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Energy Efficiency in Electronics<br />
Generation and Conservation<br />
Aninda Moitra<br />
President and Managing Director<br />
Applied Materials India<br />
India Semiconductor Association Vision Summit<br />
Date: Feb 6, 2012<br />
1<br />
APPLIED MATERIALS- EXTERNAL USE
OUTLINE<br />
• Applied Materials Introduction<br />
• Applied Materials Green Initiatives<br />
• Energy Drivers<br />
• Designing Energy Efficiency into Products<br />
• Summary<br />
2<br />
APPLIED MATERIALS- EXTERNAL USE
At A Glance<br />
Fiscal 2011<br />
Revenue:<br />
$10.52 billion<br />
Fiscal 2011 R&D: $1.1 billion<br />
Founded: November 10, 1967<br />
Headquarters: Santa Clara, California<br />
RD&E and/or<br />
Manufacturing<br />
Centers:<br />
Employees:<br />
Patents:<br />
China, Germany, India,<br />
Israel, Italy, Singapore,<br />
Switzerland, Taiwan,<br />
United States<br />
~12,700 worldwide<br />
~9,300 issued<br />
3<br />
Global Leader in Semiconductor, Solar & Display<br />
Fabrication Equipment<br />
* As of December, 2011<br />
Fiscal year-end October 31, 2011<br />
Other information as of Q3 end, July 31, 2011<br />
APPLIED MATERIALS- EXTERNAL USE
Applied Materials in India – Development Centers<br />
MUMBAI: Pathfining R&D<br />
CEN-INUP, NCPRE, CLEAN LAB<br />
IIT – AMAT Collaboration<br />
BANGALORE: Key Engineering Center<br />
Largest Engineering Pool outside of North America<br />
Engineering: Design Support, Simulation, Module<br />
Ownership<br />
Software: Product Software development & Testing<br />
Other Functions: Product Management,<br />
Application Eng, Product Support,<br />
CHENNAI<br />
Factory Automation Software development and<br />
support<br />
4<br />
APPLIED MATERIALS- EXTERNAL USE
Applied Materials Green Initiatives<br />
External Use
High-Tech Industries Play a Big Role<br />
• Worldwide electricity<br />
consumption for servers ~ 14<br />
one GW power plants<br />
• 2% of the world’s CO 2<br />
emissions from<br />
IT equipment<br />
• 70-80% of energy used<br />
by IT is in manufacturing<br />
and transportation<br />
• Overall manufacturing<br />
accounts for one third of<br />
world's global energy use<br />
Source: IT News, The Wall Street Journal<br />
6<br />
APPLIED MATERIALS- EXTERNAL USE
Setting Aggressive Goals<br />
CORPORATE GOAL<br />
Applied Materials will cut CO 2 equivalents<br />
by 20% or 50k tons by 2012<br />
PRODUCT DESIGN GOAL<br />
Applied Materials will reduce energy and resource<br />
consumption in overall product set by 20% by 2012<br />
7<br />
APPLIED MATERIALS- EXTERNAL USE
Energy Drivers<br />
External Use
Trillion<br />
Billion<br />
Million<br />
LOW COST<br />
TRANSISTORS per $<br />
1000<br />
1<br />
Million<br />
1000<br />
1<br />
LOW POWER<br />
WATTS per MIPS<br />
The<br />
Mobility<br />
AGE<br />
Thousandth<br />
Millionth<br />
9<br />
APPLIED MATERIALS- EXTERNAL USE
Computations per kWh<br />
Mobility Era Demands Higher Power Efficiency<br />
1.0 E17<br />
1.0 E16<br />
1.0 E15<br />
Smartphones<br />
Laptops (no screen)<br />
Tablets<br />
1.0 E14<br />
Dell Dimension 2400<br />
Gateway P3, 733 MHZ<br />
Dell 730X<br />
1.0 E13<br />
IBM PS/2 E high<br />
efficiency desktop<br />
Dell Optiplex GXI<br />
1.0 E12<br />
1.0 E11<br />
Compaq Deskpro<br />
386/20e<br />
486/25 and 486/33<br />
Desktops<br />
1.0 E10<br />
1.0 E09<br />
Mac 128k<br />
IBM PC<br />
Apple II<br />
C 64<br />
Altair 8800<br />
IBM PC-XT<br />
Apple IIe<br />
IBM PC-AT<br />
Adapted from: Koomey J, Berard S, Sanchez M, Wong H , "Implications Of Historical Trends In The<br />
Electrical Efficiency Of Computing," Annals of the History of Computing, IEEE , Vol.PP, no.99, pp.1, 0<br />
10<br />
1.0 E08<br />
1975 1980 1990 1985 1995 2000 2005 2010<br />
Year<br />
APPLIED MATERIALS- EXTERNAL USE<br />
2015
Tool Efficiency = GHG/Energy Opportunity<br />
Wafer Fab – Energy Usage Breakdown<br />
Proc. Equipment<br />
Chilled Water<br />
Recirc. Air<br />
DI/UPW<br />
Process Exhaust<br />
Blk Gases<br />
Comp. Air<br />
Lighting<br />
Make Up Air<br />
Proc. Cooling Water<br />
Process Vacuum<br />
Indus. Waste Coll & Treat<br />
Steam/Hot Water<br />
Chemical Dispense<br />
7%<br />
5%<br />
5%<br />
4%<br />
4%<br />
4%<br />
3%<br />
2%<br />
1%<br />
1%<br />
1%<br />
0%<br />
21%<br />
42%<br />
0% 5% 10% 15% 20% 25% 30% 35% 40% 45%<br />
40% Energy used Directly by Process Tools & Peripherals<br />
>40% indirectly used by support systems<br />
11<br />
APPLIED MATERIALS- EXTERNAL USE
Engineering Efficiency Into Products<br />
External Use
Applied Materials Strategies to Reduce Carbon footprint<br />
Strategy<br />
Collaborate<br />
Optimize<br />
Approaches<br />
1. Innovative Applications<br />
W Gate, Low K, High K/Metal Gate<br />
2. Optimized Hardware<br />
System Enhancements; Remote Clean<br />
Substitute<br />
Abate<br />
3. Alternate Chemistries<br />
Fab consulting process optimization<br />
4. Convert/Destroy PFCs<br />
Abatement Technology:<br />
Combustion-Wet, Plasma etc<br />
13<br />
APPLIED MATERIALS- EXTERNAL USE
Bulk Dielectric Constant (k)<br />
Lowering Interconnect Power Consumption<br />
Industry Challenge<br />
Interconnect power is ~⅓<br />
of total chip power consumption *<br />
Technology Enabler<br />
Lowering the dielectric constant, k, improves<br />
insulation & lowers device power use<br />
3.6<br />
3.2<br />
2.8<br />
2.4<br />
2<br />
4 USG FSG<br />
k ~ 3.6<br />
Black<br />
Diamond<br />
k ~ 3.0<br />
Black<br />
Diamond<br />
Black<br />
II k ~ 2.5<br />
Diamond 3<br />
Lowering interconnect<br />
k ~2.2<br />
power by ~10%** per gen.<br />
130nm 90/65nm 45/32nm 22/15nm<br />
Logic Technology Node (nm)<br />
*Source: Chandra, G.; Kapur, P.; Saraswat, K.C.; "Scaling trends for the on chip power dissipation”<br />
**Source: Tada, M.; Inoue, N.; Hayashi, Y.; , "Performance Modeling of Low- /Cu Interconnects for 32-nm-Node and Beyond<br />
14<br />
APPLIED MATERIALS- EXTERNAL USE
DRAM - Approaches to Lowering Power<br />
Industry Challenge<br />
Technology Enabler<br />
Tungsten<br />
Gate<br />
Lower resistance,<br />
lower RC coupling,<br />
Endura ®<br />
Versa <br />
XLR<br />
W PVD<br />
Transistor<br />
Contact<br />
Lower resistance<br />
enables higher<br />
drive current<br />
at lower voltage<br />
Endura ®<br />
HAR Cobalt<br />
PVD<br />
Oxynitride<br />
Gate<br />
Increased capacitance<br />
enables higher<br />
speed and scaling<br />
Centura ®<br />
DPN HD <br />
Gate Stack<br />
15<br />
APPLIED MATERIALS- EXTERNAL USE
Logic Devices - Engineering the High-k Stack Layers<br />
Industry Challenge<br />
Technology Enabler<br />
DPN / RPN<br />
ALD HfO<br />
Cap<br />
High-k<br />
Interface Layer<br />
RadOx iL<br />
Centura ®<br />
Dielectric<br />
Gate Stack<br />
Source<br />
Drain<br />
2 nm<br />
Si<br />
ALD Cap<br />
TiN<br />
Siconi<br />
Clean<br />
Atomic-scale engineering<br />
Material stability<br />
Interface layer precision<br />
+<br />
Endura ®<br />
Metal Gate<br />
16<br />
APPLIED MATERIALS- EXTERNAL USE
Engineering Efficiency into products (examples)<br />
Centris AdvantEdge<br />
Mesa : ETCH<br />
~35% improvement in energy<br />
savings<br />
Olympic-size swimming pool<br />
of water saving/year<br />
CMP Reflexion GT <br />
29% improvement in energy<br />
savings<br />
45% improvement in<br />
electrical usage<br />
17<br />
APPLIED MATERIALS- EXTERNAL USE
Applied Materials iSYS<br />
Reduces Energy and Utilities Consumption in the Subfab<br />
Monitors tool status to<br />
differentiate process,<br />
clean and idle stages<br />
Adjusts abatement &<br />
pump utilities usage<br />
based on tool status<br />
Provides Energy and Cost Saving<br />
18<br />
APPLIED MATERIALS- EXTERNAL USE
Summary<br />
• Improving the energy efficiency is a critical requirements for<br />
the Mobility Age<br />
• Applied Materials is committed to implementing strategies to<br />
significantly reduce its carbon footprint<br />
• Collaboration with customers and academia is critical in<br />
enabling innovative lower energy applications<br />
• Product manufacturers need to actively incorporate steps to<br />
lower the environmental impact of new tools through<br />
– Optimizing hardware design<br />
– Supporting the implementation of alternate chemistries<br />
– Offering improved abatement technologies<br />
19<br />
APPLIED MATERIALS- EXTERNAL USE
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