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In-situ Monitoring of AlGaN/GaN/AlN Growth Using LayTec EpiTT

In-situ Monitoring of AlGaN/GaN/AlN Growth Using LayTec EpiTT

In-situ Monitoring of AlGaN/GaN/AlN Growth Using LayTec EpiTT

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<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong><br />

<strong>Al<strong>GaN</strong></strong>/<strong>GaN</strong>/<strong>AlN</strong> <strong>Growth</strong> <strong>Growth</strong> <strong>Using</strong> <strong>Using</strong><br />

<strong>LayTec</strong> <strong>LayTec</strong> <strong>EpiTT</strong> <strong>EpiTT</strong><br />

Dongwon Yoo, Yoo,<br />

Jae-Hyun Jae Hyun Ryou,<br />

and Russell D. Dupuis<br />

School School <strong>of</strong> <strong>of</strong> Electrical Electrical and and Computer Computer Engineering<br />

Engineering<br />

Center Center for for Compound Compound Semiconductors<br />

Georgia Georgia <strong>In</strong>stitute <strong>In</strong>stitute <strong>of</strong> <strong>of</strong> Technology<br />

Technology<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


Thomas Thomas Swan Swan CCS CCS 7x2”” 7x2 MOCVD MOCVD Reactors: Reactors:<br />

Two Two III--Nitride III Nitride and and One One III--AsPSbN<br />

III AsPSbN System System<br />

�� MOCVD systems the in cleanroom <strong>of</strong> Georgia Tech CSS<br />

III--AsPSbN<br />

III AsPSbN MOCVD MOCVD System<br />

System<br />

III--Nitride III Nitride MOCVD MOCVD Systems Systems<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


Thomas Thomas Swan Swan MOCVD MOCVD Reactor Reactor and and<br />

<strong>EpiTT</strong> <strong>EpiTT</strong> Control/Monitor Systems Systems<br />

<strong>EpiTT</strong> control/monitor<br />

MOCVD control/monitor<br />

Swan Nitride MOCVD<br />

Reactor Control Systems<br />

<strong>LayTec</strong> <strong>EpiTT</strong> in--<strong>situ</strong> in <strong>situ</strong><br />

growth monitoring<br />

systems<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


Thomas Thomas Swan Swan CCS CCS 7x2”” 7x2 Nitride Nitride MOCVD MOCVD<br />

System System <strong>Growth</strong> <strong>Growth</strong> Chamber Chamber<br />

Close-Coupled Showerhead (CCS)<br />

<strong>LayTec</strong> <strong>EpiTT</strong><br />

Reflectance/Pyrometer<br />

Optical ports Pyrometer probes<br />

Flip-Lid: open for loading wafers Flip-Lid: closed for epitaxy<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


<strong>LayTec</strong> <strong>LayTec</strong> <strong>EpiTT</strong> <strong>EpiTT</strong> Optical Optical Reflectance Reflectance & & Emissivity--<br />

Emissivity<br />

Corrected Corrected Pyrometer; Pyrometer; Three--Channel Three Channel Pyrometer<br />

Pyrometer<br />

Optical pyrometer<br />

for temperature<br />

uniformity<br />

measurements for<br />

heater zone<br />

balancing<br />

<strong>EpiTT</strong> in--<strong>situ</strong> in <strong>situ</strong> wafer<br />

measurement for<br />

six outer wafers<br />

(in sync with wafer<br />

rotation)<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


<strong>EpiTT</strong> <strong>EpiTT</strong> for for <strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> and and Ex--<strong>situ</strong> Ex <strong>situ</strong> MOCVD MOCVD<br />

<strong>Growth</strong> <strong>Growth</strong> <strong>Monitoring</strong><br />

<strong>Monitoring</strong><br />

�� Emissivity-corrected Emissivity corrected temperature and optical reflectance<br />

�� <strong>Monitoring</strong> in sync with wafer rotation<br />

�� individual wafer monitoring on each pocket <strong>of</strong> susceptor<br />

�� Probing area adjustable (2” (2 sapphire and 10X10mm 2 <strong>GaN</strong> sub)<br />

�� <strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> monitoring<br />

�� Surface “actual actual” temperature between pockets and susceptors for same type<br />

<strong>of</strong> substrates<br />

�� Surface morphology from reflectance<br />

��Morphology Morphology evolution, recovery, and degradation on a selected layer layer<br />

or<br />

an overall structure<br />

�� Wafer bending from reflectance oscillation (damping)<br />

�� Approximate growth rate and etch-back etch back rate from reflectance oscillation<br />

period<br />

�� Etching back effect monitoring<br />

�� Ex--<strong>situ</strong> Ex <strong>situ</strong> monitoring<br />

�� <strong>Growth</strong> rate calculation based on simulation/fitting<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


Example Example Application: Application: UV UV Photodetector<br />

Device Device Structure Structure<br />

250 µm dia mesa<br />

SiO 2 sidewall<br />

passivation<br />

n-metal (Ti/Al)<br />

25 nm <strong>GaN</strong>:Mg p-contact layer<br />

Grading<br />

p-metal (Ni/Au)<br />

SiO 2<br />

10 nm ~45% <strong>Al<strong>GaN</strong></strong>:Mg<br />

150 nm ~45% <strong>Al<strong>GaN</strong></strong>:ud absorption layer<br />

Grading<br />

100 nm ~60% <strong>Al<strong>GaN</strong></strong>:Si+ n-contact layer<br />

700 nm ~60% <strong>Al<strong>GaN</strong></strong>:Si- template layer<br />

<strong>AlN</strong> buffer/nucleation layer<br />

both side polished c-plane sapphire<br />

UV Illumination<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


MOCVD MOCVD <strong>Growth</strong> <strong>Growth</strong> Conditions<br />

Conditions<br />

�� Reactor: Thomas Swan 7x2” 7x2<br />

�� Precursors<br />

��Metalorganics<br />

Metalorganics: : TMGa, TMAl, TM<strong>In</strong>, Cp 2Mg, Mg,<br />

��Hydrides: Hydrides: SiH 4, , and NH 3<br />

�� Carrier gas: UPH H 2 or N 2<br />

�� Pressure<br />

��50~600 50~600 Torr depending on the layer/structure grown<br />

�� Temperature<br />

��500~650 500~650 ° C for LT buffer growth<br />

��> > 1000 ° C for HT growth<br />

�� V/III ratio: low for <strong>Al<strong>GaN</strong></strong> and high for <strong>In</strong><strong>GaN</strong><br />

�� Substrates: Sapphire, <strong>GaN</strong>, and SiC<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Growth</strong> <strong>Growth</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong><br />

<strong>AlN</strong> <strong>AlN</strong> on on Sapphire Sapphire Substrates<br />

Substrates<br />

�� Surface morphology and <strong>EpiTT</strong> reflectance <strong>of</strong> <strong>AlN</strong> depending<br />

on growth condition<br />

�� Accurate in--<strong>situ</strong> in <strong>situ</strong> monitoring is critical for <strong>AlN</strong> growth<br />

0.25<br />

0.24<br />

0.23<br />

0.22<br />

0.21<br />

0.2<br />

0.19<br />

0.18<br />

0.17<br />

0.16<br />

0.15<br />

0.14<br />

0.13<br />

0.12<br />

0.11<br />

0.1<br />

0.09<br />

0.08<br />

0.07<br />

0.06<br />

LT <strong>AlN</strong><br />

HT <strong>AlN</strong><br />

0.05<br />

0 500 1000 1500 2000<br />

Time (sec)<br />

<strong>EpiTT</strong> reflectance change<br />

in relation to AFM<br />

surface morphology<br />

5x5 µm 2<br />

RMS rough = 12.6 nm<br />

5x5 µm 2<br />

RMS rough = 0.4 nm<br />

0.25<br />

0.24<br />

0.23<br />

0.22<br />

0.21<br />

HT <strong>AlN</strong><br />

0.2<br />

0.19<br />

0.18<br />

0.17<br />

0.16<br />

0.15<br />

0.14<br />

0.13<br />

0.12<br />

0.11<br />

0.1<br />

0.09<br />

0.08<br />

0.07<br />

0.06<br />

0.05<br />

LT <strong>AlN</strong><br />

0 500 1000 1500 2000<br />

Time (sec)<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group<br />

Temperature


<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong> <strong>Growth</strong> <strong>Growth</strong> Rate Rate and and<br />

Etching--Back Etching Back Rate Rate<br />

�� <strong>Growth</strong> vs. etch back depending on TMGa and NH 3 flow rate<br />

<strong>EpiTT</strong> temperature (C)<br />

1100<br />

1090<br />

1080<br />

1070<br />

1060<br />

1050<br />

1040<br />

1030<br />

1020<br />

1010<br />

TMGa<br />

60scc<br />

Rg=<br />

0.795nm/s<br />

TMGa<br />

45scc<br />

1-0415-1 <strong>GaN</strong> growth rate & desorption rate 100Torr<br />

TMGa<br />

30scc<br />

<strong>Growth</strong><br />

Rg= Rg=<br />

0.55nm/s 0.367nm/s<br />

TMGa<br />

10sccm<br />

Rg=0.045nm/s<br />

NH3=5L<br />

etching back<br />

Dg=<br />

0.083nm/<br />

s<br />

NH3=3L<br />

Dg=<br />

0.096nm/<br />

s<br />

1000<br />

0 2000 4000 6000<br />

Time(S)<br />

8000 10000 12000<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group<br />

NH3=1L<br />

Dg=0.15nm/s<br />

0.3<br />

0.25<br />

0.2<br />

0.15<br />

0.1<br />

0.05<br />

0<br />

Reflectance<br />

PyroTemp<br />

DetReflec<br />

Oscillation deflection


<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Growth</strong> <strong>Growth</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong><br />

<strong>Al<strong>GaN</strong></strong>/<strong>AlN</strong> <strong>Al<strong>GaN</strong></strong>/<strong>AlN</strong> on on <strong>AlN</strong>/Sapphire Template Template<br />

�� Al<br />

Al0.5Ga 0.5Ga0.5<br />

1200<br />

1100<br />

1000<br />

900<br />

800<br />

700<br />

600<br />

500<br />

400<br />

0.5N/<strong>AlN</strong> N/<strong>AlN</strong> re-growth re growth on <strong>AlN</strong> template<br />

PyroTemp<br />

DetReflec<br />

<strong>AlN</strong> template<br />

during heat-up<br />

<strong>AlN</strong> <strong>Al<strong>GaN</strong></strong><br />

0 1000 2000 3000 4000 5000 6000<br />

0<br />

7000<br />

Time (sec)<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group<br />

0.18<br />

0.16<br />

0.14<br />

0.12<br />

0.1<br />

0.08<br />

0.06<br />

0.04<br />

0.02


<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Growth</strong> <strong>Growth</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong> Al Al0.3<br />

0.3Ga Ga0.7 0.7N/<strong>GaN</strong> N/<strong>GaN</strong> on on<br />

Bulk Bulk <strong>GaN</strong> <strong>GaN</strong> Substrate Substrate and and <strong>GaN</strong>/Sapphire Template Template<br />

�� Reflectance comparison between substrates<br />

��Oscillation Oscillation behavior difference Single<br />

1200<br />

1100<br />

1000<br />

900<br />

800<br />

700<br />

600<br />

500<br />

<strong>Al<strong>GaN</strong></strong> on Bulk <strong>GaN</strong> vs. <strong>Al<strong>GaN</strong></strong> on <strong>GaN</strong>/Sapphire<br />

<strong>GaN</strong> <strong>Al<strong>GaN</strong></strong><br />

Temp on bulk <strong>GaN</strong><br />

Temp on Sapphire<br />

Reflec on bulk <strong>GaN</strong><br />

Reflec on Sapphire<br />

400<br />

0.05<br />

0 1000 2000 3000 4000 5000 6000 7000<br />

Time (sec)<br />

Substrate<br />

<strong>GaN</strong> on<br />

Sapphire<br />

50 mm dia. dia<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group<br />

0.25<br />

0.2<br />

0.15<br />

0.1<br />

Single-side side polished<br />

<strong>GaN</strong> sub not supporting<br />

cavity mode for<br />

reflectance oscillation<br />

Substrate<br />

Bulk <strong>GaN</strong><br />

15 x 15 mm<br />

<strong>EpiTT</strong> probing area adjusted<br />

for different substrate size<br />

<strong>GaN</strong> and <strong>Al<strong>GaN</strong></strong> on sapphire substrate <strong>Al<strong>GaN</strong></strong> on <strong>GaN</strong>/bulk <strong>GaN</strong> substrate<br />

<strong>GaN</strong>/bulk <strong>GaN</strong> substrate (no reflectance oscillation)<br />

oscillation (weak reflectance oscillation)


<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Growth</strong> <strong>Growth</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong><br />

<strong>GaN</strong> <strong>GaN</strong> on on <strong>AlN</strong>/ <strong>AlN</strong>/6H<br />

6H--SiC SiC<br />

�� <strong>GaN</strong> on SiC substrate using conventional insulating <strong>AlN</strong> buffer<br />

��<strong>AlN</strong> <strong>AlN</strong> buffer layer thickness and <strong>GaN</strong> morphology evolution<br />

��Wafer Wafer bending effect for thick <strong>GaN</strong> growth<br />

<strong>GaN</strong> on <strong>AlN</strong>/6H-SiC substrate<br />

PyroTemp<br />

DetReflec<br />

<strong>AlN</strong> <strong>GaN</strong><br />

0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 11000 12000<br />

0<br />

13000<br />

Time (sec)<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group<br />

0.16<br />

0.14<br />

0.12<br />

0.1<br />

0.08<br />

0.06<br />

0.04<br />

0.02


<strong>In</strong>--<strong>situ</strong> <strong>In</strong> <strong>situ</strong> <strong>Growth</strong> <strong>Growth</strong> <strong>Monitoring</strong> <strong>Monitoring</strong> <strong>of</strong> <strong>of</strong><br />

<strong>GaN</strong> <strong>GaN</strong> on on n--<strong>Al<strong>GaN</strong></strong>:Si/n<br />

n <strong>Al<strong>GaN</strong></strong>:Si/n--6H 6H--SiC SiC<br />

�� <strong>GaN</strong> on SiC using conducting nn-<strong>Al<strong>GaN</strong></strong>:Si <strong>Al<strong>GaN</strong></strong>:Si (Al~0.1) buffer<br />

layer for vertical device geometry<br />

��<strong>Al<strong>GaN</strong></strong> <strong>Al<strong>GaN</strong></strong> and <strong>GaN</strong> morphology evolution: in--<strong>situ</strong> in <strong>situ</strong> monitoring<br />

helpful for growth condition optimization<br />

1100<br />

1000<br />

900<br />

800<br />

700<br />

600<br />

500<br />

PyroTemp<br />

<strong>GaN</strong> on <strong>Al<strong>GaN</strong></strong>:Si/6H-SiC substrate<br />

<strong>Al<strong>GaN</strong></strong> grading <strong>GaN</strong><br />

DetReflec<br />

400<br />

0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 11000 12000 1300<br />

Time (sec)<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group


Summary Summary<br />

�� We have used the Laytec <strong>EpiTT</strong> to monitor the growth <strong>of</strong> a<br />

variety <strong>of</strong> III-N III N structures on SiC, <strong>GaN</strong>, <strong>AlN</strong>, and sapphire<br />

substrates<br />

�� <strong>Monitoring</strong> in real time permits a rapid evaluation <strong>of</strong> growth<br />

conditions<br />

�� Homoepitaxial growth on <strong>GaN</strong> and <strong>AlN</strong> substrates does not<br />

produce significant oscillations (as expected)<br />

Center Center Center Center for for for for Compound Compound Compound Compound Semiconductors Semiconductors Semiconductors<br />

Semiconductors / / Advanced Advanced Materials Materials and and Devices Devices Group<br />

Group

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