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3 13:20 13:30 13:40 13:50 14:00 WE3A: Planar Filters I Chi Wang, Orbital Sciences Corporation Kawthar Zaki, University of Maryland WE3A-03: Planar quintuple-Mode Resonator Bandpass Filters with Sharp Transition and Wide Stopband Y. Chiou, Y. Lee, J. Kuo, C. Chen National Chiao Tung University, Hsinchu, Taiwan WE3A-04: Rectangular Stubs in Microstrip or Stripline Using v-lines R. Levy R. Levy Associates, La Jolla, United States WE3B; Low Noise Devices and Circuits Phil Smith, BAE Systems Marian Pospieszalski, NRAO WE3C: Nonlinear Device Modeling Wayne Struble, Triquint Semiconductor Matthias Rudolph, Ferdinand-Braun-Institut (FBH) Room: A313 WE3C-01: Modeling Fast Switching Speed PIN Diodes for RF and Microwave Applications R. H. Caverly, A. M. Reif Villanova University, Villanova, United States Room: A311 Room: A312 WE3A-01: A Multi-Resolution Channel- WE3B-01: Low Noise Amplifier for 180 Select Filter with Ultra-Wide Frequency GHz Frequency Band Coverage P. Kangaslahti M. Koochakzadeh, A. Abbaspour-Tamijani Arizona State University, Tempe, United States 1 , D. Pukala1 , T. Gaier1 , W. Deal2 , X. Mei2 , R. Lai2 1Jet Propulsion Laboratory, Pasadena, United States, 1Northrop Grumman Corporation, Redondo Beach, United States WE3A-02: A Novel Compact Ultra- Wideband Bandpass Filter using Microstrip Stub-Loaded Dual-Mode Resonator Couples Z. Ma1 , W. He2 , C. Chen3 , Y. Kobayashi1 , T. Anada3 WE3B-02: q-band Low Noise Amplifiers Using a 0.15-_m MHEMT Process for Broadband Communication and Radio Astronomy Applications S. Weng 1Saitama University, Saitama, Japan, 2Shanghai University, Shanghai, China, 3Kanagawa University, Yokohama, Japan 1 , C. Lin1 , H. Chang1 , C. Chiong2 WE3C-02: A Nonlinear Electro-Thermal Model for High Power RF LDMOS Transistors D. Bridges, J. Wood, M. Guyonnet, P. H. Aaen Freescale Semiconductor Inc., Tempe, United 1National Central University, Jhongli, Taiwan, States 2Academia Sinica, Taipei, Taiwan WE3B-03: Experimental Cryogenic WE3C-03: A Scalable Compact Model for Modeling and Noise of SiGe HBTs III-v Heterojunction Bipolar Transistors J. C. Bardin, S. Weinreb S. R. Nedeljkovic, J. R. McMacken, J. M. California Institute of Technology, Pasadena, Gering, D. Halchin United States RFMD, Greensboro, United States 14:10 14:20 14:30 14:40 WEDnESDAY TECHnICAl SESSIonS 13:20-15:00 WE3A-05: New Differential PSL Coupled Resonator Filters S. F. Peik, F. Langner Bremen University of Applied Sciences, Bremen, Germany WE3B-04: Thermal Characterization of the Intrinsic Noise Parameters for AlGaN/GaN HEMTs M. Thorsell, K. Andersson, M. Fagerlind, M. Südow, P. Nilsson, N. Rorsman Chalmers University of Technology, Göteborg, Sweden WE3B-05: DC-to-40GHz MMIC Traveling Wave Power Splitter for Airborne Systems R. S. N’Gongo1 , 2 , K. Y. Varma2 , P. Ratna2 , V. Kirty2 1J&R Microwave Solutions Ltd., Toulouse, France, 2Astra Microelectronics Tech. Ltd., Hyderabad, India WE3C-04: Large-Signal Hybrid Compact/Behavioral HBT Model for III-v Technology Power Amplifiers T. S. Nielsen, S. Nedeljkovic, D. Halchin, RFMD Inc., Greensboro, United States WE3C-05: Limitations of Current Compact Transit-Time Models for III-v-Based HBTs M. Rudolph Ferdinand-Braun-Institut (FBH), Berlin, Germany
WEDnESDAY TECHnICAl SESSIonS 13:20-15:00 WE3D: RF-over-Fiber Links and Components Ronald Reano, Ohio State University Chris Scholz, LeCroy Room: A314 WE3D-01: Performance Evaluation of Multiband Radio-over-Fiber for WLAN, Gigabit Ethernet and UWB M. Yee, Y. Guo, V. Pham, L. Ong A-STAR, Singapore, Singapore WE3D-02: MultiGbit/s Transmission over a Fiber Optic mm-wave Link I. Gonzalez Insua, K. Kojucharow, C. G. Schäffer TU Dresden, Dresden, Germany WE3D-03: High-Power Modified Uni- Traveling Carrier Photodiode with > 50 dBm Third Order Intercept Point A. Beling, H. Pan, H. Chen, J. C. Campbell University of Virginia, Charlottesville, United States WE3D-04: Radio-Over-Fiber Systems for WLAN Based on CMOS-Compatible Si Avalanche Photodetectors H. Kang, M. Lee, W. Choi Yonsei University, Seoul, Republic of Korea WE3D-05: A Broadband High Dynamic Range Analog Photonic Link using Push- Pull Directly-Modulated Semiconductor Lasers D. A. Marpaung, C. G. Roeloffzen, W. C. van Etten University of Twente, Enschede, the Netherlands WE3E: Frequency-Domain Techniques Luca Perregrini, University of Pavia Adalbert Beyer, University of Duisburg-Essen Room: A315/316 WE3E-01: A Derived Circuit Model for Spiral Inductors on Lossy Silicon Substrate K. Yang1 , H. Hu1 , K. L. Wu1 , W. Y. Yin2 , J. F. Mao2 1The Chinese University of Hong Kong, Hong Kong, Hong Kong, 2Shanghai Jiao Tong University, Shanghai, China WE3E-02: Modeling of Losses in Substrate Integrated Waveguide by Boundary Integral-Resonant Mode Expansion Method M. Bozzi1 , L. Perregrini1 , K. Wu2 1 2 University of Pavia, Pavia, Italy, École Polytechnique de Montréal, Montréal, Canada WE3E-03: Electromagnetic Macro- Modeling of 3D High Density Trenched Silicon Capacitors for Wafer-Level- Packaging S. Wane1 , V. Mühlhaus2 , J. Rautio2 1 2 NXP-Semiconductors, Caen, France, Sonnet Software, Witten, Germany WE3E-04: A Novel Boundary Element Method with Surface Conductive Absorbers for 3-D Analysis of Nanophotonics L. Zhang, J. Lee, A. Farjadpour, J. K. White, S. G. Johnson Massachusetts Institute of Technology, Cambridge, United States WE3E-05: Sensitivity Analysis of S-parameters Including Port variations Using the Transfinite Element Method L. Vardapetyan, J. Manges, Z. Cendes Ansoft Corporation, Pittsburgh, United States 13:20 13:30 13:40 13:50 14:00 14:10 14:20 14:30 14:40 WEDnESDAY 33
Page 2 and 3: Sunday Monday Tuesday Wednesday Thu
Page 4 and 5: 4 On behalf of the 2008 Internation
Page 6 and 7: 6 The following events will also be
Page 8 and 9: 8 Advance Registration Please follo
Page 10 and 11: 0 on-site Registration On-site regi
Page 12 and 13: ATTEnDEE ACCoMMoDATIonS Number Hote
Page 14 and 15: 4 AboUT ATlAnTA Did You Know... Atl
Page 16 and 17: 6 MESSAGE FRoM THE IMS TECHnICAl PR
Page 18 and 19: 8 13:20 13:30 13:40 13:50 14:00 14:
Page 20 and 21: 0 TUESDAY 12:00-13:15 A305 COGNITIv
Page 22 and 23: 15:30 15:40 15:50 16:00 16:10 16:20
Page 24 and 25: 4 08:00 08:10 08:20 08:30 08:40 08:
Page 26 and 27: 6 WEDnESDAY InTERACTIVE FoRUM 09:30
Page 28 and 29: 8 10:10 10:20 10:30 10:40 10:50 11:
Page 30: 30 WEDNESDAY 12:00-13:15 A305 WIREL
Page 35 and 36: WEDnESDAY WEP2 — HAll A3 14:00-16
Page 37 and 38: WEDnESDAY TECHnICAl SESSIonS 15:30-
Page 39 and 40: THURSDAY TECHnICAl SESSIonS 08:00-0
Page 41 and 42: THURSDAY THP1 — HAll A3 09:30-11:
Page 45 and 46: 10:10-11:50 GWCC A402 TRANSITION: M
Page 49 and 50: THURSDAY THP2 — HAll A3 14:00-16:
Page 51: THURSDAY TECHnICAl SESSIonS 15:30-1
Page 55 and 56: Gerald DeJean Microsoft Focused/Spe
Page 57 and 58: Senior Advisors/Protocol Committee
Page 59 and 60: MTT-1 Computer Aided Design MTT-13
Page 61 and 62: The member grade of Fellow is confe
Page 63 and 64: SUnDAY- 17:30-19:00 • RFIC PlEnAR
Page 65 and 66: MonDAY TECHnICAl SESSIonS 13:20-17:
Page 67 and 68: TUESDAY TECHnICAl SESSIonS 13:20-17
Page 69 and 70: General Chair Jenshan Lin TPC Co-Ch
Page 71 and 72: Session 1 - 50 years of vNAs 08:00-
Page 73 and 74: market, research is gradually focus
Page 75 and 76: Nauta (University of Twente) 2 - Ci
Page 77 and 78: WSL — 08:00-17:00 On-Chip Calibra
Page 79 and 80: Systems in LTCC Technology, Prof. I
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WMD — 08:00-17:00 Millimeter-Wave
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2- Tunable technologies for agile m
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Workshop Abstract: The most recent
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WFA — 08:00-17:00 Unification of
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computationally-efficient interfaci
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LPKF Laser & Electronics M2 Global
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09:20 09:40 10:00 10:40 11:20 11:40
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HoSPITAlITY SUITE and RECREATIonAl
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