Embedded EEPROM Specification - picmg
Embedded EEPROM Specification - picmg
Embedded EEPROM Specification - picmg
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6.7 System Enclosure or Chassis Descriptor Block<br />
typedef struct EeePChassisInfo_s{<br />
SmbiosHdrDBlck_t SDBHdr; /* 0x00 Smbios Dynamic Block Header */<br />
uint8_t Manufacturer ; /* 0x06 Number of ASCIIZ String */<br />
uint8_t Type ; /* 0x07 ENUM */<br />
uint8_t Version ; /* 0x08 Number of ASCIIZ String */<br />
uint8_t SerialNumber ; /* 0x09 Number of ASCIIZ String */<br />
uint8_t AssetTagNumber ; /* 0x0A Number of ASCIIZ String */<br />
uint8_t Reserved0[4] ; /* 0x0B Reserved */<br />
uint8_t OEM[4]<br />
; /* 0x0F Contains OEM- or BIOS<br />
* vendor-specific information<br />
*/<br />
uint8_t Height<br />
; /* 0x13 The height of the<br />
* enclosure, in 'U's.<br />
*/<br />
uint8_t NumPowerCords ; /* 0x14 Identifies the number<br />
* of power cords associated with<br />
* the enclosure or chassis.<br />
*/<br />
uint8_t CElementCnt ; /* 0x15 Contained Element Count */<br />
uint8_t CElementSize ; /* 0x16 Contained Element Size */<br />
CCElement_t CElement[0]; /* 0x17 Contained Element(s) */<br />
}EeePChassisInfo_t;<br />
6.7.1 Description<br />
This block is lbased on the SMBIOS 2.6 standards CHASIS Description block. This Information<br />
should be used to populate the SMBIOS block type 3 if supported. It may additionally also be<br />
displayed in bios setup.<br />
6.7.2 Block Elements<br />
CAP_C_STRUCT 7: SMBIOS Chassis Info<br />
6.7.2.1 DBHdr<br />
See ' 6.1 Common Dynamic Block Header' on page 31.<br />
6.7.2.2 Manufacturer<br />
Number of ASCIIZ String.<br />
6.7.2.3 Type<br />
ENUM see SMBIOS <strong>Specification</strong>.<br />
6.7.2.4 Version<br />
Number of ASCIIZ String.<br />
6.7.2.5 SerialNumber<br />
Number of ASCIIZ String.<br />
6.7.2.6 AssetTagNumber<br />
Number of ASCIIZ String.<br />
6.7.2.7 Reserved0<br />
Reserved set to 0.<br />
6.7.2.8 OEM<br />
Contains OEM- or BIOS vendor-specific information.<br />
PICMG® EEEP R1.0 <strong>Embedded</strong> <strong>EEPROM</strong> <strong>Specification</strong>, August 8, 2010 page 44 of 84