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UM is suitable for workpiece materials
with hardnesses greater than 40 HRC,
such as glass, graphite, sapphire, silicon,
quartz, ceramic composites and PCD.
Developed more than 50 years ago,
UM is a nonthermal, nonchemical and
nonelectrical process that:
n meets part tolerances as tight as
±0.001";
n can produce features from 0.008" to
several inches and aspect ratios as high
as 25:1, depending on the material type
and feature size; and
n machines a nearly limitless number
of microfeatures, including round,
square and odd-shaped through-holes,
cavities of varying depths, and other OD
and ID features.
UM is suitable for making micro-
machined and microstructured glass
wafers used to fabricate MEMS devices,
including pressure sensors, gyroscopes
and accelerometers, and implantable
sensors.
12 | MAY/JUNE 2012 | MICROmanufacturing
The growth potential for UM is outstanding,
according to Bullen’s Fote.
“The process is an enabling technology
and is an excellent fit to help device
manufacturers take full advantage of the
desirable properties of advanced materials
while reducing device size and, in
Bullen
Parts made
via ultrasonic
machining.
many cases, cost,” he said. µ
—Yesenia Salcedo
An animated video explaining how the
ultrasonic machining process works can
be found at www.bullentech.com/animation.—Ed.