System summary

HMISoftwareAccessoriesAppendixSystem SLIOSystem 300S | System descriptionSystem description 300SSystem 100VSystem 300S System 200VSystem 500SStructure and ConceptThe system 300S is both a compact and a modular expandablesystem.The system 300S is designed for centralized and decentralizedautomation tasks in the manufacturing and process industry upto the highest power range.With a central extension of up to 32 modules directly to theCPU and up to 126 fi eldbus slave modules, it is deployablealmost anywhere. The module size allows use in almost anyautomation environment.The assembly is extremely simple. First, the backplane busconnectors for communication between the modules andthe CPU are entered from behind and then the modules areindividually placed and secured on the rail and screwed down.The backplane bus connectors are supplied with the I/Omodules. In the SPEED-Bus, the bus connection takes placevia a SPEED-Bus terminal strip (PCB) integrated in the profi lerail. The SPEED-Bus modules are mounted on the left ofthe CPU - depending on bus length 2, 6 or 10 SPEED-Busmodules can be deployed.42