General-Purpose Small-Signal Surface-Mount ... - Semiconductors

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12 Packaging Information Packaging Roadmap for <strong>Surface</strong>-<strong>Mount</strong> Devices TO-92 Mini Hybrid Device Integration High Performance SMQ SMV SM6 SM8 High Power US8 SOT-23F TSM High Power S-Mini USQ USV US6 UFV UF6 UFM USM ESV ES6 USC SSM ESC VESM fSV fS6 Compactness fSM UDFN6 fSC CST8 MP8 CST6 CST6C Wide range of packaging options from general-purpose packages to ultra-small and ultra-thin packages CST2 CST2B CST3 CST3B WCSP4 SC2 70
Toshiba Package Name Appearance Package Standard Tape Packing Specifications Land Pattern Dimensions Examples* Tape Type Tape Dimensions Reel Dimension Unit: mm Unit: mm Unit: mm Unit: mm SC2 Packing quantity 10000/reel 0.3 ± 0.03 0.62 ± 0.03 0.38 0.19 ± 0.02 0.19 ± 0.02 0.32 ± 0.03 0.27 ± 0.02 (Bottom View) Weight: 0.17 mg 0.4 0.32 0.21 0.19 0.21 TPL3 8.0 3.5 ± 0.05 1.75 Tape feeding directions 4.0 ± 0.05 2.0 ± 0.05 9 ø180 CST2 (SOD-882) 0.65 0.5 ± 0.05 0.6 ± 0.05 0.2 ± 0.05 1.0 ± 0.05 (Bottom View) 0.65 0.35 0.3 0.35 TPL3 8 Tape feeding directions 4 9 ø180 Packing quantity 10000/reel 0.38 + – 0.03 0.02 Weight: 0.7 mg 0.6 2 0.7 ± 0.02 Tape feeding directions 9 CST2B Cathode Mark 0.8 ± 0.05 1.2 ± 0.05 0.65 0.05 0.05 0.25 ± 0.02 0.65 ± 0.02 0.75 0.45 0.25 TPL3 8 4 ø180 Packing quantity 10000/reel (Bottom View) 0.38 + – 0.03 0.02 Weight: 0.7 mg 0.7 2 fSC Packing quantity 10000/reel Cathode Mark 0.2 ± 0.05 0.07 M A 0.6 ± 0.05 0.1 0.8 ± 0.05 0.1 A 0.1 ± 0.05 0.48 + 0.02 – 0.03 1.0 ± 0.05 Weight: 0.6 mg 0.26 0.21 0.85 TPL3 8 Tape feeding directions 4 2 9 ø180 ESC (SOD-523) Cathode Mark 0.3 ± 0.05 0.2 1.2 ± 0.1 0.2 0.13 ± 0.05 0.6 ± 0.1 1.6 ± 0.1 0.8 1.7 TPL3 8 Tape feeding directions 4 9 ø180 Packing quantity 8000/reel 0.8 ± 0.1 Weight: 1.4 mg 0.6 2 USC (SOD-323) Cathode marking 1.25 + 0.2 – 0.1 + 0.2 – 0.1 0.3 1.7 + 0.1 – 0.05 2.5 ± 0.2 + 0.1 0.15 – 0.06 0.9 2.3 TPH3 Tape feeding directions 8 4 9 ø180 Packing quantity 3000/reel 0.05 ± 0.05 0.15 + 0.2 – 0.1 0.9 Weight: 4.5 mg 0.8 4 0.6 0.5 0.05 0.03 0.03 Tape feeding directions 9 CST3 (SOT-882) Packing quantity 10000/reel 0.05 1.0 0.05 0.03 0.65 0.02 0.35 0.25 0.03 0.25 0.15 0.03 0.02 (Bottom View) 0.38 +0.02 –0.03 Weight: 0.75 mg 0.65 0.6 0.38 0.16 0.22 0.35 0.3 0.35 TPL3 8 4 2 ø180 Note: For reference only. Be sure to verify device mountability. 71
Page 1 and 2:
2011-5 PRODUCT GUIDE General-Purpos
Page 3 and 4:
1 New Products Semi-power P-channel
Page 5 and 6:
0.7 2.0 ±0.1 520 and 521 Small-Sig
Page 7 and 8:
2.2 Roadmap for Toshiba MOSFET Deve
Page 9 and 10:
2.4 Over 500 mA Series MOSFET (Semi
Page 11 and 12:
■ Dual MOSFETs (Continued) Packag
Page 13 and 14:
2.5 Under 500 mA Series MOSFET (Sta
Page 15 and 16:
3.2 New Product Information LVP Ser
Page 17 and 18: Key Electrical Characteristics of t
Page 19 and 20: Key Electrical Characteristics of t
Page 21 and 22: Low-Power-Consumption The lowered p
Page 23 and 24: 3.4 Typical Characteristics for Low
Page 25 and 26: 3 L-MOS (1- to 3-Gate Logic ICs) 3.
Page 27 and 28: 4 LDO (Low-Dropout Regulators) 4.1
Page 29 and 30: 4 LDO (Low-Dropout Regulators) ■
Page 31 and 32: 4 LDO (Low-Dropout Regulators) 4.2
Page 33 and 34: 5 Magnetic Sensors Digital-Output M
Page 35 and 36: 0.3 1.05 5 Magnetic Sensors ■ Mag
Page 37 and 38: 7 Op Amp and Comparator ICs 7.1 Low
Page 39 and 40: 7 Op Amp and Comparator ICs 7.5 Pro
Page 41 and 42: 8 Small-Signal Diodes 8.1 Switching
Page 43 and 44: 8 Small-Signal Diodes High-IO, Low-
Page 45 and 46: 8 Small-Signal Diodes 8.3 New Produ
Page 47 and 48: 8 Small-Signal Diodes 8.4 ESD-Prote
Page 49 and 50: 8 Small-Signal Diodes ■ High-Spee
Page 51 and 52: 9 Small-Signal Transistors 9.1 Gene
Page 53 and 54: Ratings R1 4.7 10 22 47 2.2 4.7 10
Page 55 and 56: Bias Resistor Built-in Transistors
Page 57 and 58: ■ Small-Signal Diodes ■ Switchi
Page 59 and 60: Package Toshiba JEITA - Part Number
Page 61 and 62: Package Toshiba JEITA − Part Numb
Page 67: MOSFET MOSFET MOSFET LDO LDO LDO Di
Page 71 and 72: Toshiba Package Name TSM Packing qu
Page 73 and 74: Toshiba Package Name Appearance Pac
Page 75 and 76: Toshiba Package Name Appearance Pac
Page 77 and 78: ■ Magnetic Sensors ■ ESD-Protec
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