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material do curso - LSI - USP

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MICROMACHINING TECHNIQUES<br />

Boron etch stop<br />

Deep boron diffusion<br />

– high temperature and time<br />

Lateral diffusion<br />

– “large”dimensions<br />

Strong crystal orientation<br />

dependence<br />

Plasma etching<br />

Low temperature process<br />

Better shape definition and<br />

thickness control<br />

– without lateral diffusion<br />

Quick process<br />

Low silicon crystalline orientation<br />

dependence

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