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PCB Thermal Simulation - RTP Designers Council

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26<br />

Full metallic distribution representation<br />

Current simulation<br />

state of the art is a<br />

representation of the<br />

change in thermal<br />

resistances in X, Y<br />

and Z directions<br />

To achieve this a<br />

detailed description<br />

of the distribution of<br />

Cu in both metallic<br />

and dielectric layers<br />

is required<br />

— Necessitating import<br />

of layer artwork<br />

descriptions from<br />

EDA tools into the<br />

simulation tool<br />

© 2010 Mentor Graphics Corp. Company Confidential<br />

www.mentor.com

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