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Low Pressure Chemical Vapor Deposition Dr. Lynn Fuller Bruce ...

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LPCVD Recipes<br />

4” LPCVD POLYSILICON FOR CMOS<br />

Polysilicon <strong>Deposition</strong>:<br />

Temperature = 610 °C<br />

<strong>Pressure</strong> = 300 mTorr<br />

Gas = Silane (SiH4)<br />

Flow = 90 sccm<br />

Rate = 77 Å/min<br />

SiH4 = Si + 2H2<br />

Fronts<br />

device wafers<br />

every other slot<br />

Rochester Institute of Technology<br />

Microelectronic Engineering<br />

5 fillers every<br />

other slot<br />

1 filler<br />

at end<br />

© November 26, 2013 <strong>Dr</strong>. <strong>Lynn</strong> <strong>Fuller</strong> Page 16

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