bersichtsflyer_Flüssigkeitskühlung_EN
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Our three cooling variants<br />
Our cooling variants<br />
Indirect cooling with heat sink:<br />
This version the heat sinks are integrated into the components<br />
and directly fixed to the heat sources in order to enable a<br />
higher degree of efficiency. This design is particularly efficient<br />
at higher power levels.<br />
Schematic diagram of indirect cooling<br />
Cooling block<br />
Winding<br />
Core<br />
Indirect cooling with coldplate:<br />
In this version a heat sink is attached externally to cool it. This<br />
is a more economical method for low power levels and smaller<br />
components.<br />
Schematic diagram of Coldplate<br />
Cooling block<br />
Winding<br />
Core<br />
Direct cooling with waveguides:<br />
In addition to it’s standard indirect cooling method REO now<br />
offers the direct cooling method, which enhances cooling<br />
efficiency even more. The direct cooling uses waveguides,<br />
which includes the conductive material as well as the cooling<br />
fluid (water/glycol). The use of this method provides optimal<br />
cooling.<br />
Schematic diagram of direct cooling<br />
Cooling liquid<br />
Conductive material
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