Catalog

Thermal Management Products
Chomerics is a leading manufacturer of thermally
conductive interface materials that transfer heat from
electronic components to heat sinks or other heat
spreading devices. Careful management of these
thermal interfaces is crucial to maintaining the
reliability and extending the life of electronic devices.
High Efficiency Products for Every Need
Chomerics offers an extensive family of interface materials.
Phase-change materials combine the convenience of pads with
performance comparable to grease. Our gap filler pads conform
easily to irregular surfaces, allowing chassis parts
to be used as heat spreaders. Thin
profile heat spreaders add cooling to
low power devices where heat sinks
can’t be used. Thermally conductive
compounds include sealants, and formin-place
elastomers.
For complete information, request
our Thermal Management Products
Catalog and convenient Selector Guide
or visit www.chomerics.com
of use of elastomeric pads with the
low thermal impedance of thermal
grease. This winning combination
makes Chomerics’ THERMFLOW
materials an excellent choice for
today’s most demanding thermal
interface applications. Each pad
consists of a thin, dry film that softens
at microprocessor operating
temperatures and completely fills
interfacial air gaps and voids typically
found between component
packages and heat sinks. The
THERMFLOW family provides materials
with thermal impedance as low
as 0.03°C-in 2 /W. Applications
include microprocessors, power
semiconductors, DC/DC converters,
and exposed die BGAs.
THERMATTACH ®
Thermally Conductive
Adhesive Tapes
THERMATTACH adhesive tapes are
used extensively to bond heat sinks
to video graphics chips and other
power-dissipating semiconductors.
They are offered with a choice of
aluminum oxide or titanium diboride
fillers coated on Kapton film, aluminum
foil, fiberglass or expanded
aluminum. The THERMATTACH family
includes materials with thermal
impedance as low as 0.25°C-in 2 /W.
T410 tapes attach heat sinks to plastic
packages, and T411 tapes are
designed to conform to out-of-flat
plastic package surfaces. Electrically
isolating and non-isolating versions
of THERMATTACH tapes are
available.
THERMFLOW ®
Phase-Change Thermal
Interface Materials
The THERMFLOW family of phasechange
thermal interface materials
combines the consistency and ease
CHO-THERM ®
Thermally Conductive
Insulators
One-component CHO-THERM insulators
eliminate the need for messy,
time-consuming thermal grease.
Quickly applied CHO-THERM insulators
can lower production costs
and enhance production consistency.
These advanced materials utilize
silicone resins filled with boron
nitride or aluminum oxide particles
to achieve a range of thermal performance
levels. Typical applications
include power conversion
equipment, power supplies and
UPS systems, power semiconductors
and automotive electronics.
CHO-THERM pads are available in
sheets, roll form, or die-cut for use
with standard semiconductors.
Materials are available with thermal
impedance as low as 0.19°C-in 2 /W.
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US Headquarters TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 • www.chomerics.com
Europe TEL +(44) 1628 404000 FAX +(44) 1628 404090
Asia Pacific TEL +(852) 2 428 8008 FAX +(852) 2 423 8253
South America TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817