator, <strong>and</strong> Microsystems Workshop, Hilton Head, 2004,220-22343. Bee Lee Chua, <strong>Zhihong</strong> <strong>Li</strong>, Daniel McCormick, W. P. Shih, Norman C. Tien*, A. S. Wexler,D. A. Niemeier <strong>and</strong> B. Holman. A Unipolar Corona Discharge Microfabricated IonizerStructure For Gases At Atmospheric Pressure And Composition. Proceed<strong>in</strong>gs of the 17th IEEEConference on Micro Electro Mechanical Systems, MEMS 2004, pp.261-26444. Wen P<strong>in</strong> Shih, <strong>Zhihong</strong> <strong>Li</strong>, Daniel McCormick, Norman C. Tien* <strong>and</strong> C. Y. Hui. TunableSolenoid Micro<strong>in</strong>ductors Utiliz<strong>in</strong>g Permalloy Electro-Thermal Vibromotors. Proceed<strong>in</strong>gs of the17th IEEE Conference on Micro Electro Mechanical Systems, MEMS 2004, pp.793-79645. Yi <strong>Li</strong>, <strong>Zhihong</strong> <strong>Li</strong>, Yilong Hao, Guizhen Yan, Wengang Wu* <strong>and</strong> Xiang Han, Electroless CopperPlat<strong>in</strong>g on Silicon Surface for MEMS, The Seventh International Conference on Solid-State <strong>and</strong>Integrated-Circuit Technology (ICSICT-2004), Beij<strong>in</strong>g (October 18~21, 2004) , pp.1900-190346. Daniel McCormick, <strong>Zhihong</strong> <strong>Li</strong>, Norman C. Tien*, Dielectric Fluid Immersed MEMS TunableCapacitors, IEEE MTT-S International Microwave Symposium, 2003, 495-49847. Daniel McCormick, <strong>Zhihong</strong> <strong>Li</strong>, Norman C. Tien*, Silicon Mems Tunable CapacitorsOperat<strong>in</strong>g In Dielectric Fluid, Transducers’03, 2003, 871-87448. Hongrui Jiang, <strong>Zhihong</strong> <strong>Li</strong>, <strong>and</strong> Norman C. Tien*, Reduc<strong>in</strong>g Silicon-Substrate Parasitics OfOn-Chip Transformers, The Fifteenth IEEE International Conference on Micro ElectroMechanical Systems (MEMS’02), Las Vegas, NV, USA, Jan. 2002, P649-653


49. Ye Wang, <strong>Zhihong</strong> <strong>Li</strong>, Daniel T. McCormick <strong>and</strong> Norman C. Tien*, Low-VoltageLateral-Contact Microrelays For RF Applications, The Fifteenth IEEE International Conferenceon Micro Electro Mechanical Systems (MEMS’02), Las Vegas, NV, USA, Jan. 2002, P645-64850. Congshun Wang, C.Y.Xiong, Weib<strong>in</strong> Zhang, J<strong>in</strong>g Fang, <strong>Zhihong</strong> <strong>Li</strong>, Test<strong>in</strong>g <strong>and</strong> simulation ofnovel MEMS relays <strong>by</strong> apply<strong>in</strong>g digital image correlation technology, The first IEEE<strong>in</strong>ternational conference on sensors,p1204-1207,Florida,USA, June 2002.51. <strong>Zhihong</strong> <strong>Li</strong>, <strong>and</strong> Norman C. Tien*, A High Tun<strong>in</strong>g-Ratio Silicon-Micromach<strong>in</strong>ed VariableCapacitor With Low Driv<strong>in</strong>g Voltage, Solid-State Sensor, Actuator, <strong>and</strong> Microsystems Workshop,Hilton Head Isl<strong>and</strong>, SC, USA, 2002, 239-24352. J<strong>in</strong>g Fang, Weib<strong>in</strong> Zhang, Congshun Wang, <strong>Zhihong</strong> <strong>Li</strong>, D.C.Zhang, Electromechanical analysisof microelectromechanical structures <strong>and</strong> dynamic simulations of laterally vibratorymicrogyroscope, SPIE Proc. Vol.4407,p68-77,Ed<strong>in</strong>burgh,UK,May 2001.53. <strong>Zhihong</strong> <strong>Li</strong>, Dacheng Zhang, T<strong>in</strong>g <strong>Li</strong>, Y<strong>in</strong>g Wang, Guoy<strong>in</strong>g Wu, Novel Silicon Cap PackageTechnology for Monolithic Micro-<strong>in</strong>ertial Measurement Unit, SPIE's 7th Annual InternationalSymposium on Smart Structures <strong>and</strong> Materials, San Diego, CA, USA, 200054. <strong>Zhihong</strong> <strong>Li</strong>, Zhixiong Xiao, Yilong Hao, Guoy<strong>in</strong>g Wu, <strong>and</strong> Yangyuan Wang,A BulkMicromach<strong>in</strong>ed Vibratory Lateral Gyroscope Fabricated with Wafer Bond<strong>in</strong>g <strong>and</strong> Deep TrenchEtch<strong>in</strong>g , The 10th International Conference on Solid- State Sensors <strong>and</strong>Actuators(Transducers’99), Sendai, Japan, 1999, P1594;55. Gang <strong>Li</strong>, <strong>Zhihong</strong> <strong>Li</strong>, Congshun Wang, Yilong Hao, Guoy<strong>in</strong>g Wu, Design <strong>and</strong> Simulation of AaNovel Highly Systemmetrical Pizoelectric Triaxial Accelerometer, MSM’2000, San Diego, CA,USA, 2000, P628-63156. ZhiXiong Xiao, Guoy<strong>in</strong>g Wu, Dacheng Zhang, Yilong Hao, <strong>Zhihong</strong>, <strong>Li</strong>, Lateral Capacity sensedAccelerometer Fabricated with the Anodic bond<strong>in</strong>g <strong>and</strong> the High Aspect Ratio Etch<strong>in</strong>g, The 10thInternational Conference on Solid- State Sensors <strong>and</strong> Actuators (Transducers’99), Sendai, Japan,1999, P15157. Guoy<strong>in</strong>g Wu, Zhixiong Xiao, <strong>Zhihong</strong> <strong>Li</strong>, Hao Yilong, Design And Fabrication for Inertial MicroSensors, International Conference on Solid- State <strong>and</strong> Integrated Circuit Technology (ICSICT’98),Bej<strong>in</strong>g, Ch<strong>in</strong>a, 1998, P903

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