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Simulation of the backfill process with Plexiglas tubes<br />
Temperature development<br />
Temperature increase of 15 K (corrected value 21 K).<br />
Good agreement with the calculated value (24 K).<br />
Low stresses during the warming phase<br />
(material creep).<br />
Possibility of thermal induced<br />
crack formation during cooling<br />
(category B) due to the length<br />
of the backfill sections (30 m).<br />
Engelhardt/Haverkamp<br />
Engelhardt, H.-J.; Haverkamp, B.; von Borstel, L.E.; Van Marcke, Ph. & Coppens, E.<br />
ONDRAF/NIRAS DBE Technology GmbH – <strong>Backfill</strong> Project – Project & ONDRAF/NIRAS<br />
B Tests & C B 31/07/2014 Techno & C Techno (MPA – Meeting Braunschweig)<br />
Category Brussels, <strong>WM2015</strong> -B 07. <strong>15374</strong> & 21/02/2013 November C 2014<br />
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