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6.3 The CMS Inner Tracker <br />
The pixel detector - construction!<br />
Hybrid Pixel Technology: <br />
Readout chips (ROCs) bump bonded to high resistivity silicon sensor!<br />
Barrel Pixel sensor wafer:! Bump bonds:!<br />
Thickness 270 µm <br />
n + -pixels in n-bulk with <br />
p-spray (CIS) or p-stop (SINTEF) <br />
<br />
!<br />
Bump bonding process <br />
Barrel: Indium, In-house at PSI <br />
Forward: PbSn at two vendors (RTI, IZM) <br />
!<br />
M. Krammer, Praktikum 2010/11! <strong>Silicon</strong> <strong>Detectors</strong>! 50!