t h i c k - f i l m ceramic substrates design guide - CoorsTek

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Laser Machining Specifi cations Guide 1. Length and Width ± 0.002" (±0.051 mm) 2. Hole Diameter ± 0.002" (± 0.051 mm) 3. Hole Location ± 0.002" (± 0.051 mm) • from any machined area to hole centerline • from center of scribe lines to hole centerline 4. Minimum Hole Diameter • typically = 0.003" (0.0762 mm) ± 0.001" (± 0.026 mm) available upon request 5. Minimum Web Thickness 6. Minimum Slot Width 7. Corner Radius For expert assistance with • hole edge to another edge substrate thickness • between adjacent holes substrate thickness • typically 0.003" (0.076 mm) • 0.010" (0.254 mm) Radius Note: Specify internal corner radii rather than sharp corners (90°) to avoid microcracking and chipping. your next project, please call: Note: Thinner Materials are more forgiving in this area +1.800.799.1457 in North America Tolerances These specifications are based on the application of statistical process control methods to determine multibeam equipment capability to a Cpk of ≥ 1.33. Dimensional tolerances should be specifi ed as close as necessary to facilitate process requirements and minimize cost. Thick Film
Annealing Annealing treatments are also available. CoorsTek offers annealing treatments to modify the microstructure of the heat affected zone (HAZ) in a laser drilled hole (reference photos immediately below) and/or to relieve any residual substrate stresses. The annealed microstructure provides an enhanced surface for metallization, thus improving via metal adhesion. The annealing process also increases the breaking force required for singulation of laser scribed substrates. Laser scribing parameters will be adjusted to result in desired singulation (as shown in the table on page 8). Unannealed Laser Pulse Annealed Laser Pulse Scanning Electron Photomicrographs of ADS-96R (1,000x and 30° Tilt) Lasered Edge Treatments CoorsTek offers a variety of edge finishing treatments: laser scribed, laser scribed and brushed, SilkEdge substrates, SmoothEdge substrates, and laser-machined substrates. Contact your CoorsTek sales representative for availability of specific edge fi nishing treatments. Note: Laser edge treatment availability is geometry dependent. Laser Scribed Edge Laser Machined Edge Scanning Electron Photomicrographs of ADS-96R (100x) For expert assistance with your next project, please call: +1.800.799.1457 in North America Laser Scribed Edge SmoothEdge Substrates SilkEdge Substrates Thick Film
Page 1 and 2: www.coorstek.com Thick Film Ceramic
Page 3 and 4: As-Fired Substrates Design Guidelin
Page 5 and 6: Laser Services The following are de
Page 7: Standard Laser Scribed Pulse Depth
Page 11 and 12: Camber Test Method: CoorsTek substr

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