18.04.2014 Views

Silicon Detectors - HEPHY

Silicon Detectors - HEPHY

Silicon Detectors - HEPHY

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

6.3 The CMS Inner Tracker
<br />

The pixel detector - construction!<br />

Hybrid Pixel Technology: 
<br />

Readout chips (ROCs) bump bonded to high resistivity silicon sensor!<br />

Barrel Pixel sensor wafer:! Bump bonds:!<br />

Thickness 270 µm
<br />

n + -pixels in n-bulk with 
<br />

p-spray (CIS) or p-stop (SINTEF) 
<br />


<br />

!<br />

Bump bonding process
<br />

Barrel: Indium, In-house at PSI
<br />

Forward: PbSn at two vendors (RTI, IZM)
<br />

!<br />

M. Krammer, Praktikum 2010/11! <strong>Silicon</strong> <strong>Detectors</strong>! 50!

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!