PCB Thermal Simulation - RTP Designers Council

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30 Application Example: JCI PCB FloTHERM PCB Top Side FloTHERM PCB Bottom Side Board provided by JCI Automotive Group, MI Dashboard PCB tested in 26ºC still air environment Total power dissipation = 9 W Analysis done using FloTHERM © 2010 Mentor Graphics Corp. Company Confidential www.mentor.com
31 Application Example: JCI PCB Bottom trace before discretization Bottom trace after discretization Trace 4 before discretization Trace 4 after discretization PCB contains 6 copper layers — Each layer becomes a pixelized representation of the thermal conductivity based on the Copper distribution — Each pixel is assigned a value for kx, ky, and kz as determined by image processing and becomes a layer patch — A similar approach is used for the via representation © 2010 Mentor Graphics Corp. Company Confidential www.mentor.com
Page 1 and 2: PCB Thermal Simulation - The State
Page 3 and 4: 3 About the Mentor Graphics Mechani
Page 5 and 6: 7 Typical Design Constraints Opera
Page 7 and 8: 9 Causes of Electronic Failure Num
Page 9 and 10: 11 Heat Transfer 101 Heat transfer
Page 11 and 12: 13 The Thermal Budget A useful des
Page 13 and 14: 15 In the beginning… 20 years ag
Page 15 and 16: 17 The grail of T j and T c modelin
Page 17 and 18: 19 From source to ambient: Modeling
Page 19 and 20: 21 The fully lumped approximation
Page 21 and 22: 23 The fully lumped approximation
Page 23 and 24: 25 Discrete layer representation N
Page 25 and 26: 27 Full Metallic Distribution Repre
Page 27: 29 Full Metallic Distribution Repre
Page 31 and 32: 33 Application Example: JCI PCB Re
Page 33 and 34: 35 A final word on Accuracy “How
Page 35: 37 www. mentor. com © 2010 Mentor

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