Annual Report 2010 - About Heraeus
Annual Report 2010 - About Heraeus
Annual Report 2010 - About Heraeus
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Materials and Technologies Business Group –<br />
<strong>Heraeus</strong> Materials Technology<br />
The materials and technologies business group (<strong>Heraeus</strong> Materials Technology) develops and manufactures high-tech industrial<br />
products using precious metals, such as gold, silver, and platinum-group metals, as well as high-melting-point, nonprecious<br />
refractory metals. Based on a broad portfolio of technologies and deep added value, <strong>Heraeus</strong> Materials Technology<br />
is a skilled partner for processing these precious metals and other innovative materials. As a technology leader with decades<br />
of experience and facilities around the world, this business group is a leading provider in many key markets.<br />
BUSINESS DEVElOPMENT<br />
Owing to significantly higher market demand, product revenues<br />
adjusted for precious metal price effects rose by<br />
40.1% over the previous year’s level. The strong demand<br />
combined with high prices throughout the year for industrial<br />
metals boosted product revenue by 53.4% to<br />
€1,501.2 million. Overall, <strong>Heraeus</strong> Materials Technology<br />
achieved record revenues, far surpassing any corresponding<br />
period.<br />
CONTaCT MaTERIalS<br />
The Contact Materials Division, hard hit by the crisis in<br />
the key semiconductor and automotive industries during<br />
2009, profited to an equal degree from their recovery in<br />
<strong>2010</strong>. In addition to taking advantage of the strong upswing<br />
in these key markets, the division benefited from<br />
the realignment of businesses as well as from consolidation<br />
measures implemented at its locations during the<br />
economic crisis.<br />
The bonding wire business stood out with strong growth,<br />
further expanding its market position. The division profited<br />
from the trend toward copper bonding wires and the<br />
solid expertise in these technologies gained through<br />
the 2008 acquisition of the bonding wire business from<br />
Kulicke & Soffa Industries, Inc.<br />
The assembly materials segment achieved satisfactory<br />
earnings through a variety of activities and measures.<br />
The acquisition of the Microbond business from Umicore<br />
S.A., Belgium, in 2009 contributed significantly to this<br />
result. Pioneering projects – such as the start of production<br />
for ultra-fine solder spheres and the successful conclusion<br />
of a contract with a solder paste manufacturer for<br />
delivery of solder powders – support the expansion of<br />
business and further growth in the future.<br />
<strong>2010</strong><br />
2009<br />
PRODUCT REVENUE<br />
in € million<br />
ENGINEERED MaTERIalS<br />
978.3<br />
1,501.2<br />
The Engineered Materials Division likewise did very good<br />
business in <strong>2010</strong>. This can be attributed both to strong<br />
demand for contact materials from the automotive industry<br />
and to gratifying developments in other markets.<br />
Faced with the need to react promptly to extremely<br />
short lead times, especially in the automobile and lighting<br />
industries, the division rose to the challenge of<br />
swiftly rebuilding personnel capacities that had been significantly<br />
trimmed in 2009.<br />
Business is expected to expand in the coming years with<br />
more new applications for flexible substrates and other<br />
materials.<br />
ThIN FIlM MaTERIalS<br />
Restructuring measures introduced in 2009 and continued<br />
in <strong>2010</strong> to support technology changes helped to<br />
boost performance within the magnetic data storage segment<br />
and throughout the Thin Film Materials Division.<br />
With new manufacturing technologies in mind, facilities<br />
in Singapore and Chandler, USA, steadily pursued the<br />
process improvements initiated in 2009. This made it<br />
possible to significantly improve and strengthen the<br />
technological situation for platinum oxide sputtering<br />
targets.<br />
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