PCB Thermal Simulation - RTP Designers Council
PCB Thermal Simulation - RTP Designers Council
PCB Thermal Simulation - RTP Designers Council
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16<br />
Simplest of 3D representations<br />
Heatsinking soon became a<br />
common cooling method<br />
From a simulation<br />
perspective this forced a 3D<br />
representation of the board<br />
and components<br />
Simple block representations<br />
of board and components<br />
— With power uniformly<br />
dissipated in the component<br />
blocks<br />
What value to use for<br />
thermal conductivity?<br />
— Indicative of case<br />
temperature… in most cases<br />
The Question<br />
What is a good value of thermal conductivity to use in<br />
FLOTHERM simulations for printed circuit boards (<strong>PCB</strong>s)<br />
and components if you have no real data?<br />
The Short Answer<br />
10 watt/m/C.<br />
[Tony Kordyban, 3 rd International Flotherm user<br />
conference , 1993]<br />
© 2010 Mentor Graphics Corp. Company Confidential<br />
www.mentor.com
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