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ABC's of Ultrasonics

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Common Applications<br />

•Plastic encapsulated IC IC packages<br />

•Flip Chips<br />

•Bonded Wafers<br />

•Printed Circuit Boards<br />

•Capacitors<br />

•Ceramics<br />

•Metallic<br />

•Power Devices/Hybrids<br />

•Medical Devices<br />

•Material Characterization<br />

7<br />

Copyright Sonix, Inc

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