PCB Thermal Simulation - RTP Designers Council
PCB Thermal Simulation - RTP Designers Council
PCB Thermal Simulation - RTP Designers Council
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26<br />
Full metallic distribution representation<br />
Current simulation<br />
state of the art is a<br />
representation of the<br />
change in thermal<br />
resistances in X, Y<br />
and Z directions<br />
To achieve this a<br />
detailed description<br />
of the distribution of<br />
Cu in both metallic<br />
and dielectric layers<br />
is required<br />
— Necessitating import<br />
of layer artwork<br />
descriptions from<br />
EDA tools into the<br />
simulation tool<br />
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