ABC's of Ultrasonics

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Examples Lid seal voids Delamination BGA die attach Die Crack 8 Copyright Sonix, Inc
Examples Die Top Delamination Mold compound voids Flip Chip Underfill Voids 9 Die Tilt, B-Scan Die Pad delamination Copyright Sonix, Inc Die Attach Voids
Page 1 and 2: Scanning Acoustic Microscopy Traini
Page 3 and 4: Ultrasound Inspection, Using an Aco
Page 5 and 6: Non-Destructive Testing NDT utilize
Page 7: Common Applications •Plastic enca
Page 11 and 12: Ultrasonic Waves Characteristics of
Page 13 and 14: Scanner The scanner consists of a t
Page 15 and 16: Transducer Beam Profile Depth of Fi
Page 17 and 18: ABC’s Of Acoustics •Acoustic Re
Page 19 and 20: Sound Reflection •Acoustic Materi
Page 21 and 22: Reflection vs. Transmission Inciden
Page 23 and 24: ABC’s of Acoustics A-Scan- The ra
Page 25 and 26: Ultrasonic Waveforms The Black sign
Page 27 and 28: C-SCAN IP Front surface Back surfac
Page 29 and 30: Inspection Modes •Pulse Echo •T
Page 31 and 32: Inspection Modes Pulse-Echo Front S
Page 33 and 34: Focusing Sound 33 Copyright Sonix,
Page 35 and 36: De-focused-- too close Water path C
Page 37 and 38: Practical Application •Digital Os
Page 39 and 40: Gates Gates Gates are are used used
Page 41 and 42: Peak Amplitude Peak amplitude imagi
Page 43 and 44: Time Of Flight Time of Flight (TOF)
Page 45 and 46: Peak Amplitude vs. TOF Peak Amplitu
Page 47 and 48: Phase Inversion Normal Phase Invert
Page 49: Image Comparison & Correlation Thro

ABC's of Ultrasonics

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