Programm ANSYS CONFERENCE & 28. CADFEM USERS' MEETING

Sponsoren / Sponsors
Premiumsponsoren
HP + Intel: Partners in High Performance Computing
To meet the ever-increasing simulation demands of the industrial manufacturing
sector, customers constantly require more power, accuracy and speed of
simulation tools. The Computer Aided Engineering industry is particularly focused
on these new challenges; challenges that can be addressed by an intelligent
converged infrastructure, integrating optimized hardware, software
and interconnect technologies. By working closely with ANSYS, HP and Intel
are able to deliver optimized simulation solutions on the Intel ® Xeon ® Processor
5600 Series or Intel ® Xeon ® Processor 7500 Series.
HP and Intel are recognized leaders in providing technical computing solutions
to meet the demands for Computer Aided Engineering. More information
on HP and Intel is available at:
www.intel.com/technology/business/hpc.htm
www.hp.com/go/cae
➔„Accelerating Innovation with ANSYS through an Intelligent,
Converged Infrastructure“
Jeremy Purches, HPC Engineering Segment Manager EMEA,
Hewlett-Packard Ltd., Bristol, United Kingdom
Stephan Gillich, Director HPC and Workstations EMEA,
Intel GmbH, Feldkirchen
Eröffnungsplenum, Mittwoch, 3. November 2010, 10:00 – 12:20 Uhr
Open Plenary Session on Wednesday, 10:00 – 12:20 h
Gold Sponsor
Microsoft High Performance Computing
in Computer Aided Engineering (CAE)
In manufacturing companies, HPC has evolved from being a cost center to
a strategic asset that is a key enabler of innovation. Microsoft is delivering a
new generation of tightly integrated HPC technology that closely interoperates
with existing enterprise HPC infrastructure, and facilitates seamless access
to compute resources without compromising the productivity of end users,
and system administrators.
Microsoft in close partnership with key advanced manufacturing and CAE
software providers, is delivering solution stacks that make the power of HPC
readily accessible to engineers and scientists in a manufacturing organization,
while ensuring they remain productive.
www.microsoft.com/hpc
➔„Technical Computing – Improving our Ability to Understand the World“
Bill Hilf, General Manager Technical Computing,
Microsoft Corp., Redmond, WA, USA
Abschlussplenum, Freitag, 5. November 2010, 13:00 – 14:15 Uhr
Closing Plenary Session on Friday, 13:00 – 14:15 h
■ Smart Simulation for Smart Products ■
Medienpartner
www.plm-it-business.de
CADFEM und ANSYS Germany bedanken sich herzlich bei
allen Sponsoren für die Unterstützung der Veranstaltung!
Besuchen Sie die Sponsoren in der Fachausstellung!
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Organisation