James Beletic's presentation
James Beletic's presentation
James Beletic's presentation
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Hybrid Imager Architecture<br />
HgCdTe light<br />
detecting material<br />
ROIC<br />
junction<br />
Indium<br />
bump<br />
V dd<br />
amp drain voltage<br />
Reset<br />
junction<br />
Indium<br />
bump<br />
junction<br />
Indium<br />
bump<br />
V reset<br />
reset voltage<br />
Column<br />
bus<br />
enable<br />
Bus to read out amplifier signal<br />
MOSFET = metal oxide semiconductor field effect transistor<br />
H4RG-10<br />
4096x4096 pixels<br />
10 micron pixel pitch<br />
HyViSI silicon PIN<br />
Mature interconnect technique:<br />
• Over 16,000,000 indium<br />
bumps per Sensor Chip<br />
Assembly (SCA)<br />
demonstrated<br />
• >99.9% interconnect yield<br />
Example of indium bumps<br />
Human Hair