Optical Packaging and Integration - AMS Technologies
Optical Packaging and Integration - AMS Technologies
Optical Packaging and Integration - AMS Technologies
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<strong>Optical</strong> <strong>Packaging</strong><br />
<strong>and</strong> <strong>Integration</strong><br />
This is a key enabler in the development of components, devices <strong>and</strong> sub-systems<br />
that have to be tested in any representative system or application.<br />
CIP has a very broad range of capabilities in packaging that reflects the highly<br />
diverse nature of the challenges presented by the different component technologies.<br />
Planar silica motherboard Wafer being probe tested Laser welder Fibre pigtailed research devices<br />
Experience <strong>and</strong> Capabilities<br />
The personnel at CIP have been developing bespoke<br />
photonics packaging solutions for research <strong>and</strong> development<br />
prototypes for over 20 years. CIP can provide a one shop<br />
solution to the packaging of optoelectronic components<br />
including package design, optical fibre <strong>and</strong> fibre array pigtailing,<br />
free space optical assemblies, hybrid device integration as well<br />
as providing consultancy in managing the transition between<br />
research packaging <strong>and</strong> manufacturing package solutions. We<br />
have expertise in:<br />
• Bespoke package design <strong>and</strong> assembly<br />
• Lens-ended fibre assemblies<br />
• Electrical probing <strong>and</strong> rf testing<br />
• Laser welding of fibre pigtails coaxial <strong>and</strong><br />
saddle welding<br />
• High speed rf packaging with b<strong>and</strong>widths<br />
up to 100 GHz<br />
• Wire <strong>and</strong> mesh bonding<br />
• <strong>Integration</strong> of hybrid optoelectronic assemblies<br />
• Passive assembly <strong>and</strong> passive fibre pigtailing for<br />
low cost packaging<br />
• Free space optical assemblies<br />
• <strong>Packaging</strong> with V-groove arrays<br />
Coaxial laser welder<br />
www.ciphotonics.com
Facilities &<br />
Services<br />
Hybrid intergrated optical device -2R Regenerator (top left)<br />
Fibre pigtailed laser (top)<br />
Tunable laser (top right)<br />
• Eutectic die bonding<br />
• Thermocompression Au wire bonding<br />
• Thermosonic Au wire bonding<br />
• Deep access Au wire bonding<br />
• Deep access Al/Au ribbon bonding<br />
• Fibre align & fix laser welding system<br />
• Prototype hybrid assembly facilities<br />
• Fibre pigtail sub-assembly manufacture<br />
• UV & thermal cure epoxy systems<br />
• Die shear & wire pull test facilities<br />
• Pre & post packaged device testing<br />
• Burn-in <strong>and</strong> reliability testing<br />
Multi-sectioned laser (top left)<br />
Micro - optic assembly with ball lens (top right)<br />
Wire bonding (lower left)<br />
LIGA assembly of SOAs with ball lenses (lower right)<br />
CIP <strong>Technologies</strong>, B55, Adastral Park, Martlesham Heath, Ipswich, IP5 3RE, UK<br />
Tel: +44 1473 663210 Fax: +44 1473 663295 Enquiries@ciphotonics.com www.ciphotonics.com
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