Tribology of Manufacturing Processes - Presses des Mines

PrefaceAs in the first edition in 1997 in Gifu, Japan, the second one in Nyborg, Denmark, in2004 and the third in 2007 in Yokohama, Japan, ICTMP 2010 ambition is to gather theinternational community involved in the tribology of manufacturing processes, fromacademia as well as from industry. Apart from the everlasting trend towards moreefficiency and productivity associated with lower costs, recent years have witnessed theemergence of new orientations, such as microforming for microsystems and MEMS, ormicro- to nano-patterning of surfaces for improved tribological properties or moregenerally for surface functionalization ; both raise new questions of scale effects onfriction. Environmental concerns bring to the forefront the need for new, “greenerlubricants”, or for using less lubricant (Minimal Quantity Lubrication, or MQL) forexample with the help of improved coatings. New coatings from non-toxic and easilydisposable baths, or new coating deposition or surface hardening and texturingtechniques, are also central in the industrial evolutions. From another point of view,friction measurement and friction models are more and more requested to account for itsspace- and time-dependence, both in view of the local or time-varying control of frictionin the shop, and in the modelling of processes.All these trends are both new constraints imposed on the mechanical engineer, andsources of new thrilling research topics for his advisor, the Tribologist, as will becomeobvious at reading the following research reports. The present two volumes present awelcome review of advances in the tribological practice and knowledge of suchtraditional processes as deep-drawing and stamping, hot and cold forging, wire-drawing,strip rolling, or assembling processes, cutting and machining, while giving an insightinto newer or less vulgarized forming, assembling or finishing techniques.The Organizing Committee heartily thanks the authors of the 88 contributions to thisConference and to the present Proceedings, and specially the Programme Committeewhose members worked hard to review the papers and improve their quality.Eric FELDER, Pierre MONTMITONNETChairmen, ICTMP 20101