Introduction, ITRS 3D Interconnect Roadmaps - Sematech
Introduction, ITRS 3D Interconnect Roadmaps - Sematech
Introduction, ITRS 3D Interconnect Roadmaps - Sematech
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Accelerating the next technology revolution<br />
Equipment Challenges for <strong>3D</strong><br />
<strong>Interconnect</strong><br />
Andrew C. Rudack<br />
Process/Equipment Engineer<br />
7/16/2008<br />
Copyright ©2008<br />
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center<br />
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.
Agenda<br />
• Housekeeping<br />
• SEMATECH <strong>3D</strong> Workshops<br />
• SEMATECH <strong>3D</strong> Survey<br />
• <strong>ITRS</strong> Roadmap(s) for <strong>3D</strong> <strong>Interconnect</strong>s<br />
• Workshop Presentations<br />
• Please adjourn to the SEMATECH Hospitality event !<br />
– Upstairs, Golden Gate Hall, 5:30 PM – 8:30 PM<br />
21 July 2008<br />
SEMATECH Non-Confidential
2008 <strong>3D</strong> Workshops<br />
• Equipment Challenges for <strong>3D</strong> <strong>Interconnect</strong><br />
– Paired with SEMICON West 2008<br />
• 7/16/2008, 1:00PM – 6:00PM<br />
– Focus on tools meeting <strong>ITRS</strong> goals/SEMI standards<br />
• Manuufacturing and Reliability Challenges for<br />
<strong>3D</strong>-ICs using TSVs<br />
– Paired with Advanced Metallization Conference<br />
• 9/25 – 9/26, San Diego, CA<br />
• http://www.sematech.org/meetings/announcements/8510<br />
• Design and Test Issues for <strong>3D</strong> <strong>Interconnect</strong><br />
– Paired with ICCAD Conference<br />
• 11/12 – 11/13/2008, Burlingame, CA<br />
• http://www.sematech.org/meetings/announcements/8518<br />
21 July 2008<br />
SEMATECH Non-Confidential
2008 SEMATECH <strong>3D</strong> Survey<br />
• Link attached to workshop meeting notice<br />
– http://www.surveymonkey.com/s.aspxsm=Zty8U9eVs0wV6UpPKyFFAg_3d_3d<br />
• ~30 questions<br />
– Technical assessments<br />
– Key issues<br />
– Industry sector breakdown<br />
• 5-minutes to complete!<br />
• Summary sent 3Q’08<br />
– only participants see results<br />
21 July 2008<br />
SEMATECH Non-Confidential
<strong>ITRS</strong> HD TSV Roadmap<br />
(in Emerging Technologies section of <strong>Interconnect</strong> chapter)<br />
Validation and refining of the roadmap<br />
in 2008 and 2009<br />
21 July 2008<br />
SEMATECH Non-Confidential
<strong>ITRS</strong> Advanced WLP Roadmap<br />
(Assembly & Packaging Section p 34)<br />
21 July 2008<br />
SEMATECH Non-Confidential
21 July 2008<br />
SEMATECH Non-Confidential
21 July 2008<br />
SEMATECH Non-Confidential
Thanks for attending!<br />
Please fill out your evaluation forms<br />
Please adjourn to the Golden Gate<br />
Ballroom (upstairs) for the SEMATECH<br />
hospitality event!<br />
5:30 pm – 8:30 pm<br />
21 July 2008<br />
SEMATECH Non-Confidential
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