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Datasheet Figure 13: True IDE Multiword DMA Read/Write Timing Diagram Rev. A.5 25/45 Mar. 2009
Datasheet 4.11 True IDE Ultra DMA Mode Read/Write Timing Specification 4.11.1 Ultra DMA Data Transfers Timing Table 15 and Table 16 define the timings associated with all phases of Ultra DMA bursts. Table 15: Ultra DMA Data Burst Timing Requirements UDMA Mode 0 UDMA Mode 1 UDMA Mode 2 Measurement location Name (ns) (ns) (ns) (See Note 2) Min Max Min Max Min Max t 2CYCTYP 240 160 120 Sender t CYC 112 73 54 Note 3 t 2CYC 230 153 115 Sender t DS 15.0 10.0 7.0 Recipient t DH 5.0 5.0 5.0 Recipient t DVS 70.0 48.0 31.0 Sender t DVH 6.2 6.2 6.2 Sender t CS 15.0 10.0 7.0 Device t CH 5.0 5.0 5.0 Device t CVS 70.0 48.0 31.0 Host t CVH 6.2 6.2 6.2 Host t ZFS 0 0 0 Device t DZFS 70.0 48.0 31.0 Sender t FS 230 200 170 Device t LI 0 150 0 150 0 150 Note 4 t MLI 20 20 20 Host t UI 0 0 0 Host t AZ 10 10 10 Note 5 t ZAG 20 20 20 Host t ZAD 0 0 0 Device t ENV 20 70 20 70 20 70 Host t RFS 75 70 60 Sender t RP 160 125 100 Recipient t IORDYZ 20 20 20 Device t ZIORDY 0 0 0 Device t ACK 20 20 20 Host t SS 50 50 50 Sender Note: 1) All timing measurement switching points (low to high and high to low) shall be taken at 1.5V. 2) All signal transitions for a timing parameter shall be measured at the connector specified in the measurement location column. For example, in the case of t RFS , both STROBE and –DMARDY transitions are measured at the sender connector. 3) The parameter t CYC shall be measured at the recipient’s connector farthest from the sender. 4) The parameter t LI shall be measured at the connector of the sender or recipient that is responding to an incoming transition from the recipient or sender respectively. Both the incoming signal and the outgoing response shall be measured at the same connector. 5) The parameter t AZ shall be measured at the connector of the sender or recipient that is driving the bus but must release the bus the allow for a but tumaround. 6) See the AX Timing requirements in Table 18: Ultra DMA AC Signal Requirements. Rev. A.5 26/45 Mar. 2009
Page 1 and 2: Datasheet Industrial CompactFlash C
Page 3 and 4: Datasheet 4.9 TRUE IDE PIO MODE REA
Page 5 and 6: Datasheet List of Tables Table 1: C
Page 7 and 8: Datasheet 2. Specification 2.1 Phys
Page 9 and 10: Datasheet 2.2 Electronic Specificat
Page 11 and 12: Datasheet 2.4.3 Bare Drop Testing
Page 13 and 14: Datasheet PC Card Memory Mode PC Ca
Page 15 and 16: Datasheet Signal Name Dir. Pin No.
Page 17 and 18: Datasheet Signal Name Dir. Pin No.
Page 19 and 20: Datasheet 4. Operation Specificatio
Page 21 and 22: Datasheet Figure 6: Attribute Memor
Page 23 and 24: Datasheet 4.6 Common Memory Write T
Page 25 and 26: Datasheet 4.8 I/O Input (Write) Tim
Page 27 and 28: Datasheet 4.9 True IDE PIO Mode Rea
Page 29: Datasheet 4.10 True IDE Multiword D
Page 33 and 34: Datasheet Name t DSIC t DHIC t DVSI
Page 35 and 36: Datasheet 4.11.3 Sustaining an Ultr
Page 37 and 38: Datasheet a) The device shall not p
Page 39 and 40: Datasheet Notes: The definitions fo
Page 41 and 42: Datasheet c) The host shall not cha
Page 43 and 44: Datasheet i) The host shall negate
Page 45 and 46: Datasheet Notes: The definitions fo
Page 47 and 48: Datasheet Table 20: PCMCIA Mode I/O
Page 49 and 50: Datasheet Notes: 1) Implemented for
Page 51: Datasheet Europe specific • Tel:

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