LOK-IT Technical Overview

S Y S T E M A T I C D E V E L O P M E N T G R O U P , L L C
SECURING THE PHYSICAL DEVICE
LOK-IT employs a series of measures to defend against physical tampering of the device
and attempted unauthorized access to its contents.
FIPS 140-2
LOK-IT models SDG003FM and SDG004FP are configured to meet FIPS 140-2 Level 3.
Both models have passed all CMVP requirements and are NIST listed (Certificate #1527).
LOK-IT models SDG002P and SDG005M incorporate the same user authentication,
encryption and epoxy coating as SDG003FM and SDG004FP but are not configured to meet
FIPS 140-2 Level 3.
Level 1: FIPS 140-2 Security Level 1 provides the lowest level of security. Basic security
requirements are specified for a cryptographic module (e.g., at least one Approved
algorithm or Approved security function shall be used). No specific physical security
mechanisms are required in a Security Level 1 cryptographic module beyond the basic
requirement for production-grade components.
Level 2: FIPS 140-2 Security Level 2 improves upon the physical security mechanisms of
a Security Level 1 cryptographic module by requiring features that show evidence of
tampering, including tamper-evident coatings or seals that must be broken to attain
physical access to the plaintext cryptographic keys and critical security parameters (CSPs)
within the module, or pick-resistant locks on covers or doors to protect against
unauthorized physical access.
Level 3: In addition to the tamper-evident physical security mechanisms required at
Security Level 2, FIPS 140-2 Security Level 3 attempts to prevent the intruder from
gaining access to CSPs held within the cryptographic module. Physical security
mechanisms required at Security Level 3 are intended to have a high probability of
detecting and responding to attempts at physical access, use or modification of the
cryptographic module. The physical security mechanisms may include the use of strong
enclosures and tamper detection/response circuitry that zeroes all plaintext CSPs when the
removable covers/doors of the cryptographic module are opened.
Form
SDG002P and SDG004FP utilize an ABS form. SDG003FM and SDG005M utilize an
anodized aluminum form. Through the FIPS process SDG will implement a uniform bonding
process for ABS casings on all models (FIPS and non FIPS approved) as well as qualifying
a standard for the anodized aluminum form.
Epoxy Potting
Epoxy potting defeats unauthorized access to the internal components within the
cryptographic boundary and provides evidence of such attempts. Attempted removal of
the epoxy potting causes irreversible damage to the components within the cryptographic
boundary, thereby rendering them useless.
LOK-IT models SDG003FM and SDG004FP are designed to meet epoxy potting
requirements for protection of the cryptographic module as specified by FIPS 140-2 Level
Level 3. LOK-IT models SDG002P and SDG005M use the same epoxy potting techniques
but are not configured to meet FIPS 140-2 Level 3.
Security Controller
Most secure UFD security systems store the encryption key on the flash media.
Accordingly, if the flash is accessed by forcing open the drive, the key can be accessed as
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