8 Layer Board
8 Layer Board
8 Layer Board
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Guideline BGA (1)<br />
Solder Ball Pitch<br />
Design Parameters 1.50 1.27 1.0 0.80 0.65 0.50<br />
Solder Ball Diameter 0.75 0.75 0.60 0.50 0.40 0.30<br />
Solder Pad Diameter 0.50 0.50 0.40 0.35 0.30 0.25<br />
PTH Diameter 0.30 0.30 0.20 0.20 0.20 0.15<br />
PTH Pad Diameter 0.50 0.50 0.40 0.40 0.40 0.25<br />
Line Width (1 Line/Channel) 0.30 0.25 0.20 0.125 0.075 0.075<br />
Line Width (2 Line/Channel) 0.20 0.15 0.12 0.075 0.050 0.050<br />
Component Type Stencil Foil Aperture Size <strong>Board</strong> Pad<br />
PQFP 0.15 1.75 x 0.23 1.80 x 0.27<br />
CBGA 0.20 0.79 round 0.71 round<br />
TBGA 0.18 0.81 round 0.66 round<br />
PBGA 0.20 0.79 round 0.71 round<br />
CSP 0.13 0.36 round 0.30 round
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