i.MX31 and i.MX31L Multimedia Applications - Freescale ...

Multimedia Applications Processors
i.MX31 and i.MX31L
Multimedia Applications
Overview
Accelerate your power-hungry mobile
applications with Freescale Semiconductor’s
i.MX31 or i.MX31L multimedia applications
processors. The i.MX31 and i.MX31L
processors unplug multimedia, driving video
and graphics to 30 fps of VGA quality, with
power to spare to perform other tasks
simultaneously. Based on the ARM1136JF-S
core, Freescale’s multimedia applications
processors, starting at 532 MHz, with
a vector floating point co-processor and
L2 cache, are designed for wireless devices
running computationally intensive multimedia
applications such as digital video broadcast
and videoconferencing. Target devices include
feature-rich smartphones, digital video
recorders, digital cameras, mobile gaming
consoles, mobile multimedia players and
many other mobile wireless applications.
Benefits
Image Processing Unit
Freescale’s i.MX31 and i.MX31L multimedia
applications processors have a built-in IPU that
includes the functionality required for image
processing and display management, including
deblock, de-ring, color space conversion,
independent horizontal and vertical resizing,
blending of graphics and video planes and
rotation in parallel to video decoding. The IPU
accelerates loop deblocking for H.264 decode
as well as encode. It provides acceleration of
image processing to deliver up to 30 fps of
VGA video quality.
Graphics Processing Unit
Freescale’s i.MX31 processor delivers an
integrated 3-D Graphics Processing Unit (GPU)
that provides an incredible 1 MTri/sec (double
textured, bi-linear, Gouraud shaded) at about
100 Mpix/s (effective). It offers full-scene
anti-aliasing for superior image quality and
provides OpenGL ® ES and Java Mobile
3-D support.
Security Features
Freescale’s i.MX31 and i.MX31L incorporate
Freescale’s platform independent security
architecture, a combination of security features
that provides a high level of confidence for
carriers, content providers and consumers.
The i.MX31 security architecture is a blended
hardware/software solution. The i.MX31
processors feature electronically blown fuses
that enable design engineers to hardwire their
device IDs, security codes and other data into
the i.MX31 processor e-fuse box.
Power Management
Freescale’s i.MX31 and i.MX31L are built using
Freescale’s Smart Speed technology with
some powerful enhancements. Our dynamic
process temperature compensation (DPTC)
mechanism measures reference circuits’
delays dependent on the process speed and
temperature, then lowers the voltage to the
minimum level needed to support the current
operating frequency. Automatic dynamic
voltage frequency scaling (DVFS) allows
on-the-fly frequency adjustment according
to the current performance requirements
of the system. The automatic DVFS hardware
mechanism monitors the processor load
and controls the supply voltage and the
frequency with minimal software and
operating system involvement.
Alliance Member
Working together, Spansion and Freescale
are delivering Package on Package (PoP)
solutions that vertically combine discrete
Spansion ® Flash memory with Freescale
application processors in a single package.
The offering satisfies the needs of wireless
devices running computationally intensive
multimedia applications such as digital video
broadcast and videoconferencing. The PoP
solutions have been specifically designed to
work with Freescale’s i.MX31 and i.MX31L
multimedia applications processors to deliver
high-end multimedia capabilities, such as
video and graphics. These applications can
run at up to VGA 30 fps quality and still have
enough power available to perform other
tasks simultaneously. Target devices include
feature-rich smart-phones, digital video
recorders, mobile gaming consoles and
many other wireless mobile applications.
Spansion solutions are compatible with
pervasive reference designs, supported by
system-level FFS software, benchmarking
and qualified products currently in
use by some of the top OEMs in the cellular
arena. The i.MX31 solution is enhanced by
using high-end memory subsystems enabled
via the PoP technology from Spansion.
The 512Mb NOR, 512Mb DDR DRAM and
512Mb MirrorBit ® ORNAND memory
solution is housed in the standard 15x15mm
PoP package. For details on this and other
solutions, please contact your local Spansion
sales representative.
Learn More:
For current information about Freescale
products, please visit www.freescale.com.
You can also find more information about Fast
Track, Freescale’s online support services
center, at www.freescale.com/fasttrack.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names
are the property of their respective owners. This product incorporates SuperFlash ® technology licensed from SST.
© Freescale Semiconductor, Inc. 2007
Document Number: SPANSIONIMX31FS
REV 1

Package-on-Package technology
Integrating Memory and Logic
Building Blocks to Meet
AdvAnced RequiReMents
MEMORY
ARCHITECTURE
NOR
FLASH
MIRRORBIT ®
ORNAND
FLASH DRAM pSRAM PoP AVAILABILITY
Spansion’s Package-on-Package (PoP) technology
enables advanced system integration for portable
products. With PoP-enabled Flash memory from
Spansion, customers can vertically combine discrete
logic and memory packages for board space savings,
lower pin-count, simplified system integration
and enhanced performance. As a result, handset
manufacturers can accommodate the growing demand
for advanced features in their wireless devices without
having to increase their size and weight.
incReAse PeRfoRMAnce while sAving
sPAce And siMPlifying integRAtion
Spansion ® PoP technology enables customers to create
flexible memory subsystems for integration into portable
applications and products. The benefits of PoP include:
systems cost savings:
• Reduction in PCB space: pack more and more
memory into the same form factor
• Lower pin count and PCB routing simplification
flexible system integration:
• Digital BB, Application Processors, WLAN, other
logic combined with flexible memory
• Scalable platforms: top memories can be swapped
easily to support both low and high-end phones
improved system performance:
• Aligned with new trends in wireless chipsets:
increased usage of high performance memory
• Enhanced speed, smaller propagation delay,
shorter trace lengths, less capacitance
NOR + pSRAM 64Mb – – 16Mb 12x12mm Now
512Mb – – 128Mb 12x12mm Planning
NOR +DRAM 512Mb – 1Gb – 15x15mm Planning
512Mb – 1Gb – 15x15mm Planning
512Mb – 768Mb – 14x14mm Now
512Mb – 256Mb – 12x12mm Planning
256Mb – 128Mb – 15x15mm Planning
1Gb – 1Gb – 15x15mm Planning
NOR + pSRAM
+ ORNAND 512Mb 512Mb – 256Mb 12x12mm Planning
NOR + DRAM 512Mb 512Mb 512Mb – 15x15mm Now
+ ORNAND 512Mb 1Gb 512Mb – 15x15mm Now
ORNAND – 1Gb 512Mb – 15x15mm Planning
+ DRAM – 1Gb 512Mb – – 15x15mm Planning
– 2Gb 1Gb – 15x15mm Planning
DRAM Type SDR DDR
stAndARd Jedec inteRfAces foR PoP
BUS 1: NOR/xRAM/NAND
BUS 2: NONE
BUS 1: NOR/NAND
BUS 2: DRAM
BUS 1: NOR/psRAM
BUS 2: DRAM
custoM solutions
Spansion also works with Processor vendors and
customers to deliver customized PoP solutions to meet
your application requirements.
12x12mm PoP 128-ball
11x11mm PoP 112-ball
NOR: burst/page
RAM: pSRAM or DRAM
ORNAND: x8 or x16
15x15mm PoP 160-ball
16x16mm PoP 176-ball
NOR: burst/page
DRAM: SDR/DDR & x16/x32
ORNAND: x8 or x16
14x14mm PoP 152-ball
14x14mm PoP 200-ball
NOR: burst/page
DRAM: SDR/DDR & x32
pSRAM: x16 burst
SPANSION
915 Deguigne Drive
PO Box 3453
Sunnyvale, CA 94088-3453, USA
Tel 408-962-2500
1-866-SPANSION
SPANSION EMEA
7, Avenue Georges Pompidou
92593 Levallois-Perret
Cedex, France
Tel +33 147 482-284
Fax +33 147 482-554
SPANSION JAPAN
Cube Kawasaki, 1-14 Nisshin-Cho,
Kawasaki-ku, Kawasaki-shi
Kanagawa, Japan
Tel +8144 223-1700
Fax +81 44 223-1800
© 2007 Spansion LLC. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof, are trademarks of Spansion LLC.
Other names used are for informational purposes only and may be trademarks of their respective owners.