Radiation Hardened Electronics Market Trends

bisresearch

Radiation hardened electronics are manufactured to be radiation resistant to operate in harsh environments. The manufacturing and development of reliable and robust radiation hardened electronic components is expensive. Additionally, the demand for radiation hardened electronics is apparently low, which makes it even more costly. Due to immense cost involved in the testing and development of radiation hardened electronics, the market tends to lack developments.

Global Radiation Hardened Electronics Market

Focus on Manufacturing Techniques (Rad-Hard by Design (RHBD),

Rad-Hard by Process (RHBP), and Rad-Hard by Software (RHBS));

Component Type; and End Users - Analysis and Forecast, 2018-2023

Key Questions Answered in the Report

MORE THAN

100 COMPANIES

RESEARCHED

ACROSS THE VALUE

CHAIN

METICULOUS

COMPILATION OF

MORE THAN 250

RESEARCH HOURS

EXCLUSIVE INSIGHTS

FROM IN-DEPTH

EXPERT INTERVIEWS

CONTAINS 42

MARKET DATA TABLES

AND 113 FIGURES

SPREAD ACROSS

206 PAGES

• What are the major driving forces that tend to increase the

demand for the global radiation hardened electronics market

during the forecast period, 2018-2023?

• What are the major challenges inhibiting the growth of the

global radiation hardened electronics market?

• Who are the key players in the global radiation hardened

electronics market and what are their competitive

benchmarking?

• What is the revenue generated by the different component

types, manufacturing techniques, and end users of radiation

hardened electronics market?

• How is each segment of the global radiation hardened

electronics market expected to grow during the forecast period

and what will be the estimated revenue generated by each of

the segments by the end of 2023?

• What are the trends in the global radiation hardened electronics

market across different regions?

• How is the industry expected to evolve during the forecast

period 2018-2023?

• Which region is expected to contribute to the highest sales in

the global radiation hardened electronics market during the

forecast period?

• What are the new strategies adopted by the existing market

players to make a mark in the industry?

• What are the major opportunities that the radiation hardened

electronics manufacturers foresee?

sales@bisresearch.com | www.bisresearch.com


Table of Contents

MARKET DYNAMICS

COMPETITIVE INSIGHTS

INDUSTRY ANALYSIS

GLOBAL RADIATION HARDENED

ELECTRONICS MARKET, 2018-2023

GLOBAL RADIATION HARDENED

ELECTRONICS MARKET

(BY MANUFACTURING TECHNIQUE),

2017-2023

GLOBAL RADIATION HARDENED

ELECTRONICS MARKET

(BY COMPONENT TYPE)

GLOBAL RADIATION HARDENED

ELECTRONICS MARKET,

(BY END USER)

GLOBAL RADIATION HARDENED

ELECTRONICS MARKET

(BY REGION)

Market Drivers

Market Challenges

Market Opportunities

• Overview: Key Strategies and

Developments

Market Share Analysis

• Competitive Benchmarking Map

• Overview

• Comparison of Radiation

Hardened Products Standard

Requirements for End

Use

• Evolving Radiation Hardened

Electronics in NewSpace

Radiation Hardened Electronics

Manufacturers and Certifications

• Supply Chain Analysis

• Industry Attractiveness: Porter’s Five

Forces

• Assumptions and Limitations

Market Overview

• Rad-Hard by Design (RHBD)

• Rad-Hard by Process (RHBP)

• Rad-Hard by Software (RHBS)

• Microprocessors and Controllers

• Discrete Semiconductors

• Power Sources

• Memory

• Field-Programmable Gate Array

• Analog and Mixed Signals

• Sensors

• Application-Specific Integrated Circuit

• Others

• Space

• Military

• Nuclear Power Plants

• Others

Market Overview

• North America

• Europe

• Asia-Pacific

• Rest-of-the-World

SCOPE & RESEARCH

METHODOLOGY

• Research Scope

• Global Radiation

Hardened Electronics

Market Research

Methodology

COMPANY PROFILES

• Overview

• Analog Devices, Inc.

• BAE Systems

• Cobham plc.

• Data Device Corporation

• Honeywell International,

Inc.

• IBM

• Infineon Technologies,

Inc.

• Microchip Technology,

Inc.

• Micropac Industries, Inc.

• Renesas Electronics

Corporation

• Solid State Devices, Inc.

• STMicroelectronics N.V

• Texas Instruments Inc.

• The Boeing Company

• Xilinx Inc.

• Other Key companies

APPENDIX

• Related Reports

VIEW COMPLETE TABLE OF CONTENT

sales@bisresearch.com | www.bisresearch.com


List of Tables

1. Market Snapshot: Global Radiation Hardened

Electronics Market, 2017 and 2023

2. Impact Analysis of Market Drivers

3. Impact Analysis of Market Challenges

4. Impact Analysis of Market Opportunities

5. Satellite Launches, 2016-2018

6. Satellite Launches, 2017

7. Comparison between COTS and QML Rad-Hard

8. Product Launch

9. Acquisitions

10. Partnerships, Agreements, and Contracts in the

Radiation Hardened Electronics Market

11. Other Developments

12. End User Specifications

13. List of Certifications

14. Analysing Factors of Threat from New Entrants

15. Analysing Factors of Threat from Substitutes

16. Analysing Factors of Bargaining Power of Buyers

17. Analyzing Factors of Bargaining Power of Suppliers

18. Analysing Factors of Intensity of Competitive Rivalry

19. Global Radiation Hardened Electronics Market (by

Manufacturing Technique), 2017-2023

20. Global Radiation Hardened Electronics Market (by

Component Type), 2017-2023

21. Microprocessors and Controllers Market (by

Qualified Manufacturers List)

22. Discrete Semiconductor Market (by Qualified

Manufacturers List):

23. Power Sources Market (by Qualified Manufacturers

List):

24. Memory Market (by Qualified Manufacturers List):

25. Field-Programmable Gate Array (FPGAs) Market

(by Qualified Manufacturers):

26. Sensors Market (by Qualified Manufacturers):

27. Application-Specific Integrated Circuit (ASIC) Market

(by Qualified Manufacturers):

28. Global Radiation Hardened Electronics Market (by

End User) 2017-2023

29. Global Radiation Hardened Electronics Market (by

Space) 2017-2023

30. Global Radiation Hardened Electronics Market (by

Region), 2017-2023

31. North America Radiation Hardened Electronics

Market (by End User), 2017-2023

32. North America Radiation Hardened Electronics

Market (by Components), 2017-2023

33. North America Radiation Hardened Electronics

Market (by Manufacturing Technique), 2017-2023

34. Europe Radiation Hardened Electronics Market (by

End User), 2017-2023

35. Europe Radiation Hardened Electronics Market (by

Components), 2017-2023

36. Europe Radiation Hardened Electronics Market (by

Manufacturing Technique), 2017-2023

37. Asia-Pacific Radiation Hardened Electronics Market

(by End User), 2017-2023

38. Asia-Pacific Radiation Hardened Electronics Market

(by Components), 2017-2023

39. Asia-Pacific Radiation Hardened Electronics Market

(by Manufacturing Technique), 2017-2023

40. Rest of the World Radiation Hardened Electronics

Market (by Components), 2017-2023

41. Rest of the World Radiation Hardened Electronics

Market (by Manufacturing Technique), 2017-2023

42. Rest-of-the-World Radiation Hardened Electronics

Market (by End User) 2017-2023

sales@bisresearch.com | www.bisresearch.com


Table of Figures

1. Global Radiation Hardened Electronics Market

Snapshot

2. Global Radiation Hardened Electronics Market (by

Component Type), 2017 and 2023

3. Global Radiation Hardened Electronics Market (by

Manufacturing Technique), 2017 and 2023

4. Global Radiation Hardened Electronics Market (by

End User), 2017 and 2023

5. Global Radiation Hardened Electronics Market:

Global Scenario, 2017 and 2023

6. Market Dynamics Snapshot

7. Key Strategies Adopted by Market Players

8. Percentage Share of Strategies Adopted by the

Market Players, January 2015 - October 2018

9. Competitive Benchmarking, 2017

10. Market Share of Leading Players in Global Radiation

Hardened Electronics Market, 2017

11. Supply Chain Analysis

12. Radiation Hardened Electronics: Porter’s Five

Forces Analysis

13. Global Radiation Hardened Electronics Market,

2018-2023

14. Global Radiation Hardened Market (by

Manufacturing Technique)

15. Rad-Hard by Design, 2017 - 2023

16. Rad-Hard by Process, 2017 - 2023

17. Rad-Hard by Software, 2017 - 2023

18. Classification of Radiation Hardened Electronics

Market (by Component Type)

19. Global Radiation Hardened Electronics Market (by

Microprocessors and Controllers), 2017 - 2023

20. Global Radiation Hardened Electronics Market (by

Discrete Semiconductors), 2017 - 2023

21. Global Radiation Hardened Electronics Market (by

Power Sources), 2017 - 2023

22. Global Radiation Hardened Electronics Market (by

Memory), 2017-2023

23. Global Radiation Hardened Electronics Market (by

Field-Programmable Gate Array), 2017 - 2023

24. Global Radiation Hardened Electronics Market (by

Analog and Mixed Signals), 2017 - 2023

25. Global Radiation Hardened Electronics Market (by

Sensors), 2017 - 2023

26. Global Radiation Hardened Electronics Market (by

Application-Specific Integrated Circuit), 2017 - 2023

27. Global Radiation Hardened Electronics Market (by

Others), 2017-2023

28. Classification of Radiation Hardened Electronics

Market (by End User)

29. Global Radiation Hardened Electronics Market (by

Space), 2017 - 2023

30. Global Radiation Hardened Electronics Market (by

Military), 2017 - 2023

31. Global Radiation Hardened Electronics Market (by

Nuclear Power Plants), 2017-2023

32. Global Radiation Hardened Electronics Market (by

Others), 2017 - 2023

33. Classification of Radiation Hardened Electronics

Market (by Region)

34. Regional Distribution of the Global Radiation

Hardened Electronics Market, 2017 and 2023

35. North America Radiation Hardened Electronics

Market, 2017- 2023

36. The U.S. Radiation Hardened Electronics Market,

2017-2023

37. Canada Radiation Hardened Electronics Market,

2017 - 2023

38. Rest-of-North America Radiation Hardened

Electronics Market, 2017 - 2023

39. Europe Radiation Hardened Electronics Market,

2017 - 2023

40. The U.K. Radiation Hardened Electronics Market,

2017-2023

41. Germany Radiation Hardened Electronics Market,

2017 - 2023

42. France Radiation Hardened Electronics Market,

2017 - 2023

43. Russia Radiation Hardened Electronics Market,

2017 - 2023

44. Spain Radiation Hardened Electronics Market, 2017

- 2023

45. Rest-of-Europe Radiation Hardened Electronics

Market, 2017 - 2023

46. Asia-Pacific Radiation Hardened Electronics Market,

2017 - 2023

sales@bisresearch.com | www.bisresearch.com


Table of Figures

47. China Radiation Hardened Electronics Market, 2017

- 2023

48. Japan Radiation Hardened Electronics Market, 2017

- 2023

49. South Korea Radiation Hardened Electronics

Market, 2017 - 2023

50. Australia Radiation Hardened Electronics Market,

2017 - 2023

51. India Radiation Hardened Electronics Market, 2017

- 2023

52. Rest-of-Asia-Pacific Radiation Hardened Electronics

Market, 2017 - 2023

53. Rest-of-the-World Radiation Hardened Electronics

Market, 2017-2023

54. Brazil Radiation Hardened Electronics Market, 2017

- 2023

55. U.A.E. Radiation Hardened Electronics Market,

2017 - 2023

56. South Africa Radiation Hardened Electronics

Market, 2017 - 2023

57. Mexico Radiation Hardened Electronics Market,

2017 - 2023

58. Share of Key Companies

59. Analog Devices Inc.: Overall Financials, 2015-2017

60. Analog Devices Inc.: Business Revenue Mix, 2015-

2017

61. Analog Devices Inc.: Region Revenue Mix, 2015-

2017

62. SWOT Analysis - Analog Devices Inc.

63. BAE Systems: Overall Financials, 2015-2017

64. BAE Systems: Business Revenue Mix, 2015-2017

65. BAE Systems: Region Revenue Mix, 2015-2017

66. SWOT Analysis - BAE Systems

67. Cobham plc: Overall Financials, 2015-2017

68. Cobham plc: Business Revenue Mix, 2015-2017

69. Cobham plc: Region Revenue Mix, 2015-2017

70. SWOT Analysis - Cobham plc

71. SWOT Analysis - Data Device Corporation

72. Honeywell International Inc.: Overall Financials,

2015-2017

73. Honeywell International Inc.: Business Revenue

Mix, 2015-2017

74. Honeywell International Inc.: Region Revenue Mix,

2015-2017

75. SWOT Analysis - Honeywell International Inc.

76. IBM Corporation: Overall Financials, 2015-2017

77. IBM Corporation: Business Revenue Mix, 2015-

2017

78. IBM Corporation: Region Revenue Mix, 2015-2017

79. SWOT Analysis - IBM Corporation

80. Infineon Technologies Inc.: Overall Financials, 2015-

2017

81. Infineon Technologies Inc.: Business Revenue Mix,

2015-2017

82. Infineon Technologies Inc.: Region Revenue Mix,

2015-2017

83. SWOT Analysis - Infineon Technologies Inc.

84. Microchip Technology Inc.: Overall Financials, 2015-

2017

85. Microchip Technology Inc.: Business Revenue Mix,

2015-2017

86. Microchip Technology Inc.: Region Revenue Mix,

2015-2017

87. SWOT Analysis - Microchip Technology Inc.

88. SWOT Analysis - Micropac Industries Inc.

89. Renesas Electronics Corporation: Overall

Financials, 2015-2017

90. Renesas Electronics Corporation: Region Revenue

Mix, 2017

91. SWOT Analysis - Renesas Electronics Corporation

92. SWOT Analysis - Solid State Devices Inc.

93. STMicroelectronics N.V: Overall Financials, 2015-

2017

94. STMicroelectronics N.V: Business Revenue Mix,

2015-2017

95. STMicroelectronics N.V: Region Revenue Mix,

2015-2017

96. SWOT Analysis - STMicroelectronics NV

97. Texas Instruments Inc.: Overall Financials, 2015-

2017

98. Texas Instruments Inc.: Business Revenue Mix,

2015-2017

99. Texas Instruments Inc.: Region Revenue Mix, 2015-

2017

sales@bisresearch.com | www.bisresearch.com


Table of Figures

100. SWOT Analysis - Texas Instruments Inc.

101. The Boeing Company: Overall Financials, 2015-2017

102. The Boeing Company: Business Revenue Mix, 2015-2017

103. The Boeing Company: Region Revenue Mix, 2015-2017

104. SWOT Analysis - The Boeing Company

105. Xilinx Inc.: Overall Financials, 2016-2018

106. Business Revenue Mix, 2016-2018

107. Region Revenue Mix, 2016-2018

108. SWOT Analysis - Xilinx Inc.

109. Global Radiation Hardened Electronics Market Scope

110. Research Design and Flow

111. Top-Down and Bottom-up Approach

112. Radiation Hardened Electronics Market: Influencing Factors

113. Assumptions and Limitations

sales@bisresearch.com | www.bisresearch.com


Research Scope & BIS Methodology

1. Scope of the Report

This report is intended to be a comprehensive study of the global radiation hardened electronics market. The report

focuses profoundly on providing market information for radiation hardened electronics by covering different segments:

manufacturing, device type, end user, and region. In addition to this, the study focuses on the major driving forces,

challenges, and growth opportunities. The major players have been identified on the basis of their revenue generation,

regional presence, and company developments related to the radiation hardened electronics market. The details of

company profiles have been included in order to understand the strategic behaviors of the market players. The radiation

hardened electronics market is further explained and analyzed on the basis of region, which is categorized into four

regions namely: North America, Europe, Asia-Pacific, and Rest-of-the-World. Moreover, the country analysis has

also been done in order to have a clear picture of the radiation hardened electronics market. Regional developments

undertaken by governments and influencing manufacturers and are some of the factors based on which the growth rates

of the countries have been calculated.

2. Global Radiation Hardened Electronics Market Research

Methodology

The research methodology design adopted for this specific study includes a mix of data collected from the primary

and secondary sources. The report was developed by exhaustively using both the primary sources (in-house experts,

industry leaders and market players) and the secondary sources (a host of paid and unpaid databases) along with the

analytical tools to build forecast and predictive models.

Primary Data Sources

The primary sources involve experts from the radiation hardened electronics industry including the suppliers,

manufacturers, and distributors, among others. Primary resources, such as CEOs, vice presidents, marketing directors,

and technology & innovation directors, among others, have been interviewed to obtain and verify both qualitative and

quantitative aspects of this research study.

The research study includes interviews with various participants throughout the value chain. Besides, online surveys of

the participants have been conducted to understand the demand from the radiation hardened electronics manufacturers

and other stakeholders in the market. Insights of the experts who didn’t participate in discussions are gained based on

an extensive questionnaire. For cases, in which the market information was not available, Delphi method has been used

to arrive at a mutual consent with BIS consultants.

sales@bisresearch.com | www.bisresearch.com


Research Scope & BIS Methodology

The key data points taken from the Primary Sources include:

• Validation and triangulation of all the numbers and graphs

• Validation of reports segmentation and key qualitative findings

• Understanding the competitive landscape

• Current and proposed production values of a product by market players

• Understanding of market drivers and opportunities

• Validation of the numbers of markets size

• Percentage split of individual markets for regional analysis

Secondary Data Sources

The research study involves the usage of extensive secondary sources such as databases, company websites, and

annual reports, among others.

Data Triangulation

This research study involves the usage of extensive secondary sources, directories, company websites, and annual

reports. It also makes use of the databases such as Hoovers, Bloomberg, Business-Week, Factiva, and one-source, to

collect useful and effective information for an extensive, technical, market-oriented, and commercial study of the global

radiation hardened electronics market.

The process of market engineering involves the calculation of the market statistics, market size estimation, market

forecast, market crackdown, and data triangulation (the methodology for these quantitative data processes is explained

in the further sections). An extensive primary research study was undertaken to gather the information and authenticate

the critical numbers derived through segmentation types, industry trends, and the key players of each type of products

in the market.

sales@bisresearch.com | www.bisresearch.com


Research Scope & BIS Methodology

Figure 1: Data Triangulation

The following figure exhibits the key secondary data sources considered:

BIS Research Internal Repository

• Key Players

• Competitive Landscape

• Opportunities/Challenges

Market Size and Market Share

• Driving Factors

Market Estimates

• Geographical Analysis

Market Trends

INFORMATION SOURCED

Primary Sources

DATA

TRIANGULATION

Secondary Sources

Primary Sources

Secondary Sources

DEMAND SIDE

Interview With:

• Leading distributors of electronic components

• Top management from compaines across end-user

industries

SUPPLY SIDE

Interview With:

• Top management and institutions of radiation

hardend electronics providers which include

president, vice-president, scientist, maketing

director, sales manager and others key opinion

leaders

• Technology analysts

• Goverment and Regulatory Sources

• National Aeronautics and Space Administration

(NASA)

• U.K. Space Agency

• Indian Space Research Organisation (ISRO)

• Indian Electronics and Semiconductor Association

• Universities Space Research Association (USRA)

• Annulal Reports

• SEC Filings

• Incestor Presentations

• Websites and Press Releases of top players

• News Articles, Journals, and Paid Databases

REQUEST FOR SAMPLE

sales@bisresearch.com | www.bisresearch.com


BIS Research

39111 Paseo Padre PKWY STE 313,

Fremont CA 94538-1686,

Tel: +1-510-404-8135

Global Delivery Centre

Tapasya Corp Heights, Subarea,

Sector 126, Noida, NCR-201303 India

Tel: +91 120 4261540 / +91 120 4261544

To know more about us, please visit our website:

bisresearch.com

For other queries contact:

sales@bisresearch.com

sales@bisresearch.com

sales@bisresearch.com | www.bisresearch.com

www.bisresearch.com

More magazines by this user
Similar magazines