Ch2 Sustainable Development - Environment - UMC

● Major elements of the PFC emission reduction plan include:
•Continue researching and testing substitute gases in
semiconductor thin film process to lower the emission
volume of greenhouse gases
•Measure the utilization rate of machines that use PFCs and
the reduction rate of the treatment equipment to master
the efficiency of machines and hence conduct improvement
measures toward inefficient machines
•Conduct individual usage evaluation for each machine that
uses PFCs to better understand greenhouse gas emissions for
each machine
•Carry out evaluation of adoption of new PFC abatement
systems
•Meanwhile, in order to lower the PFC emissions year by year,
UMC plans to install high efficiency PFC abatement systems
after fully evaluating all new models
PFC Reduction Plan
(Achieved)
Note: Millions of metric tons of carbon equivalents (MMTCE)
PFC Reduction Results
PFC Emissions at UMC
Schematic Diagram Of PFC Emission Reduction Measures
Supplier
Feedback
Note: The calculation of PFC emissions from production adopts the Tier2b
semiconductor calculation formula and parameters of IPCC 2006 and the GWP of
the fourth assessment report.
In October 2011, Dupont and TOPCO Scientific Co., Ltd. helped UMC achieve the target of PFC "333 Reduction Plan" with
Zyron®8020 (C 4 F 8 ). UMC Fab8D was the first 8-inch plant to finish the conversion. UMC’s other facilities had then reached
the target following Fab8D experience or techonology support from us. Compared with C 3 F 8 and C 2 F 6 , C 4 F 8 can reduce PFC
emissisons by 80 % top. Considering the fact that industrialized countries need to meet reduction targets committed to under
the Kyoto Protocol, we can find that this project has made great contribution to environmental protection and climate change
mitigation, in particular. We hope that UMC can continue to pioneer in this field by using more green materials.
Sam Yeh, Manager of TOPCO Scientific
Co., Ltd, and Juipo Hong, Manager of
DuPont Taiwan Ltd.
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