CAD DFM Guidelines.cdr
CAD DFM Guidelines.cdr
CAD DFM Guidelines.cdr
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Encroachment of Solder Mask onto Via<br />
Secondary Side<br />
VIA<br />
3 mils<br />
(to keep via clear)<br />
(2.5 mils = Advanced)<br />
4 mils<br />
(minimum thickness for<br />
solder mask to remain intact)<br />
PAD<br />
2 mils<br />
(to prevent mask from<br />
encroaching onto pad)<br />
The distance between pad and via must be at least 25 mils to prevent bridging. The secondary side<br />
has the possibility of going through the wave so has a much greater restriction than the primary side<br />
(which will be reflowed).<br />
Bad Idea<br />
Placing a via in between pads of a component increases the chance of a solder bridge between the pad<br />
and via. Because the bridge will be hidden under the component after assembly, it could be difficult to<br />
inspect, find, and correct.<br />
PCB<br />
4
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