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Low Pressure Chemical Vapor Deposition Dr. Lynn Fuller Bruce ...

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LPCVD Recipes<br />

6” LTO RECIPE<br />

<strong>Low</strong> Temperature Silicon Oxide:<br />

Temperature = 400 °C SiH4 + O2 = SiO2 + 2H2<br />

<strong>Pressure</strong> = 250 mTorr<br />

Silane (SiH4)<br />

Flow = 40 sccm<br />

Oxygen (O2)<br />

Flow 48 sccm<br />

Rate = 70 Å/min +/- 10 Å/min<br />

7-26-00 LTO @425 °C gave deposition rate of 113 Å/min<br />

Rochester Institute of Technology<br />

Microelectronic Engineering<br />

© November 26, 2013 <strong>Dr</strong>. <strong>Lynn</strong> <strong>Fuller</strong> Page 24

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