Optical Packaging and Integration - AMS Technologies
Optical Packaging and Integration - AMS Technologies
Optical Packaging and Integration - AMS Technologies
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Facilities &<br />
Services<br />
Hybrid intergrated optical device -2R Regenerator (top left)<br />
Fibre pigtailed laser (top)<br />
Tunable laser (top right)<br />
• Eutectic die bonding<br />
• Thermocompression Au wire bonding<br />
• Thermosonic Au wire bonding<br />
• Deep access Au wire bonding<br />
• Deep access Al/Au ribbon bonding<br />
• Fibre align & fix laser welding system<br />
• Prototype hybrid assembly facilities<br />
• Fibre pigtail sub-assembly manufacture<br />
• UV & thermal cure epoxy systems<br />
• Die shear & wire pull test facilities<br />
• Pre & post packaged device testing<br />
• Burn-in <strong>and</strong> reliability testing<br />
Multi-sectioned laser (top left)<br />
Micro - optic assembly with ball lens (top right)<br />
Wire bonding (lower left)<br />
LIGA assembly of SOAs with ball lenses (lower right)<br />
CIP <strong>Technologies</strong>, B55, Adastral Park, Martlesham Heath, Ipswich, IP5 3RE, UK<br />
Tel: +44 1473 663210 Fax: +44 1473 663295 Enquiries@ciphotonics.com www.ciphotonics.com
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