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James Beletic's presentation

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Hybrid Imager Architecture<br />

HgCdTe light<br />

detecting material<br />

ROIC<br />

junction<br />

Indium<br />

bump<br />

V dd<br />

amp drain voltage<br />

Reset<br />

junction<br />

Indium<br />

bump<br />

junction<br />

Indium<br />

bump<br />

V reset<br />

reset voltage<br />

Column<br />

bus<br />

enable<br />

Bus to read out amplifier signal<br />

MOSFET = metal oxide semiconductor field effect transistor<br />

H4RG-10<br />

4096x4096 pixels<br />

10 micron pixel pitch<br />

HyViSI silicon PIN<br />

Mature interconnect technique:<br />

• Over 16,000,000 indium<br />

bumps per Sensor Chip<br />

Assembly (SCA)<br />

demonstrated<br />

• >99.9% interconnect yield<br />

Example of indium bumps<br />

Human Hair

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